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Электронный компонент: M27W102

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1/15
April 2000
M27W102
1 Mbit (64Kb x16) Low Voltage UV EPROM and OTP EPROM
s
2.7V to 3.6V LOW VOLTAGE in READ
OPERATION
s
READ ACCESS TIME:
70ns at V
CC
= 3.0V to 3.6V
80ns at V
CC
= 2.7V to 3.6V
s
PIN COMPATIBLE with M27C1024
s
LOW POWER CONSUMPTION:
15
A max Standby Current
15mA max Active Current at 5MHz
s
PROGRAMMING TIME 100
s/word
s
HIGH RELIABILITY CMOS TECHNOLOGY
2,000V ESD Protection
200mA Latchup Protection Immunity
s
ELECTRONIC SIGNATURE
Manufacturer Code: 0020h
Device Code: 008Ch
DESCRIPTION
The M27W102 is a low voltage 1 Mbit EPROM of-
fered in the two ranges UV (ultra violet erase) and
OTP (one time programmable). It is ideally suited
for microprocessor systems requiring large data or
program storage and is organized as 65,536
words by 16 bits.
The M27W102 operates in the read mode with a
supply voltage as low as 2.7V at 40 to 85
C tem-
perature range. The decrease in operating power
allows either a reduction of the size of the battery
or an increase in the time between battery re-
charges.
The FDIP40W (window ceramic frit-seal package)
has a transparent lid which allows the user to ex-
pose the chip to ultraviolet light to erase the bit pat-
tern. A new pattern can then be written to the
device by following the programming procedure.
For application where the content is programmed
only one time and erasure is not required, the
M27w102 is offered in PDIP40, PLCC44 and
TSOP40 (10 x 14 mm) packages.
Figure 1. Logic Diagram
AI01922
16
A0-A15
P
Q0-Q15
VPP
VCC
M27W102
G
E
VSS
16
1
40
1
40
FDIP40W (F)
PDIP40 (B)
PLCC44 (K)
TSOP40 (N)
10 x 14 mm
M27W102
2/15
Figure 2B. LCC Connections
AI01924
A14
A11
A7
A3
23
Q6
Q5
Q4
Q3
Q2
NC
A2
Q12
Q8
VSS
NC
Q11
Q10
12
A15
A9
1
Q15
VSS
A12
Q13
A5
44
NC
NC
M27W102
Q14
A13
A4
NC
A6
34
Q1
Q9
A10
A8
Q7
Q0
G
A0
A1
V
PP
E
P
V
CC
Figure 2A. DIP Connections
Q6
Q5
Q4
Q11
Q8
VSS
Q7
Q10
Q9
A12
A8
A11
A10
A6
A13
A9
VSS
A7
A2
Q1
Q0
A0
G
A1
A5
NC
P
E
Q12
VPP
VCC
Q15
AI02673
M27W102
8
1
2
3
4
5
6
7
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Q3
Q2
Q14
Q13
A4
A3
40
39
38
37
36
35
34
33
A14
A15
Table 1. Signal Names
A0-A15
Address Inputs
Q0-Q15
Data Outputs
E
Chip Enable
G
Output Enable
P
Program
V
PP
Program Supply
V
CC
Supply Voltage
V
SS
Ground
NC
Not Connected Internally
Figure 2C. TSOP Connections
DQ6
DQ3
DQ2
DQ13
DQ8
DQ7
DQ10
DQ9
A14
A8
A11
A10
A4
A15
A9
G
A7
A2
DQ1
DQ0
A0
A1
A3
NC
P
E
DQ14
VPP
VCC
DQ15
AI01925
M27W102
(Normal)
10
1
11
20
21
30
31
40
VSS
A12
A6
A13
A5
DQ12
DQ4
DQ11
DQ5
VSS
3/15
M27W102
Table 2. Absolute Maximum Ratings
(1)
Note: 1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute Maximum Ratings" may
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi-
tions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant qual-
ity documents.
2. Minimum DC voltage on Input or Output is 0.5V with possible undershoot to 2.0V for a period less than 20ns. Maximum DC
voltage on Output is V
CC
+0.5V with possible overshoot to V
CC
+2V for a period less than 20ns.
3. Depends on range.
Table 3. Operating Modes
Note: X = V
IH
or V
IL
, V
ID
= 12V
0.5V.
Table 4. Electronic Signature
Note: Outputs Q15-Q8 are set to '0'.
Symbol
Parameter
Value
Unit
T
A
Ambient Operating Temperature
(3)
40 to 85
C
T
BIAS
Temperature Under Bias
50 to 125
C
T
STG
Storage Temperature
65 to 150
C
V
IO
(2)
Input or Output Voltage (except A9)
2 to 7
V
V
CC
Supply Voltage
2 to 7
V
V
A9
(2)
A9 Voltage
2 to 13.5
V
V
PP
Program Supply Voltage
2 to 14
V
Mode
E
G
P
A9
V
PP
Q15-Q0
Read
V
IL
V
IL
V
IH
X
V
CC
or V
SS
Data Out
Output Disable
V
IL
V
IH
X
X
V
CC
or V
SS
Hi-Z
Program
V
IL
X
V
IL
Pulse
X
V
PP
Data Input
Verify
V
IL
V
IL
V
IH
X
V
PP
Data Output
Program Inhibit
V
IH
X
X
X
V
PP
Hi-Z
Standby
V
IH
X
X
X
V
CC
or V
SS
Hi-Z
Electronic Signature
V
IL
V
IL
V
IH
V
ID
V
CC
Codes
Identifier
A0
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
Hex Data
Manufacturer's Code
V
IL
0
0
1
0
0
0
0
0
20h
Device Code
V
IH
1
0
0
0
1
1
0
0
8Ch
M27W102
4/15
DEVICE OPERATION
The operating modes of the M27W102 are listed in
the Operating Modes table. A single power supply
is required in the read mode. All inputs are TTL
levels except for V
PP
and 12V on A9 for Electronic
Signature.
Read Mode
The M27W102 has two control functions, both of
which must be logically active in order to obtain
data at the outputs. Chip Enable (E) is the power
control and should be used for device selection.
Output Enable (G) is the output control and should
be used to gate data to the output pins, indepen-
dent of device selection. Assuming that the ad-
dresses are stable, the address access time
(t
AVQV
) is equal to the delay from E to output
(t
ELQV
). Data is available at the output after a delay
of t
OE
from the falling edge of G, assuming that E
has been low and the addresses have been stable
for at least t
AVQV
-t
GLQV
.
Standby Mode
The M27W102 has a standby mode which reduc-
es the supply current from 15mA to 15
A with low
voltage operation V
CC
3.6V, see Read Mode DC
Characteristics table for details. The M27W102 is
placed in the standby mode by applying a CMOS
high signal to the E input. When in the standby
mode, the outputs are in a high impedance state,
independent of the G input.
Table 5. AC Measurement Conditions
High Speed
Standard
Input Rise and Fall Times
10ns
20ns
Input Pulse Voltages
0 to 3V
0.4V to 2.4V
Input and Output Timing Ref. Voltages
1.5V
0.8V and 2V
Figure 3. AC Testing Input Output Waveform
AI01822
3V
High Speed
0V
1.5V
2.4V
Standard
0.4V
2.0V
0.8V
Figure 4. AC Testing Load Circuit
AI01823B
1.3V
OUT
CL
CL = 30pF for High Speed
CL = 100pF for Standard
CL includes JIG capacitance
3.3k
1N914
DEVICE
UNDER
TEST
Table 6. Capacitance
(1)
(T
A
= 25
C, f = 1 MHz)
Note: Sampled only, not 100% tested.
Symbol
Parameter
Test Condit ion
Min
Max
Unit
C
IN
Input Capacitance
V
IN
= 0V
6
pF
C
OUT
Output Capacitance
V
OUT
= 0V
12
pF
5/15
M27W102
Table 7. Read Mode DC Characteristics
(1)
(T
A
= 40 to 85
C; V
CC
= 2.7V to 3.6V; V
PP
= V
CC
)
Note: 1. V
CC
must be applied simultaneously with or before V
PP
and removed simultaneously or after V
PP
.
2. Maximum DC voltage on Output is V
CC
+0.5V.
Symbol
Parameter
Test Condition
Min
Max
Unit
I
LI
Input Leakage Current
0V
V
IN
V
CC
10
A
I
LO
Output Leakage Current
0V
V
OUT
V
CC
10
A
I
CC
Supply Current
E = V
IL
, G = V
IL
,
I
OUT
= 0mA, f = 5MHz,
V
CC
3.6V
15
mA
I
CC1
Supply Current (Standby) TTL
E = V
IH
1
mA
I
CC2
Supply Current (Standby) CMOS
E > V
CC
0.2V,
V
CC
3.6V
15
A
I
PP
Program Current
V
PP
= V
CC
10
A
V
IL
Input Low Voltage
0.6
0.2 V
CC
V
V
IH
(2)
Input High Voltage
0.7 V
CC
V
CC
+ 0.5
V
V
OL
Output Low Voltage
I
OL
= 2.1mA
0.4
V
V
OH
Output High Voltage TTL
I
OH
= 400
A
2.4
V
Two Line Output Control
Because EPROMs are usually used in larger
memory arrays, this product features a 2 line con-
trol function which accommodates the use of mul-
tiple memory connection. The two line control
function allows:
a. the lowest possible memory power dissipation,
b. complete assurance that output bus contention
will not occur.
For the most efficient use of these two control
lines, E should be decoded and used as the prima-
ry device selecting function, while G should be
made a common connection to all devices in the
array and connected to the READ line from the
system control bus. This ensures that all deselect-
ed memory devices are in their low power standby
mode and that the output pins are only active
when data is required from a particular memory
device.
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require careful decoupling of the
devices. The supply current, I
CC
, has three seg-
ments that are of interest to the system designer:
the standby current level, the active current level,
and transient current peaks that are produced by
the falling and rising edges of E. The magnitude of
transient current peaks is dependent on the ca-
pacitive and inductive loading of the device at the
output. The associated transient voltage peaks
can be suppressed by complying with the two line
output control and by properly selected decoupling
capacitors. It is recommended that a 0.1
F ceram-
ic capacitor be used on every device between V
CC
and V
SS
. This should be a high frequency capaci-
tor of low inherent inductance and should be
placed as close to the device as possible. In addi-
tion, a 4.7
F bulk electrolytic capacitor should be
used between V
CC
and V
SS
for every eight devic-
es. The bulk capacitor should be located near the
power supply connection point. The purpose of the
bulk capacitor is to overcome the voltage drop
caused by the inductive effects of PCB traces.
M27W102
6/15
Figure 5. Read Mode AC Waveforms
AI00705B
tAXQX
tEHQZ
A0-A15
E
G
Q0-Q15
tAVQV
tGHQZ
tGLQV
tELQV
VALID
Hi-Z
VALID
Table 8. Read Mode AC Characteristics
(1)
(T
A
= 40 to 85
C; V
CC
= 2.7V to 3.6V; V
PP
= V
CC
)
Note: 1. V
CC
must be applied simultaneously with or before V
PP
and removed simultaneously or after V
PP
.
2. Sampled only, not 100% tested.
3. Speed obtained with High Speed AC measurement conditions.
Symbol
Alt
Parameter
Test
Condition
M27W102
Unit
-80
(3)
-100
(-120/-150/-200)
V
CC
= 3.0V to 3.6V V
CC
= 2.7V to 3.6V V
CC
= 2.7V to 3.6V
Min
Max
Min
Max
Min
Max
t
AVQV
t
ACC
Address Valid to
Output Valid
E = V
IL
,
G = V
IL
70
80
100
ns
t
ELQV
t
CE
Chip Enable Low to
Output Valid
G = V
IL
70
80
100
ns
t
GLQV
t
OE
Output Enable Low
to Output Valid
E = V
IL
40
50
60
ns
t
EHQZ
(2)
t
DF
Chip Enable High
to Output Hi-Z
G = V
IL
0
40
0
50
0
60
ns
t
GHQZ
(2)
t
DF
Output Enable High
to Output Hi-Z
E = V
IL
0
40
0
50
0
60
ns
t
AXQX
t
OH
Address Transition
to Output Transition
E = V
IL
,
G = V
IL
0
0
0
ns
7/15
M27W102
Table 9. Programming Mode AC Characteristics
(1)
(T
A
= 25
C; V
CC
= 6.25V
0.25V; V
PP
= 12.75V
0.25V)
Note: 1. V
CC
must be applied simultaneously with or before V
PP
and removed simultaneously or after V
PP
.
Table 10. Programming Mode AC Characteristics
(1)
(T
A
= 25
C; V
CC
= 6.25V
0.25V; V
PP
= 12.75V
0.25V)
Note: 1. V
CC
must be applied simultaneously with or before V
PP
and removed simultaneously or after V
PP
.
2. Sampled only, not 100% tested.
Symbol
Parameter
Test Condition
Min
Max
Unit
I
LI
Input Leakage Current
0V
V
IN
V
IH
10
A
I
CC
Supply Current
50
mA
I
PP
Program Current
E = V
IL
50
mA
V
IL
Input Low Voltage
0.3
0.8
V
V
IH
Input High Voltage
2
V
CC
+ 0.5
V
V
OL
Output Low Voltage
I
OL
= 2.1mA
0.4
V
V
OH
Output High Voltage TTL
I
OH
= 400
A
2.4
V
V
ID
A9 Voltage
11.5
12.5
V
Symbol
Alt
Parameter
Test Condi tion
Min
Max
Unit
t
AVPL
t
AS
Address Valid to Program Low
2
s
t
QVPL
t
DS
Input Valid to Program Low
2
s
t
VPHPL
t
VPS
V
PP
High to Program Low
2
s
t
VCHPL
t
VCS
V
CC
High to Program Low
2
s
t
ELPL
t
CES
Chip Enable Low to Program Low
2
s
t
PLPH
t
PW
Program Pulse Width
95
105
s
t
PHQX
t
DH
Program High to Input Transition
2
s
t
QXGL
t
OES
Input Transition to Output Enable Low
2
s
t
GLQV
t
OE
Output Enable Low to Output Valid
100
ns
t
GHQZ
(2)
t
DFP
Output Enable High to Output Hi-Z
0
130
ns
t
GHAX
t
AH
Output Enable High to Address
Transition
0
ns
Programming
The M27W102 has been designed to be fully com-
patible with the M27C1024 and has the same elec-
tronic signature. As a result the M27W102 can be
programmed as the M27C1024 on the same pro-
gramming equipment applying 12.75V on V
PP
and
6.25V on V
CC
by the use of the same PRESTO II
algorithm. When delivered (and after each `1's era-
sure for UV EPROM), all bits of the M27W102 are
in the '1' state. Data is introduced by selectively
programming '0's into the desired bit locations. Al-
though only '0's will be programmed, both '1's and
'0's can be present in the data word. The only way
to change a `0' to a `1' is by die exopsure to ultra-
violet light (UV EPROM). The M27W102 is in the
programming mode when V
PP
input is at 12.75V,
E is at V
IL
and P is pulsed to V
IL
. The data to be
programmed is applied to 16 bits in parallel to the
data output pins. The levels required for the ad-
dress and data inputs are TTL. V
CC
is specified to
be 6.25V
0.25V.
M27W102
8/15
Figure 6. Programming and Verify Modes AC Waveforms
tAVPL
VALID
AI00706
A0-A15
Q0-Q15
VPP
VCC
P
G
DATA IN
DATA OUT
E
tQVPL
tVPHPL
tVCHPL
tPHQX
tPLPH
tGLQV
tQXGL
tELPL
tGHQZ
tGHAX
PROGRAM
VERIFY
PRESTO II Programming Algorithm
PRESTO II Programming Algorithm allows pro-
gramming of the whole array with a guaranteed
margin, in a typical time of 6.5 seconds. Program-
ming with PRESTO II consists of applying a se-
quence of 100
s program pulses to each word
until a correct verify occurs (see Figure 7). During
programming and verify operation, a MARGIN
MODE circuit is automatically activated in order to
guarantee that each cell is programmed with
enough margin. No overprogram pulse is applied
since the verify in MARGIN MODE at V
CC
much
higher than 3.6V, provides necessary margin to
each programmed cell.
Program Inhibit
Programming of multiple M27W102s in parallel
with different data is also easily accomplished. Ex-
cept for E, all like inputs including G of the parallel
M27W102 may be common. A TTL low level pulse
applied to a M27W102's P input, with E low and
V
PP
at 12.75V, will program that M27W102. A high
level E input inhibits the other M27W102s from be-
ing programmed.
Program Verify
A verify (read) should be performed on the pro-
grammed bits to determine that they were correct-
ly programmed. The verify is accomplished with E
and G at V
IL
, P at V
IH
, V
PP
at 12.75V and V
CC
at
6.25V.
Figure 7. Programming Flowchart
AI00707D
n = 0
Last
Addr
VERIFY
P = 100
s Pulse
++n
= 25
++ Addr
VCC = 6.25V, VPP = 12.75V
FAIL
CHECK ALL WORDS
1st: VCC = 5V
2nd: VCC = 2.7V
YES
NO
YES
NO
YES
NO
9/15
M27W102
ERASURE OPERATION (
applies to
UV EPROM)
The erasure characteristics of the M27W102 is
such that erasure begins when the cells are ex-
posed to light with wavelengths shorter than ap-
proximately 4000. It should be noted that sunlight
and some type of fluorescent lamps have wave-
lengths in the 3000-4000 range. Research
shows that constant exposure to room level fluo-
rescent lighting could erase a typical M27W102 in
about 3 years, while it would take approximately 1
week to cause erasure when exposed to direct
sunlight. If the M27W102 is to be exposed to these
types of lighting conditions for extended periods of
time, it is suggested that opaque labels be put over
the M27W102 window to prevent unintentional
erasure. The recommended erasure procedure for
the M27W102 is exposure to short wave ultraviolet
light which has a wavelength of 2537. The inte-
grated dose (i.e. UV intensity x exposure time) for
erasure should be a minimum of 15 W-sec/cm
2
.
The erasure time with this dosage is approximate-
ly 15 to 20 minutes using an ultraviolet lamp with
12000
W/cm
2
power rating. The M27W102
should be placed within 2.5 cm (1 inch) of the lamp
tubes during the erasure. Some lamps have a filter
on their tubes which should be removed before
erasure.
On-Board Programming
The M27W102 can be directly programmed in the
application circuit. See the relevant Application
Note AN620.
Electronic Signature
The Electronic Signature (ES) mode allows the
reading out of a binary code from an EPROM that
will identify its manufacturer and type. This mode
is intended for use by programming equipment to
automatically match the device to be programmed
with its corresponding programming algorithm.
The ES mode is functional in the 25
C
5
C am-
bient temperature range that is required when pro-
gramming the M27W102. To activate the ES
mode, the programming equipment must force
11.5V to 12.5V on address line A9 of the
M27W102 with V
PP
= V
CC
= 5V. Two identifier
bytes may then be sequenced from the device out-
puts by toggling address line A0 from V
IL
to V
IH
. All
other address lines must be held at V
IL
during
Electronic Signature mode. Byte 0 (A0 = V
IL
) rep-
resents the manufacturer code and byte 1
(A0 = V
IH
) the device identifier code. For the
STMicroelectronics M27W102, these two identifier
bytes are given in Table 4 and can be read-out on
outputs Q7 to Q0.
Note that the M27W102 and M27C1002 have the
same byte identifier.
M27W102
10/15
Table 11. Ordering Information Scheme
Note: 1. High Speed, see AC Characteristics section for further information.
2. This speed also guarantees 70ns access time at V
CC
= 3.0V to 3.6V.
3. These speeds are replaced by the 100ns.
4. Packages option available on request. Please contact STMicroelectronics local Sales Office.
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the STMicroelectronics Sales Office nearest to you.
Example:
M27W102
-80
K
6
TR
Device Type
M27
Supp ly Voltage
W = 2.7V to 3.6V
Device Function
102 = 1 Mbit (64Kb x16)
Speed
-80
(1,2)
= 80 ns
-100 = 100 ns
Not For New Design
(3)
-120 = 120 ns
-150 = 150 ns
-200 = 200 ns
Package
F = FDIP40W
(4)
B = PDIP40
K = PLCC44
N = TSOP40: 10 x 14 mm
(4)
Temperature Range
6 = 40 to 85
C
Optio ns
TR = Tape & Reel Packing
Table 12. Revision History
Date
Revision Details
July 1999
First Issue
04/04/00
FDIP40W Package Dimension, L Max added (Table 13)
TSOP40 Package Dimension changed (Table 16)
0 to 70
C Temperature Range deleted
I
PP
changed (Table 7)
11/15
M27W102
Table 13. FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Mechanical Data
Symbol
mm
inches
Typ
Min
Max
Typ
Min
Max
A
5.72
0.225
A1
0.51
1.40
0.020
0.055
A2
3.91
4.57
0.154
0.180
A3
3.89
4.50
0.153
0.177
B
0.41
0.56
0.016
0.022
B1
1.45
0.057
C
0.23
0.30
0.009
0.012
D
51.79
52.60
2.039
2.071
D2
48.26
1.900
E
15.24
0.600
E1
13.06
13.36
0.514
0.526
e
2.54
0.100
eA
14.99
0.590
eB
16.18
18.03
0.637
0.710
L
3.18
4.10
0.125
0.161
S
1.52
2.49
0.060
0.098
8.13
0.320
4
11
4
11
N
40
40
Figure 8. FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Outline
Drawing is not to scale.
FDIPW-a
A3
A1
A
L
B1
B
e
D
S
E1
E
N
1
C
eA
D2
eB
A2
M27W102
12/15
Table 14. PDIP40 - 40 pin Plastic DIP, 600 mils width, Package Mechanical Data
Symbol
mm
inches
Typ
Min
Max
Typ
Min
Max
A
4.45
0.175
A1
0.64
0.38
0.025
0.015
A2
3.56
3.91
0.140
0.154
B
0.38
0.53
0.015
0.021
B1
1.14
1.78
0.045
0.070
C
0.20
0.31
0.008
0.012
D
51.78
52.58
2.039
2.070
D2
48.26
1.900
E
14.80
16.26
0.583
0.640
E1
13.46
13.99
0.530
0.551
e1
2.54
0.100
eA
15.24
0.600
eB
15.24
17.78
0.600
0.700
L
3.05
3.81
0.120
0.150
S
1.52
2.29
0.060
0.090
0
15
0
15
N
40
40
Figure 9. PDIP40 - 40 pin Plastic DIP, 600 mils width, Package Outline
Drawing is not to scale.
PDIP
A2
A1
A
L
B1
B
e1
D
S
E1
E
N
1
C
eA
eB
D2
13/15
M27W102
Table 15. PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Mechanical Data
Symbol
mm
inches
Typ
Min
Max
Typ
Min
Max
A
4.20
4.70
0.165
0.185
A1
2.29
3.04
0.090
0.120
A2
0.51
0.020
B
0.33
0.53
0.013
0.021
B1
0.66
0.81
0.026
0.032
D
17.40
17.65
0.685
0.695
D1
16.51
16.66
0.650
0.656
D2
14.99
16.00
0.590
0.630
E
17.40
17.65
0.685
0.695
E1
16.51
16.66
0.650
0.656
E2
14.99
16.00
0.590
0.630
e
1.27
0.050
F
0.00
0.25
0.000
0.010
R
0.89
0.035
N
44
44
CP
0.10
0.004
Figure 10. PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Outline
Drawing is not to scale.
PLCC
D
Ne
E1 E
1 N
D1
Nd
CP
B
D2/E2
e
B1
A1
A
R
0.51 (.020)
1.14 (.045)
F
A2
M27W102
14/15
Table 16. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 14 mm, Package Mechanical Data
Symbol
mm
inch
Typ
Min
Max
Typ
Min
Max
A
1.200
0.0472
A1
0.050
0.150
0.0020
0.0059
A2
0.950
1.050
0.0374
0.0413
B
0.170
0.270
0.0067
0.0106
C
0.100
0.210
0.0039
0.0083
D
13.800
14.200
0.5433
0.5591
D1
12.300
12.500
0.4843
0.4921
e
0.500
0.0197
E
9.900
10.100
0.3898
0.3976
L
0.500
0.700
0.0197
0.0276
0
5
0
5
CP
0.100
0.0039
N
40
40
Figure 11. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 14 mm, Package Outline
Drawing is not to scale.
TSOP-a
D1
E
1
N
CP
B
e
A2
A
N/2
D
DIE
C
L
A1
15/15
M27W102
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