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Электронный компонент: LN15XB60

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LN15XB60
600V 15A
Copyright & Copy;2002 Shindengen Electric Mfg.Co.,Ltd.
OUTLINE DIMENSIONS
(Unit : mm)
RATINGS
Case : 5S
SHINDENGEN
General Purpose Rectifiers
i
Low Noise Bridges
Absolute Maximum Ratings (Unless otherwise specified, Tc=25j
@Item
Symbol
Conditions
Ratings
Unit
Storage Temperature
Tstg
-55`150
Operating Junction Temperature
Tj
150
Maximum Reverse Voltage
V
RM
600
V
Average Rectified Forward Current
I
O
50Hz sine wave, R-load, With heatsink, Tc=100
15
A
I
O
50Hz sine wave, R-load, Without heatsink, Ta=25
3.0
A
Peak Surge Forward Current
I
FSM
50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25
200
A
Current Squared Time
I
2
t
1mst10ms, per diode, Tj=25
90
A
2
s
Dielectric Strength
Vdis
Terminals to case, AC 1 minute
2.5
kV
Mounting Torque
TOR
( Recommended torque : 0.5 N.m )
0.8
N.m
Electrical Characteristics (Unless otherwise specified, Tc=25j
@Item
Symbol
Conditions
Ratings
Unit
Forward Voltage
V
F
I
F
=7.5A, Pulse measurement, Rating of per diode
Max 1.1
V
Reverse Current
I
R
V
R
=V
RM
, Pulse measurement, Rating of per diode
Max 10
A
Reverse Recovery Time
trr
I
F
=0.1A, I
R
=0.1A, Rating of per diode
Max 5
s
jc
Junction to case, With heatsink
Max 1.5
Thermal Resistance
jl
junction to lead, Without heatsink
Max 5
/W
ja
junction to ambient, Without heatsink
Max 23
0
0.5
1
1.5
2
0.1
1
10
20
5
0.2
0.5
LN15XB60
Tc=150C[TYP]
Tc= 25C[TYP]
2
50
Forward Voltage
Pulse measurement per diode
Forward Voltage
I
F
[A]
F
o
rw
a
r
d
Cu
rre
n
t
V
F
[V]
0
5
10
15
20
25
30
35
40
0
2
4
6
8
10
12
14
16
SIN
LN15XB60
Forward Power Dissipation
I
O
[A]
Average Rectified Forward Current
Tj = 150C
P
F
[W
]
F
o
rw
a
r
d
P
o
w
e
r Dis
s
i
p
a
t
i
o
n
0
50
100
150
200
250
300
1
10
100
LN15XB60
[cycle]
Number of Cycles
I
FS
M
[A]
P
eak
S
u
r
g
e F
o
r
w
ar
d
C
u
r
r
e
n
t
Peak Surge Forward Capability
I
FS
M
10ms 10ms
1 cycle
non-repetitive,
sine wave,
Tj=25C before
surge current is applied
0
20
40
60
80
100
120
140
160
0
0.5
1
1.5
2
2.5
3
3.5
4
SIN
LN15XB60
V
R
= V
RM
Derating Curve
Ta [C]
Ambient Temperature
I
O
[A]
A
v
er
ag
e R
e
c
t
i
f
i
e
d
F
o
r
w
ar
d
C
u
r
r
e
n
t
PCB
Glass-epoxy substrate
Soldering land 5mm phi
0
20
40
60
80
100
120
140
160
0
5
10
15
20
25
SIN
LN15XB60
V
R
= V
RM
Tc
Tc
heatsink
.
I
O
[A]
Tc [C]
Case Temperature
A
v
er
ag
e R
e
c
t
i
f
i
e
d
F
o
r
w
ar
d
C
u
r
r
e
n
t
Derating Curve