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DESCRIPTION

The LZ2523 is a 1/5-type (3.6 mm) solid-state
image sensor that consists of PN photo-diodes
and CCDs (charge-coupled devices). With
approximately 320 000 pixels (542 horizontal x 582
vertical), the sensor provides a stable high-resolution
color image.

FEATURES

· Number of effective pixels : 512 (H) x 582 (V)
· Number of optical black pixels

Horizontal : 2 front and 28 rear

· Pixel pitch : 5.8 µm (H) x 3.8 µm (V)
· Mg, G, Cy, and Ye complementary color filters
· Low fixed-pattern noise and lag
· No burn-in and no image distortion
· Blooming suppression structure
· Built-in output amplifier
· Built-in overflow drain voltage circuit and reset

gate voltage circuit

· Horizontal shift register clock voltage : 3.6 V (TYP.)
· Variable electronic shutter (1/50 to 1/10 000 s)
· Compatible with PAL standard
· Package :

14-pin half-pitch WDIP [Plastic]
(WDIP014-P-0400A)
Row space : 10.16 mm

PIN CONNECTIONS

PRECAUTIONS

· The exit pupil position of lens should be more

than 25 mm from the top surface of the CCD.

· Refer to "PRECAUTIONS FOR CCD AREA

SENSORS" for details.

LZ2523

1/5-type Color CCD Area Sensor

with 320 k Pixels

LZ2523

GND

OFD

14-PIN HALF-PITCH WDIP

TOP VIEW

(WDIP014-P-0400A)

LZ2523

PIN DESCRIPTION

ABSOLUTE MAXIMUM RATINGS

= +25 °C)

SYMBOL

PIN NAME

Output transistor drain

Output signals

Reset transistor clock

, Ø

Vertical shift register clock

, Ø

Horizontal shift register clock

P-well

GND

Ground

, NC

No connection

PARAMETER

SYMBOL

RATING

UNIT

Output transistor drain voltage

0 to +18

Reset gate clock voltage

ØRS

Internal output

Vertical shift register clock voltage

ØV

11.5 to +17.5

Horizontal shift register clock voltage

ØH

0.3 to +12

Voltage difference between P-well and vertical clock

-V

ØV

29 to 0

Storage temperature

STG

40 to +85

°C

Ambient operating temperature

OPR

20 to +70

°C

NOTE

NOTES :

1. Do not connect to DC voltage directly. When OFD is connected to GND, connect V

to GND. Overflow drain clock is

applied below 27 Vp-p.

2. Do not connect to DC voltage directly. When Ø

is connected to GND, connect V

to GND. Reset gate clock is

applied below 8 Vp-p.

3. When clock width is below 10 µs, and clock duty factor is below 0.1%, voltage difference between vertical clocks will be

below 28 V.

Overflow drain

OFD

Internal output

OFD

Overflow drain voltage

0 to +15

ØV

-V

ØV

Voltage difference between vertical clocks

LZ2523

RECOMMENDED OPERATING CONDITIONS

PARAMETER

SYMBOL

MIN.

TYP.

MAX.

UNIT

NOTE

Ambient operating temperature

OPR

25.0

°C

Output transistor drain voltage

14.55

15.0

15.45

NOTES :

· Connect NC

and NC

to GND directly or through a capacitor larger than 0.047 µF.

1. Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE", and do not connect to DC voltage directly.

2. V

is set below V

ØVL

that is low level of vertical shift register clock, or is used with the same power supply that is connected

to V

of V driver IC.

* To apply power, first connect GND and then turn on V

. After turning on V

, turn on PW first and then turn on other powers

and pulses. Do not connect the device to or disconnect it from the plug socket while power is being applied.

24.5

22.5

ØOFD

Overflow drain clock

P-well voltage

10.0

ØVL

Ground

GND

0.0

8.5

9.0

9.5

ØV1L

, V

ØV2L

ØV3L

, V

ØV4L

Vertical shift

LOW level

INTERMEDIATE level

HIGH level

ØV1I

, V

ØV2I

ØV3I

, V

ØV4I

ØV1H

, V

ØV3H

14.55

0.0

15.0

15.45

LOW level

Horizontal shift

ØH1L

, V

ØH2L

0.05

0.0

0.05

HIGH level

ØH1H

, V

ØH2H

3.3

3.6

5.5

5.0

4.5

ØRS

Reset gate clock

p-p level

Reset gate clock frequency

ØRS

9.66

MHz

Horizontal shift register clock frequency

ØH1

, f

ØH2

9.66

MHz

Vertical shift register clock frequency

ØV1

, f

ØV2

ØV3

, f

ØV4

15.63

kHz

p-p level

LZ2523

CHARACTERISTICS

(Drive method : Field accumulation)

= +25 °C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS".

Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)

PARAMETER

SYMBOL

MIN.

TYP.

MAX.

UNIT

NOTE

Standard output voltage

150

Photo response non-uniformity

PRNU

Saturation output voltage

SAT

500

650

Dark output voltage

DARK

0.5

3.0

1, 5

Dark signal non-uniformity

DSNU

0.5

2.0

1, 6

Sensitivity

145

200

Smear ratio

SMR

Image lag

1.0

Blooming suppression ratio

ABL

1 000

Output transistor drain current

4.0

8.0

Output impedance

350

Vector breakup

7.0

°, %

Line crawling

3.0

Luminance flicker

2.0

NOTES :

· Within the recommended operating conditions of V

OFD

of the internal output satisfies with ABL larger than

1 000 times exposure of the standard exposure conditions,

and V

SAT

larger than 500 mV.

1. T

= +60 °C

2. The average output voltage under uniform illumination.

The standard exposure conditions are defined as when

Vo is 150 mV.

3. The image area is divided into 10 x 10 segments under

the standard exposure conditions. Each segment's

voltage is the average output voltage of all pixels within

the segment. PRNU is defined by (Vmax Vmin)/Vo,

where Vmax and Vmin are the maximum and minimum

values of each segment's voltage respectively.

4. The image area is divided into 10 x 10 segments. Each

segment's voltage is the average output voltage of all

pixels within the segment. V

SAT

is the minimum

segment's voltage under 10 times exposure of the

standard exposure conditions.

5. The average output voltage under non-exposure

conditions.

6. The image area is divided into 10 x 10 segments under

non-exposure conditions. DSNU is defined by (Vdmax

Vdmin), where Vdmax and Vdmin are the maximum and

minimum values of each segment's voltage respectively.

7. The average output voltage when a 1 000 lux light

source with a 90% reflector is imaged by a lens of F4,

f50 mm.

8. The sensor is exposed only in the central area of V/10

square with a lens at F4, where V is the vertical image

size. SMR is defined by the ratio of the output voltage

detected during the vertical blanking period to the

maximum output voltage in the V/10 square.

9. The sensor is exposed at the exposure level

corresponding to the standard conditions. AI is defined

by the ratio of the output voltage measured at the 1st

field during the non-exposure period to the standard

output voltage.

10. The sensor is exposed only in the central area of V/10

square, where V is the vertical image size. ABL is

defined by the ratio of the exposure at the standard

conditions to the exposure at a point where blooming is

observed.

11. Observed with a vector scope when the color bar chart

is imaged under the standard exposure conditions.

12. The difference between the average output voltage of the

(Mg + Ye), (G + Cy) line and that of the (Mg + Cy), (G +

Ye) line under the standard exposure conditions.

13. The difference between the average output voltage of

the odd field and that of the even field under the

standard exposure conditions.

LZ2523

PIXEL STRUCTURE

,,,

yyy

512 (H) x 582 (V)

1 pin

OPTICAL BLACK

(2 PIXELS)

OPTICAL BLACK

(28 PIXELS)

COLOR FILTER ARRAY

(1, 582)

(512, 582)

(1, 1)

(512, 1)

2nd, 4th
field

1st, 3rd

field

LZ2523

SYSTEM CONFIGURATION EXAMPLE

OFD

GND

POFD

)

3AX

1AX

+5 V

OFDX

CCD

OUT

0.01 µF

1 M$

OFDH

3BX

OFDX

GND

3AX

1BX

1AX

LR36685

LZ2523

100 $

270 pF

1 M$

0.1 µF

(*1)

(*1) Ø

, OFD :

Use the circuit parameter indicated in

this circuit example, and do not connect

to DC voltage directly.

PRECAUTIONS FOR CCD AREA SENSORS

1. Package Breakage

In order to prevent the package from being broken,
observe the following instructions :
1) The CCD is a precise optical component and

the package material is ceramic or plastic.
Therefore,

ø Take care not to drop the device when

mounting, handling, or transporting.

ø Avoid giving a shock to the package.

Especially when leads are fixed to the socket
or the circuit board, small shock could break
the package more easily than when the
package isn't fixed.

2) When applying force for mounting the device or

any other purposes, fix the leads between a
joint and a stand-off, so that no stress will be
given to the jointed part of the lead. In addition,
when applying force, do it at a point below the
stand-off part.

(In the case of ceramic packages)

The leads of the package are fixed with low

melting point glass, so stress added to a
lead could cause a crack in the low melting
point glass in the jointed part of the lead.

(In the case of plastic packages)

The leads of the package are fixed with

package body (plastic), so stress added to a
lead could cause a crack in the package
body (plastic) in the jointed part of the lead.

3) When mounting the package on the housing,

be sure that the package is not bent.

If a bent package is forced into place

between a hard plate or the like, the pack-
age may be broken.

4) If any damage or breakage occurs on the sur-

face of the glass cap, its characteristics could
deteriorate.

Therefore,

ø Do not hit the glass cap.
ø Do not give a shock large enough to cause

distortion.

Do not scrub or scratch the glass surface.

Even a soft cloth or applicator, if dry, could

cause dust to scratch the glass.

2. Electrostatic Damage

As compared with general MOS-LSI, CCD has
lower ESD. Therefore, take the following anti-static
measures when handling the CCD :

1) Always discharge static electricity by grounding

the human body and the instrument to be used.
To ground the human body, provide resistance
of about 1 M$ between the human body and
the ground to be on the safe side.

2) When directly handling the device with the

fingers, hold the part without leads and do not
touch any lead.

Glass cap

Package

Lead

Fixed

Stand-off

Fixed

Lead

Stand-off

Low melting point glass

PRECAUTIONS FOR CCD AREA SENSORS

3) To avoid generating static electricity,

a. do not scrub the glass surface with cloth or

plastic.

b. do not attach any tape or labels.

c. do not clean the glass surface with dust-

cleaning tape.

4) When storing or transporting the device, put it in

a container of conductive material.

3. Dust and Contamination

Dust or contamination on the glass surface could
deteriorate the output characteristics or cause a
scar. In order to minimize dust or contamination on
the glass surface, take the following precautions :

1) Handle the CCD in a clean environment such

as a cleaned booth. (The cleanliness level
should be, if possible, class 1 000 at least.)

2) Do not touch the glass surface with the fingers.

If dust or contamination gets on the glass
surface, the following cleaning method is
recommended :

ø Dust from static electricity should be blown

off with an ionized air blower. For anti-
electrostatic measures, however, ground all
the leads on the device before blowing off
the dust.

The contamination on the glass surface
should be wiped off with a clean applicator
soaked in Isopropyl alcohol. Wipe slowly and
gently in one direction only.

Frequently replace the applicator and do not

use the same applicator to clean more than
one device.

Note : In most cases, dust and contamination

are unavoidable, even before the device
is first used. It is, therefore, recommended
that the above procedures should be
taken to wipe out dust and contamination
before using the device.

4. Other

1) Soldering should be manually performed within

5 seconds at 350 °C maximum at soldering iron.

2) Avoid using or storing the CCD at high tem-

perature or high humidity as it is a precise
optical component. Do not give a mechanical
shock to the CCD.

3) Do not expose the device to strong light. For

the color device, long exposure to strong light
will fade the color of the color filters.

PRECAUTIONS FOR CCD AREA SENSORS

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Document Outline

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Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: LZ2523