Document Outline
- FEATURES
- Optimized for in-car low-speed communication
- Bus failure management
- Protections
- Support for low power modes
- GENERAL DESCRIPTION
- ORDERING INFORMATION
- QUICK REFERENCE DATA
- BLOCK DIAGRAM
- PINNING
- FUNCTIONAL DESCRIPTION
- LIMITING VALUES
- THERMAL CHARACTERISTICS
- QUALITY SPECIFICATION
- DC CHARACTERISTICS
- TIMING CHARACTERISTICS
- TEST AND APPLICATION INFORMATION
- BONDING PAD LOCATIONS
- PACKAGE OUTLINE
- SOLDERING
- DATA SHEET STATUS
- DEFINITIONS
- DISCLAIMERS
DATA SHEET
Product specification
Supersedes data of 1999 Feb 11
File under Integrated Circuits, IC18
2001 Nov 20
INTEGRATED CIRCUITS
TJA1054
Fault-tolerant CAN transceiver
2001 Nov 20
2
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
FEATURES
Optimized for in-car low-speed communication
Baud rate up to 125 kBaud
Up to 32 nodes can be connected
Supports unshielded bus wires
Very low ElectroMagnetic Emission (EME) due to
built-in slope control function and a very good matching
of the CANL and CANH bus outputs
Good ElectroMagnetic Immunity (EMI) in normal
operating mode and in low power modes
Fully integrated receiver filters
Transmit Data (TxD) dominant time-out function.
Bus failure management
Supports single-wire transmission modes with ground
offset voltages up to 1.5 V
Automatic switching to single-wire mode in the event of
bus failures, even when the CANH bus wire is
short-circuited to V
CC
Automatic reset to differential mode if bus failure is
removed
Full wake-up capability during failure modes.
Protections
Bus pins short-circuit safe to battery and to ground
Thermally protected
Bus lines protected against transients in an automotive
environment
An unpowered node does not disturb the bus lines.
Support for low power modes
Low current sleep and standby mode with wake-up via
the bus lines
Power-on reset flag on the output.
GENERAL DESCRIPTION
The TJA1054 is the interface between the protocol
controller and the physical bus wires in a Controller Area
Network (CAN). It is primarily intended for low-speed
applications up to 125 kBaud in passenger cars. The
device provides differential receive and transmit capability
but will switch to single-wire transmitter and/or receiver in
error conditions.
The TJA1054T is pin and downwards compatible with the
PCA82C252T and the TJA1053T. This means that these
two devices can be replaced by the TJA1054T with
retention of all functions.
The most important improvements of the TJA1054 with
respect to the PCA82C252 and the TJA1053 are:
Very low EME due to a very good matching of the CANL
and CANH output signals
Good EMI, especially in low power modes
Full wake-up capability during bus failures
Extended bus failure management including
short-circuit of the CANH bus line to V
CC
Support for easy system fault diagnosis
Two-edge sensitive wake-up input signal via pin WAKE.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TJA1054T
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
TJA1054U
-
bare die; 2000
2830
375
m
-
2001 Nov 20
3
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
CC
supply voltage on pin V
CC
4.75
-
5.25
V
V
BAT
battery voltage on pin BAT
no time limit
-
0.3
-
+40
V
operating mode
5.0
-
27
V
load dump
-
-
40
V
I
BAT
battery current on pin BAT
Sleep mode; V
CC
= 0 V;
V
BAT
= 12 V
-
30
50
A
V
CANH
CANH bus line voltage
V
CC
= 0 to 5.5 V; V
BAT
0 V;
no time limit
-
40
-
+40
V
V
CANL
CANL bus line voltage
V
CC
= 0 to 5.5 V; V
BAT
0 V;
no time limit
-
40
-
+40
V
V
CANH
CANH bus line transmitter
voltage drop
I
CANH
=
-
40 mA
-
-
1.4
V
V
CANL
CANL bus line transmitter
voltage drop
I
CANL
= 40 mA
-
-
1.4
V
t
PD(L)
propagation delay TXD (LOW)
to RXD (LOW)
-
1
-
s
t
r
bus line output rise time
between 10% and 90%;
C1 = 10 nF; see Fig.5
-
0.6
-
s
t
f
bus line output fall time
between 90% and 10%;
C1 = 1 nF; see Fig.5
-
0.3
-
s
T
vj
virtual junction temperature
-
40
-
+150
C
2001 Nov 20
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
BLOCK DIAGRAM
handbook, full pagewidth
MGL421
FAILURE DETECTOR
PLUS WAKE-UP
PLUS TIME-OUT
WAKE-UP
STANDBY
CONTROL
INH
1
WAKE
7
STB
5
EN
6
TXD
VCC
VCC
VCC
2
ERR
4
RXD
3
TEMPERATURE
PROTECTION
DRIVER
RECEIVER
BAT
14
VCC
10
13
GND
FILTER
TIMER
FILTER
TJA1054
9
11
12
8
RTL
CANH
CANL
RTH
Fig.1 Block diagram.
2001 Nov 20
5
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
PINNING
SYMBOL
PIN
DESCRIPTION
INH
1
inhibit output for switching an external voltage regulator if a wake-up signal occurs
TXD
2
transmit data input for activating the driver to the bus lines
RXD
3
receive data output for reading out the data from the bus lines
ERR
4
error, wake-up and power-on indication output; active LOW in normal operating mode when the bus
has a failure, and in low power modes (wake-up signal or in power-on standby)
STB
5
standby digital control signal input (active LOW); together with the input signal on pin EN this input
determines the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3
EN
6
enable digital control signal input; together with the input signal on pin STB this input determines
the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3
WAKE
7
local wake-up signal input (active LOW); both falling and rising edges are detected
RTH
8
termination resistor connection; in case of a CANH bus wire error the line is terminated with a
predefined impedance
RTL
9
termination resistor connection; in case of a CANL bus wire the line is terminated with a predefined
impedance
V
CC
10
supply voltage
CANH
11
HIGH-level CAN bus line
CANL
12
LOW-level CAN bus line
GND
13
ground
BAT
14
battery voltage connection
handbook, halfpage
MGL422
1
INH
2
3
4
5
6
7
14 BAT
TXD
GND
RXD
CANL
ERR
CANH
STB
VCC
EN
RTL
WAKE
RTH
13
12
11
10
9
8
TJA1054T
Fig.2 Pin configuration.
2001 Nov 20
6
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
FUNCTIONAL DESCRIPTION
The TJA1054 is the interface between the CAN protocol
controller and the physical wires of the CAN bus
(see Fig.7). It is primarily intended for low speed
applications, up to 125 kBaud, in passenger cars. The
device provides differential transmit capability to the CAN
bus and differential receive capability to the CAN
controller.
To reduce EME, the rise and fall slopes are limited. This
allows the use of an unshielded twisted pair or a parallel
pair of wires for the bus lines. Moreover, the device
supports transmission capability on either bus line if one of
the wires is corrupted. The failure detection logic
automatically selects a suitable transmission mode.
In normal operating mode (no wiring failures) the
differential receiver is output on pin RXD (see Fig.1).
The differential receiver inputs are connected to
pins CANH and CANL through integrated filters.
The filtered input signals are also used for the single-wire
receivers. The receivers connected to pins CANH
and CANL have threshold voltages that ensure a
maximum noise margin in single-wire mode.
A timer function (TxD dominant time-out function) has
been integrated to prevent the bus lines from being driven
into a permanent dominant state (thus blocking the entire
network communication) due to a situation in which
pin TXD is permanently forced to a LOW level, caused by
a hardware and/or software application failure.
If the duration of the LOW level on pin TXD exceeds a
certain time, the transmitter will be disabled. The timer will
be reset by a HIGH level on pin TXD.
Failure detector
The failure detector is fully active in the normal operating
mode. After the detection of a single bus failure the
detector switches to the appropriate mode (see Table 1).
The differential receiver threshold voltage is set at
-
3.2 V
typical (V
CC
= 5 V). This ensures correct reception with a
noise margin as high as possible in the normal operating
mode and in the event of failures 1, 2, 5 and 6a. These
failures, or recovery from them, do not destroy ongoing
transmissions. The output drivers remain active, the
termination does not change and the receiver remains in
differential mode (see Table 1).
Failures 3, 3a and 6 are detected by comparators
connected to the CANH and CANL bus lines.
Failures 3 and 3a are detected in a two-step approach.
If the CANH bus line exceeds a certain voltage level, the
differential comparator signals a continuous dominant
condition. Because of inter-operability reasons with the
predecessor products PCA82C252 and TJA1053, after a
first time-out the transceiver switches to single wire
operation through CANH. If the CANH bus line is still
exceeding the CANH detection voltage for a second
time-out, the TJA1054 switches to CANL operation; the
CANH driver is switched off and the RTH bias changes to
the pull-down current source. The time-outs (delays) are
needed to avoid false triggering by external RF fields.
Table 1
Bus failures
Notes
1. A weak termination implies a pull-down current source behaviour of 75
A typical.
2. A weak termination implies a pull-up current source behaviour of 75
A typical.
FAILURE
DESCRIPTION
TERMINATION
CANH (RTH)
TERMINATION
CANL (RTL)
CANH
DRIVER
CANL
DRIVER
RECEIVER
MODE
1
CANH wire interrupted
on
on
on
on
differential
2
CANL wire interrupted
on
on
on
on
differential
3
CANH short-circuited to battery
weak; note 1
on
off
on
CANL
3a
CANH short-circuited to V
CC
weak; note 1
on
off
on
CANL
4
CANL short-circuited to ground
on
weak; note 2
on
off
CANH
5
CANH short-circuited to ground
on
on
on
on
differential
6
CANL short-circuited to battery
on
weak; note 2
on
off
CANH
6a
CANL short-circuited to V
CC
on
on
on
on
differential
7
CANL and CANH mutually
short-circuited
on
weak; note 2
on
off
CANH
2001 Nov 20
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
Failure 6 is detected if the CANL bus line exceeds its
comparator threshold for a certain period of time. This
delay is needed to avoid false triggering by external RF
fields. After detection of failure 6, the reception is switched
to the single wire mode through CANH; the CANL driver is
switched off and the RTL bias changes to the pull-up
current source.
Recovery from failures 3, 3a and 6 is detected
automatically after reading a consecutive recessive level
by corresponding comparators for a certain period of time.
Failures 4 and 7 initially result in a permanent dominant
level on pin RXD. After a time-out the CANL driver is
switched off and the RTL bias changes to the pull-up
current source. Reception continues by switching to the
single-wire mode via pins CANH or CANL. When
failures 4 or 7 are removed, the recessive bus levels are
restored. If the differential voltage remains below the
recessive threshold level for a certain period of time,
reception and transmission switch back to the differential
mode.
If any of the wiring failures occur, the output signal on
pin ERR will be set to LOW. On error recovery, the output
signal on pin ERR will be set to HIGH again. In case of an
interrupted open bus wire, this failure will be detected and
signalled only if there is an open wire between the
transmitting and receiving node(s). Thus, during open wire
failures, pin ERR typically toggles.
During all single-wire transmissions, EMC performance
(both immunity and emission) is worse than in the
differential mode. The integrated receiver filters suppress
any HF noise induced into the bus wires. The cut-off
frequency of these filters is a compromise between
propagation delay and HF suppression. In single-wire
mode, LF noise cannot be distinguished from the required
signal.
Low power modes
The transceiver provides three low power modes which
can be entered and exited via pins STB and EN
(see Table 2 and Fig.3).
The Sleep mode is the mode with the lowest power
consumption. Pin INH is switched to high-impedance for
deactivation of the external voltage regulator. Pin CANL is
biased to the battery voltage via pin RTL. If the supply
voltage is provided, pins RXD and ERR will signal the
wake-up interrupt.
The standby mode operates in the same way as the Sleep
mode but with a HIGH level on pin INH.
Table 2
Normal operating and low power modes
Notes
1. If the supply voltage V
CC
is present.
2. Wake-up interrupts are released when entering normal operating mode.
3. In case the goto-sleep command was used before. When V
CC
drops pin EN will become LOW, but due to the fail-safe
functionality this does not effect the internal functions.
4. V
BAT
power-on flag will be reset when entering normal operating mode.
MODE
PIN
STB
PIN
EN
PIN ERR
PIN RXD
PIN RTL
SWITCHED
TO
LOW
HIGH
LOW
HIGH
Goto-sleep
command
LOW
HIGH
wake-up interrupt
signal;
notes 1 and 2
wake-up
interrupt signal;
notes 1 and 2
V
BAT
Sleep
LOW
LOW
(3)
Standby
LOW
LOW
Power-on
standby
HIGH
LOW
V
BAT
power-on flag;
notes 1 and 4
wake-up
interrupt signal;
notes 1 and 2
V
BAT
Normal
operating
HIGH
HIGH
error flag
no error flag
dominant
received data
recessive
received data
V
CC
2001 Nov 20
8
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
The power-on standby mode is the same as the standby
mode, however, in this mode the battery power-on flag is
shown on pin ERR instead of the wake-up interrupt signal.
The output on pin RXD will show the wake-up interrupt.
This mode is only for reading out the power-on flag.
Wake-up requests are recognized by the transceiver
through two possible channels:
The bus lines for remote wake-up
Pin WAKE for local wake-up.
In order to wake-up the transceiver remotely through the
bus lines, a filter mechanism is integrated. This
mechanism makes sure that noise and any present bus
failure conditions do not result into an erroneous wake-up.
Because of this mechanism it is not sufficient to simply pull
the CANH or CANL bus lines to a dominant level for a
certain time. To guarantee a successful remote wake-up
under all conditions, a message frame with a dominant
phase of at least the maximum specified t
CANH
or t
CANL
in
it is required.
A local wake-up through pin WAKE is detected by a rising
or falling edge with a consecutive level with the maximum
specified t
WAKE
.
On a wake-up request the transceiver will set the output on
pin INH to HIGH which can be used to activate the external
supply voltage regulator.
If V
CC
is present the wake-up request can be read on the
ERR or RXD outputs, so the external microcontroller can
activate the transceiver (switch to normal operating mode)
via pins STB and EN.
To prevent a false remote wake-up due to transients or
RF fields, the wake-up voltage levels have to be
maintained for a certain period of time. In the low power
modes the failure detection circuit remains partly active to
prevent an increased power consumption in the event of
failures 3, 3a, 4 or 7.
To prevent a false local wake-up during an open wire at
pin WAKE, this pin has a weak pull-up current source
towards V
BAT
. Pin INH is set to floating only if the
goto-sleep command is entered successfully. To enter a
successful goto-sleep command under all conditions, this
command must be kept stable for the maximum
specified t
h(sleep)
.
Pin INH will be set to a HIGH level again by the following
events only:
V
BAT
power-on (cold start)
Rising or falling edge on pin WAKE
A message frame with a dominant phase of at least the
maximum specified t
CANH
or t
CANL
, while pin EN or
pin STB is at a LOW level
Pin STB goes to a HIGH level with V
CC
active.
To provide fail-safe functionality, the signals on pins STB
and EN will internally be set to LOW when V
CC
is below a
certain threshold voltage (V
CC(stb)
).
Power-on
After power-on (V
BAT
switched on) the signal on pin INH
will become HIGH and an internal power-on flag will be set.
This flag can be read in the power-on standby mode
through pin ERR (STB = 1; EN = 0) and will be reset by
entering the normal operating mode.
Protection
A current limiting circuit protects the transmitter output
stages against short-circuit to positive and negative
battery voltage.
If the junction temperature exceeds the typical value of
165
C, the transmitter output stages are disabled.
Because the transmitter is responsible for the major part of
the power dissipation, this will result in a reduced power
dissipation and hence a lower chip temperature. All other
parts of the device will continue to operate.
The pins CANH and CANL are protected against electrical
transients which may occur in an automotive environment.
2001 Nov 20
9
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
handbook, full pagewidth
MBK949
POWER-ON
STANDBY
10
NORMAL
(4)
11
GOTO
SLEEP
(5)
01
STANDBY
00
SLEEP
00
(1)
(2)
(3)
Fig.3 Mode control.
Mode 10 stands for: pin STB = HIGH and pin EN = LOW.
(1) Mode change via input pins STB and EN.
(2) Mode change via input pins STB and EN; it should be noted that in the sleep mode pin INH is inactive and possibly there is no V
CC
.
Mode control is only possible if V
CC
of the transceiver is active.
(3) Pin INH is activated after wake-up via bus or input pin WAKE.
(4) Transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are cleared.
(5) Transitions to sleep mode: pin INH is deactivated.
2001 Nov 20
10
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
Notes
1. All voltages are defined with respect to pin GND. Positive current flows into the device.
2. Only relevant if V
WAKE
< V
GND
-
0.3 V; current will flow into pin GND.
3. Junction temperature in accordance with IEC 60747-1. An alternative definition is: T
vj
= T
amb
+ P
R
th(vj-a)
where
R
th(vj-a)
is a fixed value to be used for the calculation of T
vj
. The rating for T
vj
limits the allowable combinations of
power dissipation (P) and operating ambient temperature (T
amb
).
4. Equivalent to discharging a 100 pF capacitor through a 1.5 k
resistor.
5. Equivalent to discharging a 200 pF capacitor through a 10
resistor and a 0.75
H coil.
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
Quality specification in accordance with
"SNW-FQ-611D".
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
supply voltage on pin V
CC
-
0.3
+6
V
V
BAT
battery voltage on pin BAT
-
0.3
+40
V
V
n
DC voltage on pins TXD, RXD,
ERR, STB and EN
-
0.3
V
CC
+ 0.3
V
V
CANH
DC voltage on pin CANH
-
40
+40
V
V
CANL
DC voltage on pin CANL
-
40
+40
V
V
trt(n)
transient voltage on pins CANH
and CANL
see Fig.6
-
150
+100
V
V
WAKE
DC voltage on pin WAKE
-
V
BAT
+ 0.3
V
I
WAKE
DC current on pin WAKE
note 2
-
15
-
mA
V
INH
DC voltage on pin INH
-
0.3
V
BAT
+ 0.3
V
V
RTH
DC voltage on pin RTH
-
0.3
V
BAT
+ 1.2
V
V
RTL
DC voltage on pin RTL
-
0.3
V
BAT
+ 1.2
V
R
RTH
termination resistance on pin RTH
500
16000
R
RTL
termination resistance on pin RTL
500
16000
T
vj
virtual junction temperature
note 3
-
40
+150
C
T
stg
storage temperature
-
55
+150
C
V
esd
electrostatic discharge voltage
human body model; note 4
-
2
+2
kV
machine model; note 5
-
175
+175
V
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air
120
K/W
R
th(j-s)
thermal resistance from junction to substrate bare die
in free air
40
K/W
2001 Nov 20
11
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
DC CHARACTERISTICS
V
CC
= 4.75 to 5.25 V; V
BAT
= 5 to 27 V; V
STB
= V
CC
; T
vj
=
-
40 to +150
C; all voltages are defined with respect to
ground; positive currents flow into the device; unless otherwise specified; notes 1 and 2.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies (pins V
CC
and BAT)
V
CC
supply voltage on pin V
CC
4.75
-
5.25
V
V
CC(stb)
supply voltage for forced
standby mode (fail-safe)
2.75
-
4.5
V
I
CC
supply current
normal operating mode;
V
TXD
= V
CC
(recessive)
4
7
11
mA
normal operating mode;
V
TXD
= 0 V (dominant);
no load
10
17
27
mA
low power modes;
V
TXD
= V
CC
0
0
10
A
V
BAT
battery voltage on pin BAT
no time limit
-
0.3
-
+40
V
operating mode
5.0
-
27
V
load dump
-
-
40
V
I
BAT
battery current on pin BAT
all modes and in low power
modes at V
RTL
= V
BAT
;
V
WAKE
= V
INH
= V
BAT
V
BAT
= 12 V
10
30
50
A
V
BAT
= 5 to 27 V
5
30
125
A
V
BAT
= 3.5 V
5
20
30
A
V
BAT
= 1 V
0
0
10
A
V
BAT(Pwon)
power-on flag voltage on
pin BAT
low power modes
power-on flag set
-
-
1
V
power-on flag not set
3.5
-
-
V
I
tot
supply current plus battery
current
low power modes;
V
CC
= 5 V;
V
BAT
= V
WAKE
= V
INH
= 12 V
-
30
60
A
Pins STB, EN and TXD
V
IH
HIGH-level input voltage
0.7V
CC
-
V
CC
+ 0.3
V
V
IL
LOW-level input voltage
-
0.3
-
0.3V
CC
V
I
IH
HIGH-level input current
V
I
= 4 V
pins STB and EN
-
9
20
A
pin TXD
-
200
-
80
-
25
A
I
IL
LOW-level input current
V
I
= 1 V
pins STB and EN
4
8
-
A
pin TXD
-
800
-
320
-
100
A
2001 Nov 20
12
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
Pins RXD and ERR
V
OH
HIGH-level output voltage
on pin ERR
l
O
=
-
100
A
V
CC
-
0.9
-
V
CC
V
on pin RXD
I
O
=
-
1 mA
V
CC
-
0.9
-
V
CC
V
V
OL
LOW-level output voltage on
pins ERR and RXD
I
O
= 1.6 mA
0
-
0.4
V
I
O
= 7.5 mA
0
-
1.5
V
Pin WAKE
I
IL
LOW-level input current
V
WAKE
= 0 V; V
BAT
= 27 V
-
10
-
4
-
1
A
V
th(wake)
wake-up threshold voltage
V
STB
= 0 V
2.5
3.2
3.9
V
Pin INH
V
H
HIGH-level voltage drop
I
INH
=
-
0.18 mA
-
-
0.8
V
I
L
leakage current
Sleep mode; V
INH
= 0 V
-
-
5
A
Pins CANH and CANL
V
th(dif)
differential receiver threshold
voltage
no failures and
bus failures 1, 2, 5 and 6a;
see Fig.4
V
CC
= 5 V
-
3.5
-
3.2
-
2.9
V
V
CC
= 4.75 to 5.25 V
-
0.70V
CC
-
0.64V
CC
-
0.58V
CC
V
V
O(reces)
recessive output voltage
V
TXD
= V
CC
on pin CANH
R
RTH
< 4 k
-
-
0.2
V
on pin CANL
R
RTL
< 4 k
V
CC
-
0.2
-
-
V
V
O(dom)
dominant output voltage
V
TXD
= 0 V; V
EN
= V
CC
on pin CANH
I
CANH
=
-
40 mA
V
CC
-
1.4
-
-
V
on pin CANL
I
CANL
= 40 mA
-
-
1.4
V
I
O(CANH)
output current on pin CANH
normal operating mode;
V
CANH
= 0 V; V
TXD
= 0 V
-
110
-
80
-
45
mA
low power modes;
V
CANH
= 0 V; V
CC
= 5 V
-
-
0.25
-
A
I
O(CANL)
output current on pin CANL
normal operating mode;
V
CANL
= 14 V; V
TXD
= 0 V
45
70
100
mA
low power modes;
V
CANL
= 12 V; V
BAT
= 12 V
-
0
-
A
V
d(CANH)(sc)
detection voltage for
short-circuit to battery voltage
on pin CANH
normal operating mode
1.5
1.7
1.85
V
low power modes
1.1
1.8
2.5
V
V
d(CANL)(sc)
detection voltage for
short-circuit to battery voltage
on pin CANL
normal operating mode
V
CC
= 5 V
6.6
7.2
7.8
V
V
CC
= 4.75 to 5.25 V
1.32V
CC
1.44V
CC
1.56V
CC
V
V
th(wake)
wake-up threshold voltage
low power modes
on pin CANL
2.5
3.2
3.9
V
on pin CANH
1.1
1.8
2.5
V
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2001 Nov 20
13
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
Notes
1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at
T
amb
= 125
C for dies on wafer level, and in addition to this 100% tested at T
amb
= 25
C for cased products, unless
otherwise specified.
2. For bare die, all parameters are only guaranteed if the back side of the die is connected to ground.
V
th(wake)
difference of wake-up
threshold voltages
low power modes
0.8
1.4
-
V
V
th(CANH)(se)
single-ended receiver
threshold voltage on
pin CANH
normal operating mode;
failures 4, 6 and 7
V
CC
= 5 V
1.5
1.7
1.85
V
V
CC
= 4.75 to 5.25 V
0.30V
CC
0.34V
CC
0.37V
CC
V
V
th(CANL)(se)
single-ended receiver
threshold voltage on pin CANL
normal operating mode;
failures 3 and 3a
V
CC
= 5 V
3.15
3.3
3.45
V
V
CC
= 4.75 to 5.25 V
0.63V
CC
0.66V
CC
0.69V
CC
V
R
i(CANH)(se)
single-ended input resistance
on pin CANH
normal operating mode
110
165
270
k
R
i(CANL)(se)
single-ended input resistance
on pin CANL
normal operating mode
110
165
270
k
R
i(dif)
differential input resistance
normal operating mode
220
330
540
k
Pins RTH and RTL
R
sw(RTL)
switch-on resistance between
pin RTL and V
CC
normal operating mode;
I
O
< 10 mA
-
50
100
R
sw(RTH)
switch-on resistance between
pin RTH and ground
normal operating mode;
I
O
< 10 mA
-
50
100
V
O(RTH)
output voltage on pin RTH
low power modes; I
O
= 1 mA
-
0.7
1.0
V
I
O(RTL)
output current on pin RTL
low power modes;
V
RTL
= 0 V
-
1.25
-
0.65
-
0.3
mA
I
pu(RTL)
pull-up current on pin RTL
normal operating mode;
failures 4, 6 and 7
-
75
-
A
I
pd(RTH)
pull-down current on pin RTH
normal operating mode;
failures 3 and 3a
-
75
-
A
Thermal shutdown
T
j(sd)
junction temperature for shut
down
155
165
180
C
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2001 Nov 20
14
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
TIMING CHARACTERISTICS
V
CC
= 4.75 to 5.25 V; V
BAT
= 5 to 27 V; V
STB
= V
CC
; T
vj
=
-
40 to +150
C; all voltages are defined with respect to
ground; unless otherwise specified; notes 1 and 2
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
t
t(r-d)
CANL and CANH output transition
time for recessive to dominant
between 10% and 90%;
R1 = 100
; C1 = 10 nF;
C2 not present; see Fig.5
0.35
0.60
-
s
t
t(d-r)
CANL and CANH output transition
time for dominant to recessive
between 10% and 90%;
R1 = 100
; C1 = 1 nF;
C2 not present; see Fig.5
0.2
0.3
-
s
t
PD(L)
propagation delay TXD (LOW) to
RXD (LOW)
no failures and
failures 1, 2, 5 and 6a;
R1 = 100
; see Figs 4 and 5
C1 = 1 nF; C2 not present
-
0.75
1.5
s
C1 = C2 = 3.3 nF
-
1
1.75
s
failures 3, 3a, 4, 6 and 7;
R1 = 100
; see Figs 4 and 5
C1 = 1 nF; C2 not present
-
0.85
1.4
s
C1 = C2 = 3.3 nF
-
1.1
1.7
s
t
PD(H)
propagation delay TXD (HIGH) to
RXD (HIGH)
no failures and
failures 1, 2, 5 and 6a;
R1 = 100
; see Figs 4 and 5
C1 = 1 nF; C2 not present
-
1.2
1.9
s
C1 = C2 = 3.3 nF
-
2.5
3.3
s
failures 3, 3a, 4, 6 and 7;
R1 = 100
; see Figs 4 and 5
C1 = 1 nF; C2 not present
-
1.1
1.7
s
C1 = C2 = 3.3 nF
-
1.5
2.2
s
t
react(sleep)
reaction time of goto-sleep
command
note 3
5
-
50
s
t
dis(TxD)
disable time of TxD permanent
dominant timer
normal operating mode;
V
TXD
= 0 V
0.75
-
4
ms
t
CANH
dominant time for remote wake-up
on pin CANH
low power modes; V
BAT
= 12 V;
note 3
7
-
38
s
t
CANL
dominant time for remote wake-up
on pin CANL
low power modes; V
BAT
= 12 V;
note 3
7
-
38
s
t
WAKE
required time on pin WAKE for
local wake-up
low power modes; V
BAT
= 12 V;
for wake-up after receiving a
falling or rising edge; note 3
7
-
38
s
t
det
failure detection time
normal operating mode
failures 3 and 3a
1.6
-
8.0
ms
failures 4, 6 and 7
0.3
-
1.6
ms
low power modes; V
BAT
= 12 V
failures 3 and 3a
1.6
-
8.0
ms
failures 4 and 7
0.1
-
1.6
ms
2001 Nov 20
15
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
Notes
1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at
T
amb
= 125
C for dies on wafer level, and in addition to this 100% tested at T
amb
= 25
C for cased products, unless
otherwise specified.
2. For bare die, all parameters are only guaranteed if the back side of the die is connected to ground.
3. To guarantee a successful mode transition under all conditions, the maximum specified time must be applied.
t
rec
failure recovery time
normal operating mode
failures 3 and 3a
0.3
-
1.6
ms
failures 4 and 7
7
-
38
s
failure 6
125
-
750
s
low power modes; V
BAT
= 12 V
failures 3, 3a, 4 and 7
0.3
-
1.6
ms
N
det
pulse-count difference between
CANH and CANL for failure
detection
normal operating mode and
failures 1, 2, 5 and 6a;
pin ERR becomes LOW
-
4
-
N
rec
number of consecutive pulses on
CANH and CANL simultaneously
for failure recovery
failures 1, 2, 5 and 6a
-
4
-
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
handbook, full pagewidth
MGL424
-
5 V
-
3.2 V
2.2 V
0.7VCC
0.3VCC
0 V
5 V
1.4 V
3.6 V
0 V
VCC
VTXD
VCANL
VCANH
Vdiff
VRXD
tPD(L)
tPD(H)
Fig.4 Timing diagram.
V
diff
= V
CANH
-
V
CANL
.
2001 Nov 20
16
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
TEST AND APPLICATION INFORMATION
handbook, full pagewidth
MGL423
20 pF
RXD
EN
STB
TXD
WAKE
7
2
5
6
3
INH
BAT
VCC
1
14
10
GND
ERR
13
4
RTL
RTH
8
9
CANL
12
CANH
11
+
5 V
R1
C1
C2
R1
C1
TJA1054
Fig.5 Test circuit for dynamic characteristics.
Termination resistors R1 (100
) are not connected to pin RTH or pin RTL for testing purposes because the minimum load allowed on
the CAN bus lines is 500
per transceiver.
The capacitive bus load of 10 nF is split into 3 equal capacitors (3.3 nF) to simulate the bus cable.
handbook, full pagewidth
MGL426
20 pF
RXD
EN
STB
TXD
WAKE
7
2
5
6
3
INH
BAT
VCC
1
14
10
GND
ERR
13
4
RTL
RTH
8
9
CANL
12
CANH
11
+
5 V
+
12 V
1 nF
10
F
GENERATOR
1 nF
1 nF
1 nF
125
125
511
511
TJA1054
Fig.6 Test circuit for automotive transients.
The waveforms of the applied transients on pins CANH and CANL will be in accordance with ISO 7637 part 1: test pulses 1, 2, 3a and 3b.
2001 Nov 20
17
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
handbook, full pagewidth
MGL425
100 nF
TXD
RXD
STB
ERR
EN
INH
2
7
3
5
4
6
1
TJA1054
CAN TRANSCEIVER
BAT
VCC
VDD
GND
14
10
13
WAKE
P8xC592/P8xCE598
CAN CONTROLLER
CTX0
CRXO
Px.x Px.x Px.x
8
11
12
9
RTL
CANL
CANH
RTH
CAN BUS LINE
+
5 V
+
5 V
BATTERY
VBAT
Fig.7 Application diagram.
For more information, please refer to the separate FTCAN information, available via our website
2001 Nov 20
18
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
BONDING PAD LOCATIONS
Note
1. All coordinates (
m) represent the position of the centre of each pad with respect to the bottom left-hand corner of
the die (see Fig.8).
SYMBOL
PAD
COORDINATES
(1)
x
y
INH
1
206
357
TXD
2
211
209
RXD
3
850
151
ERR
4
1447
151
STB
5
2348
143
EN
6
2621
280
WAKE
7
2621
421
RTH
8
2650
1309
RTL
9
2459
1880
V
CC
10
1986
1849
CANH
11
972
1880
CANL
12
537
1880
GND
13a
180
1396
GND
13b
180
1281
BAT
14
206
812
handbook, full pagewidth
TJA1054U
1
2
3
4
5
6
7
8
9
10
11
12
14
13
a
13
b
MGW505
y
2830
m
x
0
0
2000
m
Fig.8 Bonding pad locations.
2001 Nov 20
19
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT108-1
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
7
8
1
14
y
076E06
MS-012
pin 1 index
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.35
0.34
0.16
0.15
0.050
1.05
0.041
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
97-05-22
99-12-27
0
2.5
5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
2001 Nov 20
20
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 220
C for
thick/large packages, and below 235
C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
2001 Nov 20
21
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not suitable
(2)
suitable
PLCC
(3)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended
(5)
suitable
2001 Nov 20
22
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DATA SHEET STATUS
(1)
PRODUCT
STATUS
(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Bare die
All die are tested and are guaranteed to
comply with all data sheet limits up to the point of wafer
sawing for a period of ninety (90) days from the date of
Philips' delivery. If there are data sheet limits not
guaranteed, these will be separately indicated in the data
sheet. There are no post packing tests performed on
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
functionality or performance of the die or systems after
third party sawing, handling, packing or assembly of the
die. It is the responsibility of the customer to test and
qualify their application in which the die is used.
2001 Nov 20
23
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054
NOTES
Koninklijke Philips Electronics N.V. 2001
SCA73
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands
703502/02/pp
24
Date of release:
2001 Nov 20
Document order number:
9397 750 08965
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