MSM5238
Semiconductor
1/12
GENERAL DESCRIPTION
The MSM5238 is a dot matrix LCD common driver LSI which is fabricated using low power
CMOS metal gate technology. The scanning signal in one matrix display frame can be divided
into up to 1/32 duty. This LSI consists of 32-bit shift register, 32-bit level shifter and 32-bit 4-level
driver.
This LSI can drive a variety of LCD panels because the bias voltage, which determines the LCD
driving voltage, can be optionally supplied from an external source.
FEATURES
Supply voltage
: 3 to 7V
LCD driving voltage
: 3 to 16V
Applicable LCD duty
: 1/32 to 1/64
(1/64 duty is available when MSM5238s are cascade-connected)
Bias voltage can be supplied externally.
Applicable segment driver: MSM5839B/C (40 outputs)
Package options:
44-pin plastic QFP (QFP44-P-910-0.80-K) (Product name: MSM5238GS-K)
44-pin plastic QFP (QFP44-P-910-0.80-L2) (Product name: MSM5238GS-L2)
44-pin plastic QFP (QFP44-P-910-0.80-2K) (Product name: MSM5238GS-2K)
Semiconductor
MSM5238
32-DOT LCD COMMON DRIVER
E2B0027-27-Y2
This version: Nov. 1997
Previous version: Mar. 1996
MSM5238
Semiconductor
2/12
BLOCK DIAGRAM
V
DD
V
EE
V
DD
V
SS
V
SS
DO
O
32
O
1
32-Bit 4-Level Driver
32-Bit Level Shifter
32-Bit Shift Register
V
DD
V
1
V
2
V
3
V
EE
(V
4
)
DF
DI
CP
MSM5238
Semiconductor
3/12
PIN CONFIGURATION (TOP VIEW)
22
21
20
19
18
17
16
15
14
13
12
1
2
3
4
5
6
7
8
9
10
11
33
34
35
36
37
38
39
40
41
42
43
44
O
1
DO
V
EE
(V
4
)
V
3
V
2
V
1
V
DD
V
SS
CP
DF
NC
DI
O
21
O
20
O
19
O
18
O
17
*(V
DD
)
O
16
O
15
O
14
O
13
O
12
O
2
O
3
O
4
O
5
O
6
O
7
O
8
O
9
O
10
O
11
32
31
30
29
28
27
26
25
24
23
O
32
O
31
O
30
O
29
O
28
O
27
O
26
O
25
O
24
O
23
O
22
44-Pin Plastic QFP (Type K)
NC: No connection
23
24
25
26
27
28
29
30
31
32
33
44
43
42
41
40
39
38
37
36
35
34
12
11
10
9
8
7
6
5
4
3
2
1
DI
O
11
O
10
O
9
O
8
O
7
O
6
O
5
O
4
O
3
O
2
O
1
O
22
O
23
O
24
O
25
O
26
O
27
O
28
O
29
O
30
O
31
O
32
NC
DF
CP
V
SS
V
DD
V
1
V
2
V
3
V
EE
(V
4
)
DO
13
14
15
16
17
18
19
20
21
22
O
12
O
13
O
14
O
15
O
16
*(V
DD
)
O
17
O
18
O
19
O
20
O
21
44-Pin Plastic QFP (Type L)
NC: No connection
(Top view)
* Pin 17 is an auxiliary pin. It must be connected to the power supply or left open.
Note : The figure for Type L shows the configuration viewed from the reverse side of the package.
Pay attention to the difference in pin arrangement.
MSM5238
Semiconductor
4/12
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
* V
DD
V
1
V
2
V
3
V
EE
(V
4
)
Parameter
Symbol
Condition
Rating
Unit
Supply Voltage
V
DD
Ta = 25C
0.3 to +7
V
Supply Voltage
V
LCD
Ta = 25C, V
DD
V
EE
0 to 16.5
V
Input Voltage
V
I
Ta = 25C
0.3 to V
DD
V
Storage Temperature
T
STG
--
55 to +150
C
Parameter
Symbol
Condition
Range
Unit
Supply Voltage
V
DD
--
3 to 7
V
Supply Voltage
V
LCD
V
DD
V
EE
*
3 to 16
V
Operating Temperature
T
op
--
40 to +85
C
Fan-Out
N
MOS load
5
--
MSM5238
Semiconductor
5/12
ELECTRICAL CHARACTERISTICS
DC Characteristics
*1 V
IH1
and V
IL1
are input pins for DI and DF, while V
IH2
and V
IL2
are input pins for CP.
*2 V
OH
and V
OL
are output pins for DO.
Unit
V
DD
(V)
V
SS
(V)
V
EE
(V)
Symbol
Parameter
"H" Input Voltage
*1
5
7
0
0
0 to
9
0 to
7
--
--
--
--
3.6/4.2
5.2/6.0
--
--
--
--
V
"L" Input Voltage
*1
5
7
0
0
0 to
9
0 to
7
0.8/0.4
1.1/0.5
--
--
V
Input Current
I
IH
I
IL
7
0
7
0
V
I
= 7V
7
V
I
= 0V
7
--
--
--
--
1
1
mA
"H" Output Voltage
*2
5
0
7
0
0 to
9
0 to
7
I
O
= 40mA
I
O
= 56mA
4.2
5.8
--
--
--
--
V
"L" Output Voltage
*2
5
0
7
0
0 to
9
0 to
7
I
O
= 0.2mA
I
O
= 0.3mA
0.4
0.4
--
--
--
--
V
R
ON
(V
1
, V
EE
(V
4
))
5
7
0
0
0
0
0
5
0
7
--
500
2000
--
250
1000
--
350
1400
--
200
800
W
V
O
: DRV output
V
O
V
1
= 0.25V
V
1
= V
EE
to (V
DD
0.25V)
V
O
V
4
= 0.25V
V
4
(V
EE
): 0V MAX
R
ON
(V
2
, V
3
)
5
7
0
0
0
0
0
5
0
7
--
800
3200
--
450
1800
--
550
2200
--
350
1400
W
V
N
=
V
2
or V
3
V
O
= DRV output
V
O
V
N
= 0.25V
V
N
= V
EE
to (V
DD
0.25V)
ON Resistance
OFF Leakage Current
I
OFF
5
0
7
0
9
7
--
--
--
--
5
5
mA
--
--
Supply Current
I
DD
5
0
7
0
9
7
--
--
--
--
0.5
1.0
mA
--
--
Input Capacitance
C
I
pF
--
--
5
--
--
--
Max.
Typ.
Min.
V
IH1
/V
IH2
V
IL1
/V
IL2
V
OH
V
OL
Condition
--
--
MSM5238
Semiconductor
6/12
Switching Characteristics
t
w
(cp)
50%
50%
t
f
(cp)
10%
t
r
(cp)
90%
90%
50%
10%
CP
t
SETUP
t
HOLD
DI
50%
50%
Min.
Data Setup Time (DATAIN CP)
Parameter
Symbol
V
DD
(V)
Typ.
Max.
Unit
Clock Frequency
f
(cp)
Clock Pulse Width
t
w (cp)
t
SETUP
Data Hold Time (DATAIN CP)
t
HOLD
Clock Pulse Rise/Fall Time
t
r (cp)
t
f (cp)
5
7
5
7
5
7
5
7
5
7
--
kHz
ns
ns
ns
ms
Condition
--
--
400
--
--
--
550
--
400
--
--
--
300
--
--
--
100
--
--
--
50
--
--
--
800
--
--
--
500
--
--
--
--
--
0.5
--
--
--
0.1
MSM5238
Semiconductor
7/12
FUNCTIONAL DESCRIPTION
Pin Functional Description
DI
Shift register data input pin which inputs the data on scanning lines in synchronization with
a clock (positive logic). This LSI can optionally divide the scanning signal up to 1/32 duty LCD
panel because it consists of the 32-bit shift register.
CP
Clock pulse input pin for the 32-bit shift register. The data is shifted to the 32-bit shift register
at the falling edge of the clock pulse. A data set up time (t
SETUP
) and data hold time (t
HOLD
) are
required between DI and CP. (Refer to Switching Characteristics.) A Schmitt circuit is included
in the CP input circuit.
DF
Synchronous signal input pin for alternate signal for LCD driving.
V
DD
, V
SS
V
DD
is a power supply pin, which is normally from 3.0V to 7.0V. V
SS
is a ground pin, which
is 0V.
O
1
- O
32
Display data output pins which correspond to each data bit in the latch. One of V
1
, V
2
, V
3
and
V
EE
(V
4
) is selected as a display driving voltage source based on the combination of latched
data level and DF signal. Refer to the Truth Table. O
1
- O
32
are connected to the common side
of the LCD panel.
MSM5238
Semiconductor
8/12
V
1
, V
2
, V
3
, V
EE
(V
4
)
Bias supply voltage pins to drive the LCD. Use an external bias voltage supply for driving the
LCD.
DO
Shift register output pin. The data which was input from DI is output from DO with 32 bits
delay, synchronized with the clock pulse. The MSM5238 is used at 1/32 duty and also at 1/64
duty through cascade connection. Refer to Figure 1 below.
MSM5238
O
1
V
DD
V
1
V
2
V
3
V
EE
(V
4
) V
ss
CP
DF
DI
O
32
DO
MSM5238
O
1
V
DD
V
1
V
2
V
3
V
EE
(V
4
) V
ss
CP
DF
DI
O
32
DO
Frame
signal
Clock
DF
Bias Circuit
Figure 1
+5V
V
GND
32
32
64 n
LCD panel
Truth Table
Latched data
L
H
DF
L
H
L
H
LCD driver output
V
2
V
4
V
3
V
1
MSM5238
Semiconductor
9/12
NOTES ON USE
Note the following when turning power on and off:
The LCD drivers of this IC require a high voltage. For this reason, if a high voltage is applied to
the LCD drivers with the logic power supply floating, excess current flows. This may damage
the IC. Be sure to carry out the following power-on and power-off sequences:
When turning power on:
First V
DD
ON, next V
EE
(V
4
), V
3
, V
2
, V
1
ON. Or both ON at the same time.
When turning power off:
First V
EE
(V
4
), V
3
, V
2
, V
1
OFF, next V
DD
OFF. Or both OFF at the same time.
MSM5238
Semiconductor
10/12
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
QFP44-P-910-0.80-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.35 TYP.
Mirror finish
MSM5238
Semiconductor
11/12
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
QFP44-P-910-0.80-L2
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.35 TYP.
Spherical surface
MSM5238
Semiconductor
12/12
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.41 TYP.
QFP44-P-910-0.80-2K
Mirror finish
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