2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

FEATURES

Optimized for in-vehicle high speed communication

Fully compatible with the ISO 11898 standard

Communication speed up to 1 Mbit/s

Very low ElectroMagnetic Emission (EME)

Differential receiver with wide common-mode range,
offering high ElectroMagnetic Immunity (EMI)

Passive behaviour when supply voltage is off

Automatic I/O-level adaptation to the host controller
supply voltage

Recessive bus DC voltage stabilization for further
improvement of EME behaviour

Listen-only mode for node diagnosis and failure
containment

Allows implementation of large networks (more than
110 nodes).

Low-power management

Very low-current in standby and sleep mode, with local
and remote wake-up

Capability to power down the entire node, still allowing
local and remote wake-up

Wake-up source recognition.

Protection and diagnosis (detection and signalling)

TXD dominant clamping handler with diagnosis

RXD recessive clamping handler with diagnosis

TXD-to-RXD short-circuit handler with diagnosis

Over-temperature protection with diagnosis

Undervoltage detection on pins V

, V

I/O

and V

BAT

Automotive environment transient protected bus pins
and pin V

BAT

Short-circuit proof bus pins and pin SPLIT (to battery
and to ground)

Bus line short-circuit diagnosis

Bus dominant clamping diagnosis

Cold start diagnosis (first battery connection).

GENERAL DESCRIPTION

The TJA1041 provides an advanced interface between the
protocol controller and the physical bus in a Controller
Area Network (CAN) node. The TJA1041 is primarily
intended for automotive high-speed CAN applications (up
to 1 Mbit/s). The transceiver provides differential transmit
capability to the bus and differential receive capability to
the CAN controller. The TJA1041 is fully compatible to the
ISO 11898 standard, and offers excellent EMC
performance, very low power consumption, and passive
behaviour when supply voltage is off. The advanced
features include:

Low-power management, supporting local and remote
wake-up with wake-up source recognition and the
capability to control the power supply in the rest of the
node

Several protection and diagnosis functions including
short circuits of the bus lines and first battery connection

Automatic adaptation of the I/O-levels, in line with the
supply voltage of the controller.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TJA1041T

SO14

plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

TJA1041U

bare die; 1930

3200

380

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

QUICK REFERENCE DATA

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

DC voltage on pin V

operating range

4.75

5.25

I/O

DC voltage on pin V

I/O

operating range

2.8

5.25

BAT

DC voltage on pin V

BAT

operating range

BAT

input current

BAT

= 12 V

CANH

DC voltage on pin CANH

0 < V

< 5.25 V; no time limit

+40

CANL

DC voltage on pin CANL

0 < V

< 5.25 V; no time limit

+40

SPLIT

DC voltage on pin SPLIT

0 < V

< 5.25 V; no time limit

+40

esd

electrostatic discharge voltage

Human Body Model (HBM)

pins CANH, CANL and SPLIT

all other pins

PD(TXD-RXD)

propagation delay TXD to RXD

STB

= 0 V

255

virtual junction temperature

+150

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

PINNING

SYMBOL

PIN

DESCRIPTION

TXD

transmit data input

GND

ground

transceiver supply voltage input

RXD

receive data output; reads out data
from the bus lines

I/O

I/O-level adapter voltage input

enable control input

INH

inhibit output for switching external
voltage regulators

ERR

error and power-on indication output
(active LOW)

WAKE

local wake-up input

BAT

battery voltage input

SPLIT

common-mode stabilization output

CANL

LOW-level CAN bus line

CANH

HIGH-level CAN bus line

STB

standby control input (active LOW)

handbook, halfpage

TJA1041T

MGU165

TXD

GND

VCC

RXD

VI/O

INH

STB

CANH

CANL

SPLIT

VBAT

WAKE

ERR

Fig.2 Pinning configuration.

FUNCTIONAL DESCRIPTION

The primary function of a CAN transceiver is to provide the
CAN physical layer as described in the ISO 11898
standard. In the TJA1041 this primary function is
complemented with a number of operating modes,
fail-safe features and diagnosis features, which offer
enhanced system reliability and advanced power
management functionality.

Operating modes

The TJA1041 can be operated in five modes, each with
specific features. Control pins STB and EN select the
operating mode. Changing between modes also gives
access to a number of diagnostics flags, available via
pin ERR. The following sections describe the five
operating modes. Table 1 shows the conditions for
selecting these modes. Figure 3 illustrates the mode
transitions when V

, V

I/O

and V

BAT

are present.

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

Table 1

Operating mode selection.

Notes

1. Setting the pwon flag or the wake-up flag will clear the UV

NOM

flag.

2. The transceiver directly enters sleep mode and pin INH is set floating when the UV

NOM

flag is set (so after the

undervoltage detection time on either V

or V

I/O

has elapsed before that voltage level has recovered).

3. When go-to-sleep command mode is selected for longer than the minimum hold time of the go-to-sleep command,

the transceiver will enter sleep mode and pin INH is set floating.

4. On entering normal mode the pwon flag and the wake-up flag will be cleared.

CONTROL PINS

INTERNAL FLAGS

OPERATING MODE

PIN INH

STB

NOM

BAT

pwon, wake-up

set

(1)

sleep mode; note 2

floating

cleared

set

one or both set

standby mode

both cleared

no change from sleep mode

floating

standby mode from any other mode

cleared

one or both set

standby mode

both cleared

no change from sleep mode

floating

standby mode from any other mode

cleared

one or both set

standby mode

both cleared

no change from sleep mode

floating

go-to-sleep command mode from any
other mode; note 3

(3)

cleared

pwon/listen-only mode

cleared

normal mode; note 4

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

handbook, full pagewidth

MGU983

STANDBY

MODE

NORMAL

MODE

GO-TO-SLEEP

COMMAND

MODE

LEGEND:

= H, = L

flag set

flags cleared

logical state of pin

setting pwon and/or wake-up flag

pwon and wake-up flag both cleared

SLEEP

MODE

PWON / LISTEN-

ONLY MODE

flags cleared

and

th(min)

STB = H and EN = H

and

UVNOM cleared

STB = H and EN = L

and

UVNOM cleared

STB = L

and

flag set

STB = L

and

(EN = L or flag set)

STB = L and EN = H

and

flags cleared

STB = H

and

EN = H

STB = H

and

EN = L

STB = L

and

(EN = L or flag set)

STB = L and EN = H

and

flags cleared

STB = L

and

EN = H

STB = H

and

EN = H

STB = L

and

EN = L

STB = H

and

EN = L

STB = H

and

EN = H

STB = H

and

EN = L

Fig.3 Mode transitions when V

, V

I/O

and V

BAT

are present.

ORMAL MODE

Normal mode is the mode for normal bi-directional CAN
communication. The receiver will convert the differential
analog bus signal on pins CANH and CANL into digital
data, available for output to pin RXD. The transmitter will
convert digital data on pin TXD into a differential analog
signal, available for output to the bus pins. The bus pins
are biased at 0.5V

(via R

i(cm)

). Pin INH is active, so

voltage regulators controlled by pin INH (see Fig.4) will be
active too.

WON

LISTEN

ONLY MODE

In pwon/listen-only mode the transmitter of the transceiver
is disabled, effectively providing a transceiver listen-only

behaviour. The receiver will still convert the analog bus
signal on pins CANH and CANL into digital data, available
for output to pin RXD. As in normal mode the bus pins are
biased at 0.5V

, and pin INH remains active.

TANDBY MODE

The standby mode is the first-level power saving mode of
the transceiver, offering reduced current consumption.
In standby mode the transceiver is not able to transmit or
receive data and the low-power receiver is activated to
monitor bus activity. The bus pins are biased at ground
level (via R

i(cm)

). Pin INH is still active, so voltage

regulators controlled by this pin INH will be too.

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

Pins RXD and ERR will reflect any wake-up requests
(provided that V

I/O

is present).

SLEEP COMMAND MODE

The go-to-sleep command mode is the controlled route for
entering sleep mode. In go-to-sleep command mode the
transceiver behaves as if in standby mode, plus a
go-to-sleep command is issued to the transceiver. After
remaining in go-to-sleep command mode for the minimum
hold time (t

h(min)

), the transceiver will enter sleep mode.

The transceiver will not enter the sleep mode if the state of
pins STB or EN is changed or the UV

BAT

, pwon or

wake-up flag is set before t

h(min)

has expired.

LEEP MODE

The sleep mode is the second-level power saving mode of
the transceiver. Sleep mode is entered via the go-to-sleep

command mode, and also when the undervoltage
detection time on either V

or V

I/O

elapses before that

voltage level has recovered. In sleep mode the transceiver
still behaves as described for standby mode, but now
pin INH is set floating. Voltage regulators controlled by
pin INH will be switched off, and the current into pin V

BAT

is reduced to a minimum. Waking up a node from sleep
mode is possible via the wake-up flag and (as long as the
UV

NOM

flag is not set) via pin STB.

Internal flags

The TJA1041 makes use of seven internal flags for its
fail-safe fallback mode control and system diagnosis
support. Table 1 shows the relation between flags and
operating modes of the transceiver. Five of the internal
flags can be made available to the controller via pin ERR.
Table 2 shows the details on how to access these flags.
The following sections describe the seven internal flags.

Table 2

Accessing internal flags via pin ERR.

Notes

1. Pin ERR is an active-LOW output, so a LOW level indicates a set flag and a HIGH level indicates a cleared flag. Allow

pin ERR to stabilize for at least 8

s after changing operating modes.

2. Allow for a TXD dominant time of at least 4

s per dominant-recessive cycle.

Internal flag

Flag is available on pin ERR (note 1)

Flag is cleared

NOM

by setting the pwon or wake-up flag

BAT

when V

BAT

has recovered

pwon

in pwon/listen-only mode (coming from standby
mode, go-to-sleep command mode, or sleep mode)

on entering normal mode

wake-up

in standby mode, go-to-sleep command mode, and
sleep mode (provided that V

I/O

is present)

on entering normal mode, or by setting the
pwon or UV

NOM

flag

wake-up source

in normal mode (before the fourth dominant to
recessive edge on pin TXD; note 2)

on leaving normal mode, or by setting the
pwon flag

bus failure

in normal mode (after the fourth dominant to
recessive edge on pin TXD; note 2)

on re-entering normal mode

local failure

in pwon/listen-only mode (coming from normal
mode)

on entering normal mode or when RXD is
dominant while TXD is recessive (provided
that all local failures are resolved)

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

NOM

FLAG

NOM

is the V

and V

I/O

undervoltage detection flag.

The flag is set when the voltage on pin V

drops below

CC(sleep)

for longer than t

UV(VCC)

or when the voltage on

pin V

I/O

drops below V

I/O(sleep)

for longer than t

UV(VI/O)

When the UV

NOM

flag is set, the transceiver will enter

sleep mode to save power and not disturb the bus. In sleep
mode the voltage regulators connected to pin INH are
disabled, avoiding the extra power consumption in case of
a short-circuit condition. After a waiting time (fixed by the
same timers used for setting UV

NOM

) any wake-up request

or setting of the pwon flag will clear UV

NOM

and the timers,

allowing the voltage regulators to be reactivated at least
until UV

NOM

is set again.

BAT

FLAG

BAT

is the V

BAT

undervoltage detection flag. The flag is

set when the voltage on pin V

BAT

drops below V

BAT(stb)

When UV

BAT

is set, the transceiver will try to enter standby

mode to save power and not disturb the bus. UV

BAT

cleared when the voltage on pin V

BAT

has recovered. The

transceiver will then return to the operating mode
determined by the logic state of pins STB and EN.

WON FLAG

Pwon is the V

BAT

power-on flag. This flag is set when the

voltage on pin V

BAT

has recovered after it dropped below

BAT(pwon)

, particularly after the transceiver was

disconnected from the battery. By setting the pwon flag,
the UV

NOM

flag and timers are cleared and the transceiver

can not enter sleep mode. This ensures that any voltage
regulator connected to pin INH is activated when the node
is reconnected to the battery. In pwon/listen-only mode the
pwon flag can be made available on pin ERR. The flag is
cleared when the transceiver enters normal mode.

AKE

UP FLAG

The wake-up flag is set when the transceiver detects a
local or a remote wake-up request. A local wake-up
request is detected when a logic state change on
pin WAKE remains stable for at least t

wake

. A remote

wake-up request is detected when the bus remains in
dominant state for at least t

BUS

. The wake-up flag can only

be set in standby mode, go-to-sleep command mode or
sleep mode. Setting of the flag is blocked during the
UV

NOM

flag waiting time. By setting the wake-up flag, the

NOM

flag and timers are cleared. The wake-up flag is

immediately available on pins ERR and RXD (provided
that V

I/O

is present). The flag is cleared at power-on, or

when the UV

NOM

flag is set or the transceiver enters

normal mode.

AKE

UP SOURCE FLAG

Wake-up source recognition is provided via the wake-up
source flag, which is set when the wake-up flag is set by a
local wake-up request via pin WAKE. The wake-up source
flag can only be set after the pwon flag is cleared.
In normal mode the wake-up source flag can be made
available on pin ERR. The flag is cleared at power-on or
when the transceiver leaves normal mode.

US FAILURE FLAG

The bus failure flag is set if the transceiver detects a bus
line short-circuit condition to V

BAT

, V

or GND during four

consecutive dominant-recessive cycles on pin TXD, when
trying to drive the bus lines dominant. In normal mode the
bus failure flag can be made available on pin ERR. The
flag is cleared when the transceiver re-enters normal
mode.

OCAL FAILURE FLAG

In normal mode or pwon/listen-only mode the transceiver
can recognize five different local failures, and will combine
them into one local failure flag. The five local failures are:
TXD dominant clamping, RXD recessive clamping, a
TXD-to-RXD short circuit, bus dominant clamping, and
over-temperature. Nature and detection of these local
failures is described in Section "Local failures".
In pwon/listen-only mode the local failure flag can be made
available on pin ERR. The flag is cleared when entering
normal mode or when RXD is dominant while TXD is
recessive, provided that all local failures are resolved.

Local failures

The TJA1041 can detect five different local failure
conditions. Any of these failures will set the local failure
flag, and in most cases the transmitter of the transceiver
will be disabled. The following sections give the details.

TXD

DOMINANT CLAMPING DETECTION

A permanent LOW level on pin TXD (due to a hardware or
software application failure) would drive the CAN bus into
a permanent dominant state, blocking all network
communication. The TXD dominant time-out function
prevents such a network lock-up by disabling the
transmitter of the transceiver if pin TXD remains at a LOW
level for longer than the TXD dominant time-out t

dom(TXD)

The t

dom(TXD)

timer defines the minimum possible bit rate

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

of 40 kbit/s. The transmitter remains disabled until the
local failure flag is cleared.

RXD

RECESSIVE CLAMPING DETECTION

An RXD pin clamped to HIGH level will prevent the
controller connected to this pin from recognizing a bus
dominant state. So the controller can start messages at
any time, which is likely to disturb all bus communication..
RXD recessive clamping detection prevents this effect by
disabling the transmitter when the bus is in dominant state
without RXD reflecting this. The transmitter remains
disabled until the local failure flag is cleared.

TXD-

-RXD

SHORT

CIRCUIT DETECTION

A short-circuit between pins RXD and TXD would keep the
bus in a permanent dominant state once the bus is driven
dominant, because the low-side driver of RXD is typically
stronger than the high-side driver of the controller
connected to TXD. The TXD-to-RXD short-circuit
detection prevents such a network lock-up by disabling the
transmitter. The transmitter remains disabled until the local
failure flag is cleared.

US DOMINANT CLAMPING DETECTION

A CAN bus short circuit (to V

BAT

, V

or GND) or a failure

in one of the other network nodes could result in a
differential voltage on the bus high enough to represent a
bus dominant state. Because a node will not start
transmission if the bus is dominant, the normal bus failure
detection will not detect this failure, but the bus dominant
clamping detection will. The local failure flag is set if the
dominant state on the bus persists for longer than t

dom(bus)

By checking this flag, the controller can determine if a
clamped bus is blocking network communication. There is
no need to disable the transmitter. Note that the local
failure flag does not retain a bus dominant clamping
failure, and is released as soon as the bus returns to
recessive state.

VER

TEMPERATURE DETECTION

To protect the output drivers of the transceiver against
overheating, the transmitter will be disabled if the virtual
junction temperature exceeds the shutdown junction
temperature T

j(sd)

. The transmitter remains disabled until

the local failure flag is cleared.

Recessive bus voltage stabilization

In recessive state the output impedance of transceivers is
relatively high. In a partially powered network (supply
voltage is off in some of the nodes) any deactivated
transceiver with a significant leakage current is likely to
load the recessive bus to ground. This will cause a
common-mode voltage step each time transmission starts,
resulting in increased ElectroMagnetic Emission (EME).
Using pin SPLIT of the TJA1041 in combination with split
termination (see Fig.5) will reduce this step effect. In
normal mode and pwon/listen-only mode pin SPLIT
provides a stabilized 0.5V

DC voltage. In standby mode,

go-to-sleep command mode and sleep mode pin SPLIT is
set floating.

I/O level adapter

The TJA1041 is equipped with a built-in I/O-level adapter.
By using the supply voltage of the controller (to be supplied
at pin V

I/O

) the level adapter ratio-metrically scales the

I/O-levels of the transceiver. For pins TXD, STB and EN
the digital input threshold level is adjusted, and for
pins RXD and ERR the HIGH-level output voltage is
adjusted. This allows the transceiver to be directly
interfaced with controllers on supply voltages between
2.8 V and 5.25 V, without the need for glue logic.

Pin WAKE

Pin WAKE of the TJA1041 allows local wake-up triggering
by a LOW to HIGH state change as well as a HIGH to LOW
state change. This gives maximum flexibility when
designing a local wake-up circuit. To keep current
consumption at a minimum, after a t

wake

delay the internal

bias voltage of pin WAKE will follow the logic state of this
pin. A HIGH level on pin WAKE is followed by an internal
pull-up to V

BAT

. A LOW level on pin WAKE is followed by

an internal pull-down towards GND.

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).

Notes

1. Equivalent to discharging a 100 pF capacitor via a 1.5 k

series resistor.

2. Equivalent to discharging a 200 pF capacitor via a 0.75

H series inductor and a 10

series resistor.

3. Junction temperature in accordance with IEC 60747-1. An alternative definition is: T

= T

amb

+ P

th(vj-amb)

, where

th(vj-amb)

is a fixed value. The rating for T

limits the allowable combinations of power dissipation (P) and ambient

temperature (T

amb

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

DC voltage on pin V

no time limit

0.3

operating range

4.75

5.25

I/O

DC voltage on pin V

I/O

no time limit

0.3

operating range

2.8

5.25

BAT

DC voltage on pin V

BAT

no time limit

0.3

+40

operating range

load dump

TXD

DC voltage on pin TXD

0.3

I/O

+ 0.3

RXD

DC voltage on pin RXD

0.3

I/O

+ 0.3

STB

DC voltage on pin STB

0.3

I/O

+ 0.3

DC voltage on pin EN

0.3

I/O

+ 0.3

ERR

DC voltage on pin ERR

0.3

I/O

+ 0.3

INH

DC voltage on pin INH

0.3

BAT

+ 0.3 V

WAKE

DC voltage on pin WAKE

0.3

BAT

+ 0.3 V

WAKE

DC current on pin WAKE

CANH

DC voltage on pin CANH

0 < V

< 5.25 V; no time limit

+40

CANL

DC voltage on pin CANL

0 < V

< 5.25 V; no time limit

+40

SPLIT

DC voltage on pin SPLIT

0 < V

< 5.25 V; no time limit

+40

trt

transient voltages on
pins CANH, CANL, SPLIT
and V

BAT

according to ISO 7637; see Fig.6

200

+200

esd

electrostatic discharge voltage

Human Body Model (HBM); note 1

pins CANH, CANL and SPLIT

all other pins

Machine Model (MM); note 2

200

+200

virtual junction temperature

note 3

+150

stg

storage temperature

+150

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient in SO14 package in free air

120

K/W

th(j-s)

thermal resistance from junction to substrate of bare die

in free air

K/W

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

CHARACTERISTICS
V

= 4.75 to 5.25 V; V

I/O

= 2.8 V to V

; V

BAT

= 5 to 27 V; R

= 60

;

40 to +150

C; unless specified

otherwise; all voltages are defined with respect to ground; positive currents flow into the device; note 1.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies (pins V

BAT

, V

and V

I/O

)

CC(sleep)

undervoltage detection

level for forced sleep mode

BAT

= 12 V (fail-safe)

2.75

3.3

4.5

I/O(sleep)

I/O

undervoltage detection

level for forced sleep mode

0.5

1.5

BAT(stb)

BAT

voltage level for fail-safe

fallback mode

= 5 V (fail-safe)

2.75

3.3

4.5

BAT(pwon)

BAT

voltage level for setting

pwon flag

= 0 V

2.5

3.3

4.1

input current

normal mode; V

TXD

= 0 V

(dominant)

normal or pwon/listen-only
mode; V

TXD

= V

I/O

(recessive)

standby or sleep mode

I/O

input current

normal mode; V

TXD

= 0 V

(dominant)

100

350

1000

normal or pwon/listen-only
mode; V

TXD

= V

I/O

(recessive)

200

standby or sleep mode

BAT

input current

normal or pwon/listen-only
mode

standby mode;
V

> 4.75 V; V

I/O

= 2.8 V;

INH

= V

WAKE

= V

BAT

= 12 V

sleep mode;
V

INH

= V

I/O

= 0 V;

WAKE

= V

BAT

= 12 V

Transmitter data input (pin TXD)

HIGH-level input voltage

0.7V

I/O

+ 0.3 V

LOW-level input voltage

0.3

0.3V

I/O

HIGH-level input current

normal or pwon/listen-only
mode; V

TXD

= V

I/O

LOW-level input current

normal or pwon/listen-only
mode; V

TXD

= 0.3V

I/O

250

500

input capacitance

not tested

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

Receiver data output (pin RXD)

HIGH-level output current

RXD

= V

I/O

0.4 V;

I/O

= V

LOW-level output current

RXD

= 0.4 V; V

TXD

= V

I/O

;

bus dominant

Standby and enable control inputs (pins STB and EN)

HIGH-level input voltage

0.7V

I/O

+ 0.3 V

LOW-level input voltage

0.3

0.3V

I/O

HIGH-level input current

STB

= V

= 0.7V

I/O

LOW-level input current

STB

= V

= 0 V

Error and power-on indication output (pin ERR)

HIGH-level output current

ERR

= V

I/O

0.4 V;

I/O

= V

LOW-level output current

ERR

= 0.4 V

0.1

0.2

0.35

Local wake-up input (pin WAKE)

HIGH-level input current

WAKE

= V

BAT

1.9 V

LOW-level input current

WAKE

= V

BAT

3.1 V

threshold voltage

STB

= 0 V

BAT

2.5 V

BAT

Inhibit output (pin INH)

HIGH-level voltage drop

INH

0.18 mA

0.05

0.2

0.8

leakage current

sleep mode

Bus lines (pins CANH and CANL)

O(dom)

dominant output voltage

TXD

= 0 V

pin CANH

3.6

4.25

pin CANL

0.5

1.4

1.75

O(dom)(m)

matching of dominant output
voltage
(V

CANH

CANL

)

0.1

+0.15

O(dif)(bus)

differential bus output voltage
(V

CANH

CANL

)

TXD

= 0 V (dominant);

< R

< 65

1.5

3.0

TXD

= V

I/O

(recessive); no

load

+50

O(reces)

recessive output voltage

normal or pwon/listen-only
mode; V

TXD

= V

I/O

; no load

0.5V

standby or sleep mode; no
load

0.1

+0.1

O(sc)

short-circuit output current

TXD

= 0 V (dominant)

pin CANH; V

CANH

= 0 V

pin CANL; V

CANL

= 40 V

O(reces)

recessive output current

27 V < V

CAN

< 32 V

2.5

+2.5

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

dif(th)

differential receiver threshold
voltage

normal or pwon/listen-only
mode (see Fig.7);

12 V < V

CANH

< 12 V;

12 V < V

CANL

< 12 V

0.5

0.7

0.9

standby or sleep mode;

12 V < V

CANH

< 12 V;

12 V < V

CANL

< 12 V

0.5

0.7

1.15

dif(hys)

differential receiver
hysteresis

normal or pwon/listen-only
mode (see Fig.7);

12 V < V

CANH

< 12 V;

12 V < V

CANL

< 12 V

100

input leakage current

= 0 V;

CANH

= V

CANL

= 5 V

100

170

250

i(cm)

common-mode input
resistance

i(cm)(m)

common-mode input
resistance matching

CANH

= V

CANL

i(dif)

differential input resistance

i(cm)

common-mode input
capacitance

TXD

= V

; not tested

i(dif)

differential input capacitance

TXD

= V

; not tested

sc(bus)

detectable short-circuit
resistance between bus lines
and V

BAT

, V

and GND

normal mode

Common-mode stabilization output (pin SPLIT)

output voltage

normal or pwon/listen-only
mode;

500

A < I

SPLIT

< 500

0.3V

0.5V

0.7V

leakage current

standby or sleep mode;

22 V < V

SPLIT

< 35 V

Timing characteristics; see Figs 8 and 9

d(TXD-BUSon)

delay TXD to bus active

normal mode

110

d(TXD-BUSoff)

delay TXD to bus inactive

normal mode

d(BUSon-RXD)

delay bus active to RXD

normal or pwon/listen-only
mode

115

d(BUSoff-RXD)

delay bus inactive to RXD

normal or pwon/listen-only
mode

100

160

PD(TXD-RXD)

propagation delay TXD to
RXD

STB

= 0 V

255

UV(VCC)

UV(VI/O)

undervoltage detection time
on V

and V

I/O

12.5

dom(TXD)

TXD dominant time-out

TXD

= 0 V

300

600

1000

dom(bus)

bus dominant time-out

dif

> 0.9 V

300

600

1000

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

Note

1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at

amb

= 125

C for dies on wafer level and in addition to this, 100% tested at T

amb

= 125

C for cased products, unless

specified otherwise. For bare dies, all parameters are only guaranteed with the reverse side of the die connected to
ground.

h(min)

minimum hold time of
go-to-sleep command

BUS

dominant time for wake-up
via bus

standby or sleep mode;
V

BAT

= 12 V

0.75

1.75

wake

minimum wake-up time after
receiving a falling or rising
edge

standby or sleep mode;
V

BAT

= 12 V

Thermal shutdown

j(sd)

shutdown junction
temperature

155

165

180

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

SPLIT

CAN bus wires

TJA1041

MICRO-

CONTROLLER

WAKE

VI/O

INH

VBAT

VCC

Port x, y, z

RXD

TXD

STB

GND

CANL

CANH

MGU173

TXD

RXD

ERR

5 V

BAT

3 V

Fig.4 Typical application with 3 V microcontroller.

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

handbook, full pagewidth

MGS377

td(TXD-BUSon)

tPD(TXD-RXD)

0.3VCC

0.7VCC

0.9 V

0.5 V

HIGH

LOW

CANH

TXD

RXD

CANL

Vi(dif)(bus)

(1)

HIGH

recessive
(BUS off)

dominant
(BUS on)

LOW

td(TXD-BUSoff)

td(BUSon-RXD)

td(BUSoff-RXD)

Fig.9 Timing diagram.

(1) V

i(dif)(bus)

= V

CANH

CANL

BONDING PAD LOCATIONS

Note

1. All x/y coordinates represent the position of the centre

of each pad (in

m) with respect to the left hand bottom

corner of the top aluminium layer.

SYMBOL

PAD

COORDINATES

(1)

TXD

664.25

3004.5

GND

75.75

3044.25

115.5

2573

RXD

115.5

1862.75

I/O

115.5

264.5

114

INH

667.75

ERR

1076.75

115.5

WAKE

1765

BAT

1765

792.5

SPLIT

1765

1442.25

CANL

1765

2115

CANH

1751

3002.5

STB

940.75

3004.5

MGU984

handbook, halfpage

TJA1041U

Fig.10 Bonding pad locations.

The reverse side of the bare die must be connected to ground.

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

PACKAGE OUTLINE

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

1.75

0.25
0.10

1.45
1.25

0.25

0.49
0.36

0.25
0.19

8.75
8.55

4.0
3.8

1.27

6.2
5.8

0.7
0.6

0.7
0.3

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0
0.4

SOT108-1

detail X

(A )

076E06

MS-012

pin 1 index

0.069

0.010
0.004

0.057
0.049

0.01

0.019
0.014

0.0100
0.0075

0.35
0.34

0.16
0.15

0.050

1.05

0.041

0.244
0.228

0.028
0.024

0.028
0.012

0.01

0.25

0.01

0.004

0.039
0.016

97-05-22
99-12-27

2.5

5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferably be kept:

below 220

C for all the BGA packages and packages

with a thickness

2.5mm and packages with a

thickness <2.5 mm and a volume

350 mm

so called

thick/large packages

below 235

C for packages with a thickness <2.5 mm

and a volume <350 mm

so called small/thin packages.

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. For more detailed information on the BGA packages refer to the

"(LF)BGA Application Note" (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.

4. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE

(1)

SOLDERING METHOD

WAVE

REFLOW

(2)

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS

not suitable

(3)

suitable

PLCC

(4)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(4)(5)

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

(6)

suitable

2003 Feb 13

Philips Semiconductors

Product specification

High speed CAN transceiver

TJA1041

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

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Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TJA1041

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TJA1041