ChipFind - документация

Электронный компонент: MC33390

Скачать:  PDF   ZIP

Document Outline

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 2003
33390 Simplified Application Diagram
Document order number: MC33390/D
Rev 4.0, 2/2003
33390
Class B Serial Transceiver
The 33390 is a serial transceiver designed to provide bi-directional half-
duplex communication meeting the automotive SAE Standard J-1850 Class B
Data Communication Network Interface specification. It is designed to
interface directly to on-board vehicle microcontrollers and serves to transmit
and receive data on a single-wire bus at data rates of 10.4 kbps using Variable
Pulse Width Modulation (VPWM). The 33390 operates directly from a vehicle's
12 V battery system and functions in a logic fashion as an I/O interface
between the microcontroller's 5.0 V CMOS logic level swings and the required
0 V to 7.0 V waveshaped signal swings of the bus. The bus output driver is
short circuit current limited.
Features
Designed for SAE J-1850 Class B Data Rates
Full Operational Bus Dynamics Over a Supply Voltage of 9.0 to 16 V
Ambient Operating Temperature of -40
C to 125C
Interfaces Directly to Standard 5.0 V CMOS Microcontroller
BUS Pin Protected Against Shorts to Battery and Ground
Thermal Shutdown with Hysteresis
Voltage Waveshaping of Bus Output Driver
40 V Max V
BAT
Capability
J-1850 SERIAL TRANSCEIVER
ORDERING INFORMATION
Device
Temperature
Range (T
A
)
Package
MC33390D/DR2
-40 to 125C
8 SOICN
D SUFFIX
PLASTIC PACKAGE
CASE 751
(8-LEAD SOICN)
33390
BUS
V
BAT
SLEEP
Tx
Rx
4X/LOOP
GND
LOAD
Primary
Node
MCU
V
BAT
Secondary
Nodes
10.6 k
470 pF
47 H
F
r
e
e
s
c
a
l
e

S
e
m
i
c
o
n
d
u
c
t
o
r
,

I














































Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
.
.
.
33390
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
2
Figure 1. 33390 Simplified Block Diagram
33390
Voltage
Regulator
Bus
Driver
Thermal
Shutdown
Waveshaping
Filter
BUS
4.5 V
Reference
V
BAT
SLEEP
Tx
Rx
4X/LOOP
4X Enable
Loopback
Digital Output
Driver
Loss of Ground
Protection
GND
LOAD
Note This device contains approximately 400 active transistors and 250 gates.
F
r
e
e
s
c
a
l
e

S
e
m
i
c
o
n
d
u
c
t
o
r
,

I














































Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
.
.
.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33390
3
PIN FUNCTION DESCRIPTION
Pin
Pin Name
Description
1
SLEEP
Enables the transceiver when Logic 1 and disables the transceiver when Logic 0.
2
GND
Device ground pin.
3
LOAD
Accommodates an external pull-down resistor to ground to provide loss of ground protection.
4
BUS
Waveshaped SAE Standard J-1850 Class B transmitter output and receiver input.
5
V
BAT
Provides device operating input power.
6
4X/LOOP
Tristate input mode control; Logic 0 = normal waveshaping, Logic 1 = waveshaping disabled for 4X
transmitting, high impedance = loopback mode.
7
Tx
Serial data input (DI) from the microcontroller to be transmitted onto Bus.
8
Rx
Bus received serial data output (DO) sent to the microcontroller.
2
3
4
8
7
6
5
11
2
4
3
8
7
5
6
Rx
Tx
V
BAT
4X/LOOP
SLEEP
GND
LOAD
BUS
F
r
e
e
s
c
a
l
e

S
e
m
i
c
o
n
d
u
c
t
o
r
,

I














































Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
.
.
.
33390
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
4
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
V
BAT
DC Supply Voltage (Note 1)
V
BAT
-0.3 to 40
V
Input I/O Terminals (Note 2)
V
I/O(CPU)
-0.3 to 7.0
V
BUS and LOAD Outputs
V
BUS
-2.0 to 16
V
ESD Voltage
Human Body Model (Note 3)
Machine Model (Note 4)
V
ESD1
V
ESD2
2000
200
V
Storage Temperature
T
STG
-65 to 150
C
Operating Ambient Temperature
T
A
-40 to 125
C
Operating Junction Temperature
T
J
-40 to 150
C
Soldering Temperature (for 10 seconds)
T
SOLDER
260
C
Thermal Resistance (Junction-to-Ambient)
R
J-A
180
C/W
Notes
1.
An external series diode must be used to provide reverse battery protection of the device.
2.
SLEEP
, TX, RX, and 4X/LOOP are normally connected to a microcontroller.
3.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
=100 pF, R
ZAP
=1500
).
4.
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
=200 pF, R
ZAP
=0
).
F
r
e
e
s
c
a
l
e

S
e
m
i
c
o
n
d
u
c
t
o
r
,

I














































Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
.
.
.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33390
5
STATIC ELECTRICAL CHARACTERISTICS
Characteristics noted under conditions of 7.0 V
V
BAT
16 V, -40C T
A
125C,
SLEEP
= 5.0 V unless otherwise noted. Typical
values reflect the parameter's approximate midpoint average value with V
BAT
= 13 V, T
A
= 25C. All positive currents are into the
pin. All negative currents are out of the pin.
Characteristic
Symbol
Min
Typ
Max
Unit
POWER CONSUMPTION
Operational Battery Current (RMS with Tx = 7.812 kHz Square Wave)
BUS Load = 1380
to GND, 3.6 nF to GND
BUS Load = 257
to GND, 20.2 nF to GND
I
BAT(OP1)
I
BAT(OP2)

3.0
22.4
11.5
32
mA
Battery Bus Low Input Current
After SLEEP Toggle Low to High; Prior to Tx Toggling
After Tx Toggle High to Low
I
BAT(BUS L1)
I
BAT(BUS L2)

1.1
6.4
3.0
8.5
mA
Sleep State Battery Current
V
SLEEP
= 0 V
I
BAT(SLEEP)
38.2
65
A
BUS
BUS Input Receiver Threshold (Note 5)
Threshold High (Bus Increasing until Rx
3.0 V)
Threshold Low (Bus Decreasing until Rx
3.0 V)
Threshold in Sleep State (SLEEP = 0 V)
Hysteresis (V
BUS(IH)
- V
BUS(IL)
, SLEEP = 0 V)
V
BUS(IH)
V
BUS(IL)
BUS
TH(SLEEP)
V
BUS(HYST)
4.25
2.4
0.1
3.9
3.7
3.0
0.2
3.5
3.4
0.6
V
BUS-Out Voltage (257
R
BUS(L)
to GND
1380 )
8.2 V
V
BAT
16 V, Tx = 5.0 V
4.25 V
V
BAT
8.2 V, Tx = 5.0 V
Tx = 0 V
V
BUS(OUT1)
V
BUS(OUT2)
V
BUS(OUT3)
6.25
V
BAT
- 1.6
6.9
0.27
8.0
V
BAT
0.7
V
BUS Short Circuit Output Current
Tx = 5.0 V, -2.0 V
V
BUS
4.8 V
I
BUS(SHORT)
60
129
170
mA
BUS Leakage Current
-2.0 V
V
BUS
0 V
0 V
V
BUS
V
BAT
I
BUS(LEAK1)
I
BUS(LEAK2)
-500
-55
189
500
A
BUS Thermal Shutdown (Note 6) (Tx = 5.0 V, I
BUS
= -0.1 mA)
Increase Temperature until V
BUS
2.5 V
T
BUS(LIM)
150
170
190
C
BUS Thermal Shutdown Hysteresis (Note 7)
T
BUS(LIM)
- T
BUS(REEN)
T
BUS(LIMHYS)
10
12
15
C
BUS and LOAD Current with Loss of V
BAT
or GND (I
BAT
= 0 A) (see Figure 2)
-18 V
V
BUS
9.0 V
-18 V
V
LOAD
9.0 V
I
BUS (LOSS)
I
LOAD (LOSS)

0.00
0.00
0.1
0.1
mA
Notes
5.
Typical threshold value is the approximate actual occurring switch point value with V
BAT
= 13 V, T
A
= 25C.
6.
Device characterized but not production tested for thermal shutdown.
7.
Device characterized but not production tested for thermal shutdown hysteresis.
F
r
e
e
s
c
a
l
e

S
e
m
i
c
o
n
d
u
c
t
o
r
,

I














































Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
.
.
.