1
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05074.R4 12/02
LOW CAPACITANCE TVS ARRAYS
APPLICATIONS
SCSI & IDE Interfaces
Parallel & Serial Port Protection (RS-232)
Ethernet - 10/100 Base T
Test & Measurement Equipment
Industrial Control: Low Voltage Sensors
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
61000-4-5 (Surge): 12A, 8/20s - Level 1(Line-Gnd) & Level 2(Line-Line)
FEATURES
500 Watts Peak Pulse Power per Line(t
p
= 8/20s)
Unidirectional & Bidirectional Configurations
Available in Multiple Voltage Types Ranging from 3.0V to 24V
Protects Up to Four (4) Lines
ESD Protection > 40 kilovolts
LOW CAPACITANCE - 15pF
MECHANICAL CHARACTERISTICS
Molded JEDEC SO-8
Weight 15 milligrams (Approximate)
Flammability Rating UL 94V-0
12mm Tape and Reel Per EIA Standard 481
Device Marking: Logo, Marking Code, Pin 1 Indicated by DOT on Top of Package
CIRCUIT DIAGRAMS
SO-8
. . . engineered solutions for the transient environmentTM
05074
SMDA03LC
thru
SMDA24LCC
BIDIRECTIONAL
4
1
2
3
8
7
6
5
I/O
I/O
GND
GND
GND
GND
I/O
I/O
1
2
3
4
5
8
7
6
UNIDIRECTIONAL
GND
GND
GND
GND
I/O
I/O
I/O
I/O
2
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05074.R4 12/02
SMDA03LC
thru
SMDA24LCC
DEVICE CHARACTERISTICS
Note 1: Part numbers with a "C" suffix are bidirectional devices, i.e., SMDA03LCC.
Note 2: SPICE model and parameters available for this device on the ProTek Devices website:
www.protekdevices.com
.
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
(See Notes 1-2)
DEVICE
MARKING
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20s
V
C
@ I
PP
MAXIMUM
CAPACITANCE
0V @ 1 MHz
C
pF
SMDA03LC
SMDA03LCC
SMDA05LC
SMDA05LCC
SMDA08LC
SMDA08LCC
SMDA12LC
SMDA12LCC
SMDA15LC
SMDA15LCC
SMDA24LC
SMDA24LCC
SLA
SLB
SLC
SLD
SLE
SLF
SLG
SLH
SLJ
SLK
SLL
SLM
4.5
4.5
6.0
6.0
8.5
8.5
13.3
13.3
16.7
16.7
26.7
26.7
7.0
7.0
9.8
9.8
13.4
13.4
19.0
19.0
24.0
24.0
43.0
43.0
10.9V @ 43.0A
10.9V @ 43.0A
13.5V @ 42.0A
13.5V @42.0A
16.9V @ 34.0A
16.9V @ 34.0A
25.9V @ 27.0A
25.9V @ 27.0A
30.0V @ 17.0A
30.0V @ 17.0A
49.0V @ 12.0A
49.0V @ 12.0A
15
15
15
15
15
15
15
15
15
15
15
15
MAXIMUM
LEAKAGE
CURRENT
@V
WM
I
D
A
125
125
20
20
10
10
1
1
1
1
1
1
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
3.3
3.3
5.0
5.0
8.0
8.0
12.0
12.0
15.0
15.0
24.0
24.0
Note 1: Only applies to unidirectional devices.
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55
C to 150
C
C
C
-55
C to 150
C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
Peak Pulse Power (t
p
= 8/20s) - See Figure 1
P
PP
500
Watts
Forward Voltage @ 50mA, 300s - Square Wave (Note 1)
Volts
1.5
V
F
3
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05074.R4 12/02
SMDA03LC
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SMDA24LCC
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR SMDA05LC
ESD Test Pulse: 5 kilovolt, 1/30ns (waveform)
GRAPHS
0.1 1 10 100 1,000 10,000
t
d
- Pulse Duration - s
10
100
1,000
10,000
P
PP
- Peak Pulse Current - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
500W, 8/20s Waveform
0 25 50 75 100 125 150
T
L
- Lead Temperature - C
20
40
60
80
100
% Of Rated Power
Peak Pulse Power
8/20s
Average Power
FIGURE 3
POWER DERATING CURVE
0
0 5 10 15 20 25 30
t - Time - s
0
20
40
60
80
100
120
I
PP
- Peak Pulse Current - % of I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8s
t
d
= 20s
t
f
Peak Value I
PP
e
-t
FIGURE 2
PULSE WAVE FORM
I
PP
/2
t
d
= t
5
V
o
lts per Division
-20
-10
0
10
20
4
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05074.R4 12/02
SMDA03LC
thru
SMDA24LCC
The SMDAxxLC & SMDAxxLCC Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD (> 40kV), EFT and
other types of surges. This product series provides both unidiretional and bidirectional protection, with a surge capability of 500 Watts P
PP
per line for
an 8/20s waveform.
UNIDIRECTIONAL CONFIGURATION
COMMON-MODE PROTECTION (Figure 1)
The SMDAxxLC Series provides up to four (4) lines of protection in a common mode
configuration as depicted in Figure 1.
Circuit connectivity is as follows:
Line 1 is connected to Pin 5.
Line 2 is connected to Pin 6.
Line 3 is connected to Pin 7.
Line 4 is connected to Pin 8.
Pins 1-4 are connected to ground.
BIDIRECTIONAL CONFIGURATION
COMMON-MODE PROTECTION (Figure 2)
Ideal for Ethernet applications, SMDAxxLCC Series provides up to four (4) lines of
protection in a common-mode configuration as depicted in Figure 2.
Circuit connectivity is as follows:
TPIN is connected to Pin 5.
TPIP is connected to Pin 6.
TPON is connected to Pin 1.
TPOP is connected to Pin 2.
Pins 3, 4, 7 & 8 are connected to ground.
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic Compat-
ibility (EMC) protection. The following guidelines are
recommended:
The protection device should be placed near the input
terminals or connectors, the device will divert the
transient current immediately before it can be coupled
into the nearby traces.
The path length between the TVS device and the
protected line should be minimized.
All conductive loops including power and ground loops
should be minimized.
The transient current return path to ground should be
kept as short as possible to reduce parasitic induc-
tance.
Ground planes should be used whenever possible.
For multilayer PCBs, use ground vias.
APPLICATION NOTES
Figure 1. Unidirectional Common-Mode Protection
5
6
7
8
1
2
3
4
LINE 4
LINE 3
LINE 2
LINE 1
GND PLANE
Figure 2. Bidirectional Common-Mode Protection
5
6
7
8
1
2
3
4
TPIN
TPIP
TPOP
TPON
ETHERNET REPEA
TER
5
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05074.R4 12/02
SMDA03LC
thru
SMDA24LCC
PACKAGE OUTLINE & DIMENSIONS
COPYRIGHT ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and
technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
A
B
C
D
F
G
J
K
P
R
4.80
3.80
1.35
0.35
0.40
1.27 BSC
0.18
0.10
5.80
0.25
5.00
4.00
1.75
0.49
1.250
1.27 BSC
0.25
0.25
6.20
0.50
0.189
0.150
0.054
0.014
0.016
0.05 BSC
0.007
0.004
0.229
0.010
0.196
0.157
0.068
0.019
0.049
0.05 BSC
0.009
0.008
0.244
0.019
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES:
1. - T - = Seating Plane and Datum Surface.
2. Dimensions "A" and "B" are Datum.
3. Dimensions "A" and "B" do not include mold
protrusion.
4. Maximum mold protrusion is 0.015" (0.380 mm)
per side.
5. Dimensioning and tolerances per ANSI Y14.5M,
1982.
6. Dimensions are exclusive of mold flash and metal
burrs.
-A-
P
-B-
D
G
8
5
4
1
-T-
K
C
R X 45
J
F
0
- 10
0.010" (0.25 MM)
M
B
M
4 PL
0.010" (0.25 MM)
S
B
M
8 PL
T
A
S
PACKAGE OUTLINE
SO-8
0.030"
0.005"
0.050"
0.005"
0.160"
0.005"
0.045"
0.005"
0.245" MIN
MOUNTING PAD
06009 Rev 1 -11/01
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
TAPE & REEL ORDERING INFORMATION:
Surface mount product is taped and reeled in accordance with EIA-481.
Suffix -T7: 7 Inch Reel - 1,000 pieces per reel (i.e., SMDA05LC-T7).
Suffix -T13: 13 Inch Reel - 2,500 pieces per reel (i.e., SMDA05LC-T13).
No Suffix: Bulk Quantities - 98 pieces per tube.
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