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Электронный компонент: NB100LVEP17

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Semiconductor Components Industries, LLC, 2003
April, 2003 - Rev. 4
1
Publication Order Number:
NB100LVEP17/D
NB100LVEP17
2.5V / 3.3V / 5V ECL Quad
Differential Driver/Receiver
The NB100LVEP17 is a 4-bit differential line receiver. The design
incorporates two stages of gain, internal to the device, making it an
excellent choice for use in high bandwidth amplifier applications.
The V
BB
pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to V
BB
as a switching reference voltage.
V
BB
may also rebias AC coupled inputs. When used, decouple V
BB
and V
CC
via a 0.01
mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, V
BB
should be left open.
Inputs of unused gates can be left open and will not affect the
operation of the rest of the device.
Maximum Input Clock Frequency > 2.5 GHz Typical
Maximum Input Data Rate > 2.5 Gb/s Typical
250 ps Typical Propagation Delay
Low Profile QFN Package
PECL Mode Operating Range: V
CC
= 2.375 V to 5.5 V
with V
EE
= 0 V
NECL Mode Operating Range: V
CC
= 0 V
with V
EE
= -2.375 V to -5.5 V
Q Output Will Default LOW with Inputs Open or at V
EE
V
BB
Output
TSSOP-20
DT SUFFIX
CASE 948E
MARKING
DIAGRAMS*
*For additional information, see Application Note
AND8002/D
N100
LP17
ALYW
20
1
1
20
http://onsemi.com
A = Assembly Location
L
= Wafer Lot
Y = Year
W = Work Week
N100
LP17
ALYW
1
24
24 PIN QFN
MN SUFFIX
CASE 485L
24
1
Device
Package
Shipping
ORDERING INFORMATION
NB100LVEP17DT
TSSOP-20
75 Units/Rail
NB100LVEP17DTR2
2500/Tape & Reel
TSSOP-20
NB100LVEP17MN
QFN-24
92 Units/Rail
NB100LVEP17MNR2
3000/Tape & Reel
QFN-24
NB100LVEP17
http://onsemi.com
2
D1
D1
D2
Q0
Q1
Q1
V
EE
D0
Q0
D2
D0
D3
D3
V
CC
Figure 1. Logic Diagram
Q2
Q3
Q3
Q2
V
BB
R1
R1
R1
R1
R1
R1
R1
R1
R2
R2
R2
R2
PIN DESCRIPTION
Pin
Default
TSSOP
QFN
Name
I/O
Default
State
Description
1,20
13,18,21,
22,23
V
CC
-
-
Positive Supply Voltage. All V
CC
Pins Must be Externally Connected
to Power Supply to Guarantee Proper Operation.
11
10
V
EE
-
-
Negative Supply Voltage. All V
EE
Pins Must be Externally Con-
nected to Power Supply to Guarantee Proper Operation.
10
9
V
BB
-
-
ECL Reference Voltage Output.
2,4,6,8
1,3,5,7
D[0:3]
ECL Input
Low
Noninverted Differential Inputs [0:3]. Internal 75 k
W
to V
EE
.
3,5,7,9
2,4,6,8
D[0:3]
ECL Input
High
Inverted Differential Inputs [0:3]. Internal 75 k
W
to V
EE
and 37 k
W
to
V
CC
.
19,17,15,13
12,15,17,2
0
Q[0:3]
ECL Output
-
Noninverted Differential Outputs [0:3]. Typically Terminated with
50
W
to V
TT
= V
CC
- 2 V.
18,16,14,12
11,14,16,1
9
Q[0:3]
ECL Output
-
Inverted Differential Outputs [0:3]. Typically Terminated with 50
W
to
V
TT
= V
CC
- 2 V.
N/A
24
NC
-
-
No Connect. The NC Pin is Electrically Connected to the Die and
"MUST BE" Left Open.
N/A
-
EP
-
Exposed Pad. (Note 1)
1. All V
CC
and V
EE
pins must be externally connected to Power Supply to guarantee proper operation. The thermally conductive expose pad
on the package bottom (see case drawing) must be attached to a heat-sinking conduit.
NB100LVEP17
http://onsemi.com
3
D1
D1
D2
D3
17
18
16
15
14
13
12
4
3
5
6
7
8
9
Q0
11
10
Q1
Q1
Q2
Q2
Q3
Q3 V
EE
D0
19
20
2
1
V
CC
Q0
D0
D2
V
CC
D3 V
BB
Figure 2. TSSOP-20 Lead Pinout (Top View)
D1
D1
D2
D3
Q0
Q1
Q1
Q2
Q2
Q3
Q3
V
EE
D0
V
CC
Q0
D0
D2
V
CC
D3
V
BB
V
CC
V
CC
V
CC
NC
Figure 3. QFN-24 Lead Pinout (Top View)
NB100LVEP17
NB100LVEP17
18
12
4
3
5
6
7
8
9
11
10
2
1
17
16
15
14
13
19
24
23
22
20
21
Exposed Pad
(EP)
Table 1. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
(R1)
75 k
W
Internal Input Pullup Resistor
(R2)
37 k
W
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 150 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V-0 @ 0.125 in
Transistor Count
274 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
NB100LVEP17
http://onsemi.com
4
Table 2. MAXIMUM RATINGS
(Note 2)
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
V
CC
Positive Mode Power Supply
V
EE
= 0 V
6
V
V
EE
Negative Mode Power Supply
V
CC
= 0 V
-6
V
V
I
Positive Mode Input Voltage
Negative Mode Input Voltage
V
EE
= 0 V
V
CC
= 0 V
V
I
v
V
CC
V
I
w
V
EE
6
-6
V
V
I
out
Output Current
Continuous
Surge
50
100
mA
mA
I
BB
V
BB
Sink/Source
$
0.5
mA
TA
Operating Temperature Range
-40 to +85
C
T
stg
Storage Temperature Range
-65 to +150
C
q
JA
Thermal Resistance (Junction-to-Ambient)
JEDEC 51-3 (1S - Single Layer Test Board)
0 LFPM
500 LFPM
20 TSSOP
20 TSSOP
140
50
C/W
C/W
q
JA
Thermal Resistance (Junction-to-Ambient)
JEDEC 51-6 (2S2P Multilayer Test Board) with Filled Thermal
Vias
0 LFPM
500 LFPM
24 QFN
24 QFN
37
32
C/W
C/W
q
JC
Thermal Resistance (Junction-to-Case)
Standard Board
20 TSSOP
24 QFN
23 to 41
11
C/W
C/W
T
sol
Wave Solder
<2 to 3 sec @ 248
C
265
C
2. Maximum Ratings are those values beyond which device damage may occur.
Table 3. DC CHARACTERISTICS, PECL
V
CC
= 2.5 V; V
EE
= 0 V (Note 3)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
EE
Negative Power Supply Current
30
40
50
30
40
50
30
40
55
mA
V
OH
Output HIGH Voltage (Note 4)
1355
1480
1605
1355
1480
1605
1355
1480
1605
mV
V
OL
Output LOW Voltage (Note 4)
555
775
900
555
775
900
555
775
900
mV
V
IH
Input HIGH Voltage (Single-Ended) (Note 5)
1335
1620
1335
1620
1275
1620
mV
V
IL
Input LOW Voltage (Single-Ended) (Note 5)
555
875
555
875
555
875
mV
V
IHCMR
Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 6)
1.2
2.5
1.2
2.5
1.2
2.5
V
I
IH
Input HIGH Current (@ V
IH
)
150
150
150
m
A
I
IL
Input LOW Current (@ V
IL
)
D
D
0.5
-150
0.5
-150
0.5
-150
m
A
NOTE:
100LVEP circuits are designed to meet the DC specifications shown in the above table, after thermal equilibrium has been established.
The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
3. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary + 0.125 V to -1.3 V.
4. All loading with 50
W
to V
EE
= V
CC
- 2.0 V.
5. Do not use V
BB
at VCC < 3.0 V.
6. V
IHCMR
min varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differential
input signal.
NB100LVEP17
http://onsemi.com
5
Table 4. DC CHARACTERISTICS, PECL
V
CC
= 3.3 V; V
EE
= 0 V (Note 7)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
EE
Negative Power Supply Current
30
40
50
30
40
50
30
40
55
mA
V
OH
Output HIGH Voltage (Note 8)
2155
2280
2405
2155
2280
2405
2155
2280
2405
mV
V
OL
Output LOW Voltage (Note 8)
1355
1575
1700
1355
1575
1700
1355
1575
1700
mV
V
IH
Input HIGH Voltage (Single-Ended)
2135
2420
2135
2420
2135
2420
mV
V
IL
Input LOW Voltage (Single-Ended)
1355
1675
1355
1675
1355
1675
mV
V
BB
ECL Output Reference Voltage (Note 9)
1775
1875
1975
1775
1875
1975
1775
1875
1975
mV
V
IHCMR
Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 10)
1.2
3.3
1.2
3.3
1.2
3.3
V
I
IH
Input HIGH Current (@ V
IH
)
150
150
150
m
A
I
IL
Input LOW Current (@ V
IL
)
D
D
0.5
-150
0.5
-150
0.5
-150
m
A
NOTE:
100LVEP circuits are designed to meet the DC specifications shown in the above table, after thermal equilibrium has been established.
The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
7. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary + 0.925 V to -0.5 V.
8. All loading with 50
W
to V
CC
- 2.0 V.
9. Single ended input operation is limited V
CC
3.0 V in PECL mode.
10. V
IHCMR
min varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differential
input signal.
Table 5. DC CHARACTERISTICS, PECL
V
CC
= 5.0 V, V
EE
= 0 V (Note 11)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
EE
Negative Power Supply Current
30
40
50
30
40
55
30
40
55
mA
V
OH
Output HIGH Voltage (Note 12)
3855
3980
4105
3855
3980
4105
3855
3980
4105
mV
V
OL
Output LOW Voltage (Note 12)
3055
3275
3400
3055
3275
3400
3055
3275
3400
mV
V
IH
Input HIGH Voltage
3775
4120
3775
4120
3775
4120
mV
V
IL
Input LOW Voltage
3055
3375
3055
3375
3055
3375
mV
V
BB
ECL Output Voltage Reference
3475
3575
3675
3475
3575
3675
3475
3575
3675
mV
V
IHCMR
Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 13)
1.2
5.0
1.2
5.0
1.2
5.0
V
I
IH
Input HIGH Current (@ V
IH
)
150
150
150
m
A
I
IL
Input LOW Current (@ V
IL
)
D
D
0.5
-150
0.5
-150
0.5
-150
m
A
NOTE: 100LVEP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500 lfpm is maintained.
11. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary +2.0 V to -0.5 V.
12. All loading with 50 ohms to V
CC
-2.0 V.
13. V
IHCMR
min varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differential
input signal.
NB100LVEP17
http://onsemi.com
6
Table 6. DC CHARACTERISTICS, NECL
V
CC
= 0 V, V
EE
= -2.375 V to -3.8 V (Note 14)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
EE
Negative Power Supply Current
30
40
50
30
40
50
30
40
55
mA
V
OH
Output HIGH Voltage (Note 15)
-1 145
-1020
-895
-1 145
-1020
-895
-1 145
-1020
-895
mV
V
OL
Output LOW Voltage (Note 15)
-1945
-1725
-1600
-1945
-1725
-1600
-1945
-1725
-1600
mV
V
IH
Input HIGH Voltage (Single-Ended)
-1 165
-880
-1 165
-880
-1 165
-880
mV
V
IL
Input LOW Voltage (Single-Ended)
-1945
-1600
-1945
-1600
-1945
-1600
mV
V
BB
ECL Output Reference Voltage
(Note 16)
-1525
-1425
-1325
-1525
-1425
-1325
-1525
-1425
-1325
mV
V
IHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 17)
V
EE
+ 1.2
0.0
V
EE
+ 1.2
0.0
V
EE
+ 1.2
0.0
V
I
IH
Input HIGH Current (@ V
IH
)
150
150
150
m
A
I
IL
Input LOW Current (@ V
IL
)
D
D
0.5
-150
0.5
-150
0.5
-150
m
A
NOTE:
100LVEP circuits are designed to meet the DC specifications shown in the above table, after thermal equilibrium has been established.
The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
14. Input and output parameters vary 1:1 with V
CC
.
15. All loading with 50
W
to V
CC
- 2.0 V.
16. Single ended input operation is limited V
EE
-3.0V in NECL mode.
17. V
IHCMR
min varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differential
input signal.
Table 7. DC CHARACTERISTICS, NECL
V
CC
= 0 V, V
EE
= -3.8 V to -5.5 V (Note 18)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
EE
Negative Power Supply Current
30
40
50
30
40
55
30
40
55
mA
V
OH
Output HIGH Voltage (Note 19)
-1 145
-1020
-895
-1 145
-1020
-895
-1 145
-1020
-895
mV
V
OL
Output LOW Voltage (Note 19)
-1945
-1725
-1600
-1945
-1725
-1600
-1945
-1725
-1600
mV
V
IH
Input HIGH Voltage
-1 165
-880
-1 165
-880
-1 165
-880
mV
V
IL
Input LOW Voltage
-1945
-1625
-1945
-1625
-1945
-1625
mV
V
BB
ECL Output Reference Voltage
(Note 20)
-1525
-1425
-1325
-1525
-1425
-1325
-1525
-1425
-1325
mV
V
IHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 21)
V
EE
+1.2
0.0
V
EE
+1.2
0.0
V
EE
+1.2
0.0
V
I
IH
Input HIGH Current (@ V
IH
)
150
150
150
m
A
I
IL
Input LOW Current (@ V
IL
)
D
D
0.5
-150
0.5
-150
0.5
-150
m
A
NOTE: 100LVEP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500 lfpm is maintained.
18. Input and output parameters vary 1:1 with V
CC
.
19. All loading with 50
W
to V
CC
-2.0 V.
20. Single-Ended input operation is limited to V
EE
from -3.0 V to -5.5 V in NECL mode.
21. V
IHCMR
min varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differential
input signal.
NB100LVEP17
http://onsemi.com
7
Table 8. AC CHARACTERISTICS
V
CC
= 0 V; V
EE
= -2.375 V to -3.8 V or V
CC
= 2.375 V to 3.8 V; V
EE
= 0 V (Note 22)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
V
OUTPP
Output Voltage Amplitude
f
in
< 1 GHz
(See Figures 4, 5)
f
in
= 2 GHz
f
in
= 2.5 GHz
600
400
300
700
500
400
600
325
250
700
500
400
550
300
200
700
500
400
mV
t
PLH
,
t
PHL
Propagation Delay to Output Differential
D to Q, Q
200
250
325
200
250
325
225
300
350
ps
t
Skew
Pulse Skew (Note 23)
Within Device Skew (Note 25)
Device-to-Device Skew (Note 25)
5
5
25
25
25
100
5
5
25
25
25
100
5
5
25
25
25
100
ps
t
JITTER
RMS Random Clock Jitter (Note 26)
f
in
= 2.5 GHz
Peak-to Peak Data Dependent Jitter
f
in
= 1.5 Gb/s
(Note 27)
f
in
= 2.5 Gb/s
0.5
5
5
1
15
15
0.5
5
5
1
15
15
0.5
5
5
1
15
15
ps
V
INPP
Input Voltage Swing (Differential Configuration)
(Note 28)
150
800
1200
150
800
1200
150
800
1200
mV
t
r
t
f
Output Rise/Fall Times @ 50 MHz
Q, Q
(20% - 80%)
125
175
225
140
190
240
150
200
250
ps
22. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50
W
to V
CC
-2.0 V. Input edge rates 150 ps (20% - 80%).
23. Pulse Skew = |t
PLH
- t
PHL
|
24. Worst case difference between Q0 and Q1 outputs.
25. Skew is measured between outputs under identical transitions.
26. Additive RMS jitter with 50% Duty Cycle Clock Signal at 2.5 GHz.
27. Peak-to-Peak jitter with input NRZ data at PRBS 2
31
-1 at 2.5 Gb/s with all inputs active.
28. Input voltage swing is a single-ended measurement operating in differential mode, with minimum propagation change of 50 ps.
Table 9. AC CHARACTERISTICS
V
CC
= 0 V; V
EE
= -4.2 V to -5.5 V or V
CC
= 4.2 V to 5.5 V; V
EE
= 0 V (Note 29)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
V
OUTPP
Output Voltage Amplitude
f
in
< 1 GHz
(See Figure 6)
f
in
= 2 GHz
f
in
= 2.5 GHz
650
450
350
750
550
450
650
425
300
750
525
400
650
350
250
750
450
350
mV
t
PLH
,
t
PHL
Propagation Delay to Output Differential
D to Q, Q
200
250
325
200
250
325
225
300
350
ps
t
Skew
Pulse Skew (Note 30)
Within Device Skew (Note 31)
Device-to-Device Skew (Note 32)
5
5
25
25
25
100
5
5
25
25
25
100
5
5
25
25
25
100
ps
t
JITTER
RMS Random Clock Jitter
f
in
= 2.5 GHz
(Note 33)
Peak-to-Peak Data Dependent Jitter
f
in
=1.5 Gb/s
(Note 34)
f
in
= 2.5 Gb/s
0.5
5
10
1
15
20
0.5
5
10
1
15
20
0.5
5
15
1
15
50
ps
V
INPP
Input Voltage Swing (Differential Configuration)
(Note 35)
150
800
1200
150
800
1200
150
800
1200
mV
t
r
t
f
Output Rise/Fall Times @ 50 MHz
Q, Q
(20% - 80%)
125
175
225
140
190
240
150
200
250
ps
29. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50
W
to V
CC
-2.0 V. Input edge rates 150 ps (20% - 80%).
30. Pulse Skew |t
PLH
- t
PHL
|
31. Worst case difference between Q0 and Q1 outputs.
32. Skew is measured between outputs under identical transitions.
33. Additive RMS jitter with 50% Duty Cycle Clock Signal at 2.5 GHz.
34. Peak-to-Peak jitter with input NRZ data at PRBS 2
31
-1 at 2.5 Gb/s.
35. Input voltage swing is a single-ended measurement operating in differential mode, with minimum propagation change of 50 ps.
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Figure 4. Output Voltage Amplitude (V
OUTPP
) / RMS Jitter vs.
Input Frequency (f
in
) at V
CC
= 2.5 V, Ambient Temperature
INPUT FREQUENCY (GHz)
2.5
2.0
1.5
1.0
0.5
250
350
450
550
650
750
850
OUTPUT VOL
T
AGE AMPLITUDE
(mV)
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
RMS JITTER (ps)
Figure 5. Output Voltage Amplitude (V
OUTPP
) / RMS Jitter vs.
Input Frequency (f
in
) at V
CC
= 3.3 V, Ambient Temperature
INPUT FREQUENCY (GHz)
2.5
2.0
1.5
1.0
0.5
250
350
450
550
650
750
850
OUTPUT VOL
T
AGE AMPLITUDE (mV)
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
RMS JITTER (ps)
Figure 6. Output Voltage Amplitude (V
OUTPP
) / RMS Jitter vs.
Input Frequency (f
in
) at V
CC
= 5.0 V, Ambient Temperature
INPUT FREQUENCY (GHz)
2.5
2.0
1.5
1.0
0.5
250
350
450
550
650
750
850
OUTPUT VOL
T
AGE AMPLITUDE (mV)
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
RMS JITTER (ps)
Q AMP (mV)
RMS JITTER (ps)
Q AMP (mV)
RMS JITTER (ps)
Q AMP (mV)
RMS JITTER (ps)
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9
Figure 7. AC Reference Measurement
D
D
Q
Q
t
PHL
t
PLH
V
INPP
= V
IH
(D) - V
IL
(D)
V
OUTPP
= V
OH
(Q) - V
OL
(Q)
V TT = V CC - 2.0 V
Figure 8. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020 - Termination of ECL Logic Devices.)
W
Driver
Device
Receiver
Device
Q
D
50
W
50
V TT
Q
D
Resource Reference of Application Notes
AN1404
-
ECLinPS Circuit Performance at Non-Standard V
IH
Levels
AN1405
-
ECL Clock Distribution Techniques
AN1406
-
Designing with PECL (ECL at +5.0 V)
AN1504
-
Metastability and the ECLinPS Family
AN1568
-
Interfacing Between LVDS and ECL
AN1650
-
Using Wire-OR Ties in ECLinPS Designs
AN1672
-
The ECL Translator Guide
AND8001
-
Odd Number Counters Design
AND8002
-
Marking and Date Codes
AND8009
-
ECLinPS Plus Spice I/O Model Kit
AND8020
-
Termination of ECL Logic Devices
For an updated list of Application Notes, please see our website at http://onsemi.com.
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PACKAGE DIMENSIONS
TSSOP-20
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E-02
ISSUE A
DIM
A
MIN
MAX
MIN
MAX
INCHES
6.60
0.260
MILLIMETERS
B
4.30
4.50
0.169
0.177
C
1.20
0.047
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
H
0.27
0.37
0.011
0.015
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0 8 0 8
_
_
_
_
1
10
11
20
PIN 1
IDENT
A
B
-T-
0.100 (0.004)
C
D
G
H
SECTION N-N
K
K1
J J1
N
N
M
F
-W-
SEATING
PLANE
-V-
-U-
S
U
M
0.10 (0.004)
V
S
T
20X REF
K
L
L/2
2X
S
U
0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40
0.252
---
---
S
U
0.15 (0.006) T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. ICONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
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PACKAGE DIMENSIONS
QFN 24
MN SUFFIX
24 PIN QFN, 4x4
CASE 485L-01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
SEATING
PLANE
D
B
0.15 C
A2
A
A3
A
E
PIN 1
IDENTIFICATION
2X
0.15 C
2X
0.08 C
0.10 C
A1
C
DIM
MIN
MAX
MILLIMETERS
A
0.80
1.00
A1
0.00
0.05
A2
0.60
0.80
A3
0.20 REF
b
0.23
0.28
D
4.00 BSC
D2
2.70
2.90
E
4.00 BSC
E2
2.70
2.90
e
0.50 BSC
L
0.35
0.45
24X
L
D2
b
1
6
7
18
13
19
e
12
E2
e
24
0.10
B
0.05
A
C
C
REF
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