Device
Operating
Temperature Range
Package
AM26LS30
SEMICONDUCTOR
TECHNICAL DATA
DUAL DIFFERENTIAL/
QUAD SINGLEENDED
LINE DRIVERS
ORDERING INFORMATION
AM26LS30PC
MC26LS30D
TA = 40
to +85
C
Plastic DIP
SO16
PIN CONNECTIONS
Order this document by AM26LS30/D
PC SUFFIX
PLASTIC PACKAGE
CASE 648
D SUFFIX
PLASTIC PACKAGE
CASE 751B
(SO16)
FN SUFFIX
PLASTIC PACKAGE
CASE 775
AM26LS30FN
PLCC20
In B/En AB
Mode
NC
Gnd
In C/En CD
Out B
SRB
NC
SRC
Out C
Input
A
V CC
NC
SRA
Out
A
In D
NC
SRD
Out D
V
EE
4
5
6
7
8
18
17
16
15
14
3
2
1
20 19
9
10 11 12 13
16
1
4
2
5
6
7
8
9
3
10
11
12
13
14
15
Input C/
Enable CD
(Top View)
SRA
Output A
Output B
Input D
VEE
SRD
Output D
Output C
SRC
SRB
Gnd
VCC
Input A
Mode
Input B/
Enable AB
1
MOTOROLA ANALOG IC DEVICE DATA
Advance Information
Dual Differential (EIA-422-A)/
Quad Single-Ended
(EIA-423-A) Line Drivers
The AM26LS30 is a low power Schottky set of line drivers which can be
configured as two differential drivers which comply with EIA422A
standards, or as four singleended drivers which comply with EIA423A
standards. A mode select pin and appropriate choice of power supplies
determine the mode. Each driver can source and sink currents in excess of
50 mA.
In the differential mode (EIA422A), the drivers can be used up to
10 Mbaud. A disable pin for each driver permits setting the outputs into a
high impedance mode within a
10 V common mode range.
In the singleended mode (EIA423A), each driver has a slew rate
control pin which permits setting the slew rate of the output signal so as to
comply with EIA423A and FCC requirements and to reduce crosstalk.
When operated from symmetrical supplies (
5.0 V), the outputs exhibit zero
imbalance.
The AM26LS30 is available in a 16pin plastic DIP and surface mount
package. Operating temperature range is 40
to +85
C.
Operates as Two Differential EIA422A Drivers, or Four SingleEnded
EIA423A Drivers
High Impedance Outputs in Differential Mode
Short Circuit Current Limit In Both Source and Sink Modes
10 V Common Mode Range on High Impedance Outputs
15 V Range on Inputs
Low Current PNP Inputs Compatible with TTL, CMOS, and MOS
Outputs
Individual Output Slew Rate Control in SingleEnded Mode
Replacement for the AMD AM25LS30 and National Semiconductor
DS3691
Representative Block Diagrams
SingleEnded Mode
EIA423A
Differential Mode
EIA422A
Enable CD
Enable AB
Out D
Out C
Out B
Out A
VCC 1
VEE 8
Input D
Input A
Input A
SRA
Out A
Gnd 5
Mode 4
SRB
SRC
Out D
SRD
Out C
Out B
Input B
Input C
Input D
Motorola, Inc. 1995
This document contains information on a new product. Specifications and information herein are
subject to change without notice.
AM26LS30
2
MOTOROLA ANALOG IC DEVICE DATA
MAXIMUM OPERATING CONDITIONS
(Pin numbers refer to DIP and SO16
packages only.)
Rating
Symbol
Value
Unit
Power Supply Voltage
VCC
VEE
0.5, +7.0
7.0, +0.5
Vdc
Input Voltage (All Inputs)
Vin
0.5, +20
Vdc
Applied Output Voltage when in High Impedance Mode
(VCC = 5.0 V, Pin 4 = Logic 0, Pins 3, 6 = Logic 1)
Vza
15
Vdc
Output Voltage with VCC, VEE = 0 V
Vzb
15
Output Current
IO
Self limiting
Junction Temperature
TJ
65, +150
C
Devices should not be operated at these limits. The "Recommended Operating Conditions" table provides
conditions for actual device operation.
RECOMMENDED OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Power Supply Voltage (Differential Mode)
VCC
VEE
+4.75
0.5
5.0
0
+5.25
+0.3
Vdc
Power Supply Voltage (SingleEnded Mode)
VCC
VEE
+4.75
5.25
+5.0
5.0
+5.25
4.75
Input Voltage (All Inputs)
Vin
0
+15
Vdc
Applied Output Voltage (when in High Impedance Mode)
Vza
10
+10
Applied Output Voltage, VCC = 0
Vzb
10
+10
Output Current
IO
65
+65
mA
Operating Ambient Temperature (See text)
TA
40
+85
C
All limits are not necessarily functional concurrently.
ELECTRICAL CHARACTERISTICS
(EIA422A differential mode, Pin 4
p
0.8 V, 40
C
t
TA
t
85
C, 4.75 V
p
VCC
p
5.25 V,
VEE = Gnd, unless otherwise noted. Pin numbers refer to DIP and SO16 packages only.)
Characteristic
Symbol
Min
Typ
Max
Unit
Output Voltage (see Figure 1)
Differential, RL =
, VCC = 5.25 V
Differential, RL = 100
, VCC = 4.75 V
Change in Differential Voltage, RL = 100
(Note 4)
Offset Voltage, RL = 100
Change in Offset Voltage*, RL = 100
VOD1
VOD2
VOD2
VOS
VOS
2.0
4.2
2.6
10
2.5
10
6.0
400
3.0
400
Vdc
Vdc
mVdc
Vdc
mVdc
Output Current (each output)
Power Off Leakage, VCC = 0, 10 V
p
VO
p
+10 V
High Impedance Mode, VCC = 5.25 V, 10 V
p
VO
p
+10 V
Short Circuit Current (Note 2)
High Output Shorted to Pin 5 (TA = 25
C)
High Output Shorted to Pin 5 (40
C
t
TA
t
+85
C)
Low Output Shorted to +6.0 V (TA = 25
C)
Low Output Shorted to +6.0 V (40
C
t
TA
t
+85
C)
IOLK
IOZ
ISC
ISC
ISC+
ISC+
100
100
150
150
60
50
0
0
95
75
+100
+100
60
50
150
150
A
mA
Inputs
Low Level Voltage
High Level Voltage
Current @ Vin = 2.4 V
Current @ Vin = 15 V
Current @ Vin = 0.4 V
Current, 0
p
Vin
p
15 V, VCC = 0
Clamp Voltage (Iin = 12 mA)
VIL
VIH
IIH
IIHH
IIL
IIX
VIK
2.0
200
1.5
0
0
8.0
0
0.8
40
100
Vdc
Vdc
A
Vdc
Power Supply Current (VCC = +5.25 V, Outputs Open)
(0
p
Enable
p
VCC)
ICC
16
30
mA
NOTES: 1. All voltages measured with respect to Pin 5.
2. Only one output shorted at a time, for not more than 1 second.
3. Typical values established at +25
C, VCC = +5.0 V, VEE = 5.0 V.
4. Vin switched from 0.8 to 2.0 V.
5. Imbalance is the difference between
VO2
with Vin
t
0.8 V and
VO2
with Vin
u
2.0 V.
AM26LS30
3
MOTOROLA ANALOG IC DEVICE DATA
TIMING CHARACTERISTICS
(EIA422A differential mode, Pin 4
p
0.8 V, TA = 25
C, VCC = 5.0 V, VEE = Gnd, (Notes 1 and 3)
unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
Differential Output Rise Time (Figure 3)
tr
70
200
ns
Differential Output Fall Time (Figure 3)
tf
70
200
ns
Propagation Delay Time Input to Differential Output
Input Low to High (Figure 3)
Input High to Low (Figure 3)
tPDH
tPDL
90
90
200
200
ns
Skew Timing (Figure 3)
tPDH to tPDL
for Each Driver
Max to Min tPDH Within a Package
Max to Min tPDL Within a Package
tSK1
tSK2
tSK3
9.0
2.0
2.0
ns
Enable Timing (Figure 4)
Enable to Active High Differential Output
Enable to Active Low Differential Output
Enable to 3State Output From Active High
Enable to 3State Output From Active Low
tPZH
tPZL
tPHZ
tPLZ
150
190
80
110
300
350
350
300
ns
ELECTRICAL CHARACTERISTICS
(EIA423A singleended mode, Pin 4
q
2.0 V, 40
C
t
TA
t
85
C, 4.75 V
p
VCC
,
|VEE
p
5.25 V, (Notes 1 and 3) unless otherwise noted).
Characteristic
Symbol
Min
Typ
Max
Unit
Output Voltage (VCC =
VEE
= 4.75 V)
SingleEnded Voltage, RL =
(Figure 2)
SingleEnded Voltage, RL = 450
, (Figure 2)
Voltage Imbalance (Note 5), RL = 450
VO1
VO2
VO2
4.0
3.6
4.2
3.95
0.05
6.0
6.0
0.4
Vdc
Slew Control Current (Pins 16, 13, 12, 9)
ISLEW
120
A
Output Current (Each Output)
Power Off Leakage, VCC = VEE = 0, 6.0 V
p
VO
p
+6.0 V
Short Circuit Current (Output Short to Ground, Note 2)
Vin
p
0.8 V (TA = 25
C)
Vin
p
0.8 V (40
C
t
TA
t
+85
C)
Vin
w
2.0 V (TA = 25
C)
Vin
w
2.0 V (40
C
t
TA
t
+85
C)
IOLK
ISC+
ISC+
ISC
ISC
100
60
50
150
150
0
80
95
+100
150
150
60
50
A
mA
Inputs
Low Level Voltage
High Level Voltage
Current @ Vin = 2.4 V
Current @ Vin = 15 V
Current @ Vin = 0.4 V
Current, 0
p
Vin
p
15 V, VCC = 0
Clamp Voltage (Iin = 12 mA)
VIL
VIH
IIH
IIHH
IIL
IIX
VIK
2.0
200
1.5
0
0
8.0
0
0.8
40
100
Vdc
Vdc
A
Vdc
Power Supply Current (Outputs Open)
VCC = +5.25 V, VEE = 5.25 V, Vin = 0.4 V
ICC
IEE
22
17
8.0
30
mA
TIMING CHARACTERISTICS
(EIA423A singleended mode, Pin 4
q
2.0 V, TA = 25
C, VCC = 5.0 V, VEE = 5.0 V, (Notes 1 and 3)
unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
Output Timing (Figure 5)
Output Rise Time, CC = 0
Output Fall Time, CC = 0
Output Rise Time, CC = 50 pF
Output Fall Time, CC = 50 pF
tr
tf
tr
tf
65
65
3.0
3.0
300
300
ns
s
Rise Time Coefficient (Figure 16)
Crt
0.06
s/pF
Propagation Delay Time, Input to Single Ended Output (Figure 5)
Input Low to High, CC = 0
Input High to Low, CC = 0
tPDH
tPDL
100
100
300
300
ns
Skew Timing, CC = 0 (Figure 5)
tPDH to tPDL
for Each Driver
Max to Min tPDH Within a Package
Max to Min tPDL Within a Package
tSK4
tSK5
tSK6
15
2.0
5.0
ns
AM26LS30
4
MOTOROLA ANALOG IC DEVICE DATA
Table 1
Inputs
Outputs
Operation
VCC
VEE
Mode
A
B
C
D
A
B
C
D
Differential
(EIA422A)
+5.0
Gnd
0
0
0
0
0
0
0
1
X
1
0
1
0
0
1
0
0
0
0
0
0
0
0
1
0
1
1
0
1
X
0
1
Z
1
0
1
1
0
Z
0
1
0
1
0
0
1
0
Z
0
1
1
0
1
Z
(EIA422A)
0
0
0
0
0
1
X
1
0
1
0
1
0
0
0
0
0
0
0
1
1
1
0
1
X
1
Z
1
0
1
0
Z
0
1
0
0
0
1
0
Z
1
1
0
1
Z
0
0
0
0
X
1
0
1
1
0
0
0
0
0
0
1
1
0
1
X
Z
1
0
1
Z
0
1
0
0
1
0
Z
1
0
1
Z
0
0
0
1
0
1
0
0
0
0
0
1
0
1
X
1
0
1
0
1
0
1
0
Z
0
1
Z
0
0
0
1
0
0
0
1
1
X
0
1
1
0
0
Z
1
Z
0
1
0
1
X
1
0
Z
Z
SingleEnded
(EIA423A)
+5.0
5.0
1
1
1
1
1
0
1
0
0
0
0
0
1
0
0
0
0
0
1
0
0
0
0
0
1
0
1
0
0
0
0
0
1
0
0
0
0
0
1
0
0
0
0
0
1
(EIA423A)
1
1
1
1
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
1
1
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
1
1
0
0
0
0
1
0
0
1
0
0
0
0
1
0
0
1
1
0
0
0
1
0
0
0
1
X
0
X
X
X
X
X
X
Z
Z
Z
Z
X = Don't Care
Z = High Impedance (Off)
Figure 1. Differential Output Test
Figure 2. SingleEnded Output Test
VEE
Mode = 0
VOS
RL
RL/2
RL/2
CL
Vin
(0.8 or 2.0 V)
VCC
VO
VCC
VOD2
Mode = 1
Vin
(0.8 or 2.0 V)
Figure 3. Differential Mode Rise/Fall Time and Data Propagation Delay
NOTES: 1. S.G. set to: f
p
1.0 MHz; duty cycle = 50%; tr, tf,
p
10 ns.
2. tSK1 =
tPDHtPDL
for each driver.
3. tSK2 computed by subtracting the shortest tPDH from the longest tPDH of the 2 drivers within a package.
4. tSK3 computed by subtracting the shortest tPDL from the longest tPDL of the 2 drivers within a package.
10%
tPDH
1.5 V
Vin
0 V
10%
50%
90%
tf
tPDL
tr
90%
50%
Vout
1.5 V
+3.0 V
VCC
Vin
S.G.
VOD
500 pF
100
AM26LS30
5
MOTOROLA ANALOG IC DEVICE DATA
Figure 4. Differential Mode Enable Timing
NOTES: 1. S.G. set to: f
p
1.0 MHz; duty cycle = 50%; tr, tf,
p
10 ns.
2. Above tests conducted by monitoring output current levels.
Figure 5. SingleEnded Mode Rise/Fall Time and Data Propagation Delay
NOTES: 1. S.G. set to: f
p
100 kHz; duty cycle = 50%; tr, tf,
p
10 ns.
2. tSK4 =
tPDHtPDL
for each driver.
3. tSK5 computed by subtracting the shortest tPDH from the longest tPDH of the 4 drivers within a package.
4. tSK6 computed by subtracting the shortest tPDL from the longest tPDL of the 4 drivers within a package.
VEE
tPZH
tPZL
tPLZ
tPHZ
1.5 V
Output
Current
(Vin = Lo)
0.1 VSS/RL
0.1 VSS/RL
VSS/RL
VSS/RL
0.5 VSS/RL
0.5 VSS/RL
RL
0 or 3.0 V
En
VSS
500 pF
450
S.G.
VCC
450
CC
+3.0 V
1.5 V
0 V
Vin
VCC
Vin
+2.5 V
S.G.
500 pF
VO
(Vin = Hi)
Vin
1.5 V
Vout
10%
50%
90%
tr
1.5 V
90%
0 V
10%
Vin
50%
tf
tPDL
tPDH
AM26LS30
6
MOTOROLA ANALOG IC DEVICE DATA
VOD
SingleEnded Mode
Mode = 1
VCC = 5.0 V, VEE = 5.0 V
Vin = 1
4.0
0
3.5
4.5
IOH, OUTPUT CURRENT (mA)
60
40
30
50
20
10
3.0
V
OH
, OUTPUT
VOL
T
AGE (V)
4.75
0
3.25
3.75
60
50
40
30
4.25
20
10
IOL, OUTPUT CURRENT (mA)
SingleEnded Mode
Mode = 1
VCC = 5.0 V, VEE = 5.0 V
Vin = 0
V
OL
, OUTPUT
VOL
T
AGE (V)
Figure 6. Differential Output Voltage
versus Load Current
Figure 7. Internal Bias Current
versus Load Current
Figure 8. Short Circuit Current
versus Output Voltage
Figure 9. Input Current versus
Input Voltage
(Pin numbers refer to DIP and SO16 packages only.)
Figure 10. Output Voltage versus
Output Source Current
Figure 11. Output Voltage versus
Output Sink Current
IO
VCC = 5.25 V
Vza, APPLIED OUTPUT VOLTAGE (V)
Pins 2 to 4, 6, 7
5.0 V
t
VEE
t
0
Differential or
SingleEnded Mode
VCC = 0
+5.0
0
5.0
10
15
20
25
15
13
11
9.0
7.0
5.0
3.0
1.0
1.0
1.0
Normally High Output
+100
+60
+20
20
60
100
6.0
5.0
4.0
3.0
2.0
0
20
40
30
20
120
100
80
60
0
40
5.0
4.0
3.0
2.0
1.0
0
60
50
40
30
20
10
0
0.8 or
2.0 V
IO, OUTPUT CURRENT (mA)
10
Vin, INPUT VOLTAGE (V)
Normally Low Output
VCC = 5.0 V
Differential Mode
Mode = 0, VCC = 5.0 V
Differential Mode
Mode = 0, VCC = 5.0 V
Differential Mode
Mode = 0
Supply Current = Bias Current + Load Current
TOTAL LOAD CURRENT (mA)
, INPUT
CURRENT
(
A)
V OD
, OUTPUT
VOL
T
AGE (V)
I in
I B
, BIAS CURRENT
(mA)
I SC
, SHOR
T
CIRCUIT
CURRENT
(mA)
AM26LS30
7
MOTOROLA ANALOG IC DEVICE DATA
I SC
(mA)
I SC
+ (mA)
Figure 12. Internal Positive Bias Current
versus Load Current
Figure 13. Internal Negative Bias Current
versus Load Current
Figure 14. Short Circuit Current
versus Output Voltage
Figure 15. Short Circuit Current
versus
Temperature
Figure 16. Rise/Fall Time versus Capacitance
TOTAL LOAD CURRENT (mA)
IOL
Vin = Lo Vin = Hi
Single Ended Mode
Mode = 1
VCC = 5.0 V, VEE = 5.0 V
Supply Current = Bias Current + IOH
80
IOH
240
0
160
240
160
80
26
22
18
14
10
I B+
, BIAS CURRENT
(mA)
TOTAL LOAD CURRENT (mA)
0
20
85
SingleEnded Mode
Mode = 1
VCC = 5.0 V, VEE = 5.0 V
Supply Current = Bias Current + IOL
0
TA, AMBIENT TEMPERATURE (
C)
10
CC, CAPACITANCE (pF)
Single or Differential Mode
VCC = 5.0 V, VEE = 5.0 V or Gnd
SingleEnded Mode
Mode = 1
VCC = 5.0 V, VEE = 5.0 V
1.0
Vin = Lo Vin = Hi
50
40
IOL
80
240
0
160
240
160
80
5.0
20
15
10
IOH
Normally High Output
SingleEnded Mode
Mode = 1
VCC = 5.0 V, VEE = 5.0 V
Normally Low Output
100
20
20
60
60
100
0
Vza, APPLIED OUTPUT VOLTAGE (V)
2.0
4.0
6.0
2.0
4.0
6.0
Normally Low Output
10 k
10
100
100
1.0 k
40
110
110
100
90
70
60
20
1.0 k
90
Normally High Output to Ground
I B
, BIAS CURRENT
(mA)
I SC
, SHOR
T
CIRCUIT
CURRENT
(mA)
, RISE/F
ALL
TIME ( s)
t r
, t
f
AM26LS30
8
MOTOROLA ANALOG IC DEVICE DATA
APPLICATIONS INFORMATION
(Pin numbers refer to DIP and SO16 packages only.)
Description
The AM26LS30 is a dual function line driver it can be
configured as two differential output drivers which comply
with EIA422A Standard, or as four singleended drivers
which comply with EIA423A Standard. The mode of
operation is selected with the Mode pin (Pin 4) and
appropriate power supplies (see Table 1). Each of the four
outputs is capable of sourcing and sinking 60 to 70 mA while
providing sufficient voltage to ensure proper data
transmission.
As differential drivers, data rates to 10 Mbaud can be
transmitted over a twisted pair for a distance determined by
the cable characteristics. EIA422A Standard provides
guidelines for cable length versus data rate. The advantage
of a differential (balanced) system over a singleended
system is greater noise immunity, common mode rejection,
and higher data rates.
Where extraneous noise sources are not a problem, the
AM26LS30 may be configured as four singleended drivers
transmitting data rates to 100 Kbaud. Crosstalk among wires
within a cable is controlled by the use of the slew rate control
pins on the AM26LS30.
Mode Selection
(Differential Mode)
In this mode (Pins 4 and 8 at ground), only a +5.0 V supply
5% is required at VCC. Pins 2 and 7 are the driver inputs,
while Pins 10, 11, 14 and 15 are the outputs (see Block
Diagram on page 1). The two outputs of a driver are always
complementary and the differential voltage available at each
pair of outputs is shown in Figure 6 for VCC = 5.0 V. The
differential output voltage will vary directly with VCC. A "high"
output can only source current, while a "low" output can only
sink current (except for short circuit current see Figure 8).
The two outputs will be in a high impedance mode when
the respective Enable input (Pin 3 or 6) is high, or if VCC
p
1.1 V. Output leakage current over a common mode range of
10 V is typically less than 1.0
A.
The outputs have short circuit current limiting, typically,
less than 100 mA over a voltage range of 0 to +6.0 V (see
Figure 8). Short circuits should not be allowed to last
indefinitely as the IC may be damaged.
Pins 9, 12, 13 and 16 are not normally used when in this
mode, and should be left open.
(SingleEnded Mode)
In this mode (Pin 4
2.0 V) VCC requires +5.0 V, and VEE
requires 5.0 V, both
5.0%. Pins 2, 3, 6, and 7 are inputs for
the four drivers, and Pins 15, 14, 11, and 10 (respectively) are
the outputs. The four drivers are independent of each other,
and each output will be at a positive or a negative voltage
depending on its input state, the load current, and the supply
voltage. Figures 10 & 11 indicate the high and low output
voltages for VCC = 5.0 V, and VEE = 5.0 V. The graph of
Figure 10 will vary directly with VCC, and the graph of
Figure 11 will vary directly with VEE. A "high" output can only
source current, while a "low" output can only sink current
(except short circuit current see Figure 14).
The outputs will be in a high impedance mode only if
VCC
p
1.1 V. Changing VEE to 0 V does not set the outputs
to a high impedance mode. Leakage current over a common
mode range of
10 V is typically less than 1.0
A.
The outputs have short circuit current limiting, typically
less than 100 mA over a voltage range of
6.0 V (see Figure
14). Short circuits should not be allowed to last indefinitely as
the IC may be damaged.
Capacitors connected between Pins 9, 12, 13, and 16 and
their respective outputs will provide slew rate limiting of the
output transition. Figure 16 indicates the required capacitor
value to obtain a desired rise or fall time (measured between
the 10% and 90% points). The positive and negative
transition times will be within
5% of each other. Each
output may be set to a different slew rate if desired.
Inputs
The five inputs determine the state of the outputs in
accordance with Table 1. All inputs (regardless of the
operating mode) have a nominal threshold of +1.3 V, and
their voltage must be kept within a range of 0 V to +15 V for
proper operation. If an input is taken more than 0.3 V below
ground, excessive currents will flow, and the proper operation
of the drivers will be affected. An open pin is equivalent to a
logic high, but good design practices dictate that inputs
should never be left open. Unused inputs should be
connected to ground. The characteristics of the inputs are
shown in Figure 9.
Power Supplies
VCC requires +5.0 V,
5%, regardless of the mode of
operation. The supply current is determined by the IC's
internal bias requirements and the total load current. The
internally required current is a function of the load current and
is shown in Figure 7 for the differential mode.
In the singleended mode, VEE must be 5.0 V,
5% in
order to comply with EIA423A standards. Figures 12 and
13 indicate the internally required bias currents as a function
of total load current (the sum of the four output loads). The
discontinuity at 0 load current exists due to a change in bias
current when the inputs are switched. The supply currents
vary
2.0 mA as VCC and VEE are varied from
4.75 V
to
5.25 V
.
Sequencing of the supplies during powerup/powerdown
is not required.
Bypass capacitors (0.1
F minimum on each supply pin)
are recommended to ensure proper operation. Capacitors
reduce noise induced onto the supply lines by the switching
action of the drivers, particularly where long P.C. board tracks
are involved. Additionally, the capacitors help absorb
transients induced onto the drivers' outputs from the external
cable (from ESD, motor noise, nearby computers, etc.).
AM26LS30
9
MOTOROLA ANALOG IC DEVICE DATA
Operating Temperature Range
The maximum ambient operating temperature, listed as
+85
C, is actually a function of the system use (i.e.,
specifically how many drivers within a package are used) and
at what current levels they are operating. The maximum
power which may be dissipated within the package is
determined by:
P
Dmax
+
T
Jmax
*
T
A
R
q
JA
where R
JA = package thermal resistance which is typically:
67
C/W for the DIP (PC) package,
120
C/W for the SOIC (D) package,
TJmax = max. allowable junction temperature (150
C)
TA = ambient air temperature near the IC package.
1) Differential Mode Power Dissipation
For the differential mode, the power dissipated within the
package is calculated from:
PD = [(VCC VOD)
IO] (each driver) + (VCC
IB)
where:
VCC = the supply voltage
where:
VOD = is taken from Figure 6 for the known
where:
VOD =
value of IO
where:
IB = the internal bias current (Figure 7)
As indicated in the equation, the first term (in brackets) must
be calculated and summed for each of the two drivers, while
the last term is common to the entire package. Note that the
term (VCC VOD) is constant for a given value of IO and does
not vary with VCC. For an application involving the following
conditions:
TA = +85
C, IO = 60 mA (each driver), VCC = 5.25 V, the
suitability of the package types is calculated as follows.
The power dissipated is:
PD = [3.0 V
60 mA
2] + (5.25 V
18 mA)
PD = 454 mW
The junction temperature calculates to:
TJ = 85
C + (0.454 W
67
C/W) = 115
C for the
TJ =
DIP package,
TJ = 85
C + (0.454 W
120
C/W) = 139
C for the
TJ =
SOIC package.
Since the maximum allowable junction temperature is not
exceeded in any of the above cases, either package can be
used in this application.
2) SingleEnded Mode Power Dissipation
For the singleended mode, the power dissipated within
the package is calculated from:
PD = (IB+
VCC) + (IB
VEE) +
[(IO
(VCC VOH)](each driver)
The above equation assumes IO has the same magnitude
for both output states, and makes use of the fact that the
absolute value of the graphs of Figures 10 and 11 are nearly
identical. IB+ and IB are obtained from the right half of
Figures 12 and 13, and (VCC VOH) can be obtained from
Figure 10. Note that the term (VCC VOH) is constant for a
given value of IO and does not vary with VCC. For an
application involving the following conditions:
TA = +85
C, IO = 60 mA (each driver), VCC = 5.25 V,
VEE = 5.25 V, the suitability of the package types is
calculated as follows.
The power dissipated is:
PD = (24 mA
5.25 V) + (3.0 mA
5.25 V) +
PD =
[60 mA
1.45 V
4.0]
PD = 490 mW
The junction temperature calculates to:
TJ = 85
C + (0.490 W
67
C/W) = 118
C for the
TJ =
DIP package,
TJ = 85
C + (0.490 W
120
C/W) = 144
C for the
TJ =
SOIC package.
Since the maximum allowable junction temperature is not
exceeded in any of the above cases, either package can be
used in this application.
AM26LS30
10
MOTOROLA ANALOG IC DEVICE DATA
SYSTEM EXAMPLES
(Pin numbers refer to DIP and SO16 packages only.)
Differential System
An example of a typical EIA422A system is shown in
Figure 17. Although EIA422A does not specifically address
multiple driver situations, the AM26LS30 can be used in this
manner since the outputs can be put into a high impedance
mode. It is, however, the system designer's responsibility to
ensure the Enable pins are properly controlled so as to
prevent two drivers on the same cable from being "on" at the
same time.
The limit on the number of receivers and drivers which
may be connected on one system is determined by the input
current of each receiver, the maximum leakage current of
each "off" driver, and the DC current through each
terminating resistor. The sum of these currents must not
exceed the capability of the "on" driver (
60 mA). If the cable
is of any significant length, with receivers at various points
along its length, the common mode voltage may vary along
its length, and this parameter must be considered when
calculating the maximum driver current.
The cable requirements are defined not only by the AC
characteristics and the data rate, but also by the DC
resistance. The maximum resistance must be such that the
minimum voltage across any receiver inputs is never less than
200 mV.
The ground terminals of each driver and receiver in Figure
17 must be connected together by a dedicated wire (or the
shield) in the cable to provide a common reference. Chassis
grounds or power line grounds should not be relied on for this
common connection as they may generate significant
common mode differences. Additionally, they usually do not
provide a sufficiently low impedance at the frequencies
of interest.
SingleEnded System
An example of a typical EIA423A system is shown in
Figure 18. Multiple drivers on a single data line are not
possible since the drivers cannot be put into a high
impedance mode. Although each driver is shown connected
to a single receiver, multiple receivers can be driven from a
single driver as long as the total load current of the receivers
and the terminating resistor does not exceed the capability of
the driver (
60 mA). If the cable is of any significant length,
with receivers at various points along its length, the common
mode voltage may vary along its length, and this parameter
must be considered when calculating the maximum
driver current.
The cable requirements are defined not only by the AC
characteristics and the data rate, but also by the DC
resistance. The maximum resistance must be such that the
minimum voltage across any receiver inputs is never less
than 200 mV.
The ground terminals of each driver and receiver in Figure
18 must be connected together by a dedicated wire (or the
shield) in the cable so as to provide a common reference.
Chassis grounds or power line grounds should not be relied
on for this common connection as they may generate
significant common mode differences. Additionally, they
usually do not provide a sufficiently low impedance at the
frequencies of interest.
Additional Modes of Operation
If compliance with EIA422A or EIA423A Standard is
not required in a particular application, the AM26LS30 can be
operated in two other modes.
1) The device may be operated in the differential mode
(Pin 4 = 0) with VEE connected to any voltage between
ground and 5.25 V. Outputs in the low state will be
referenced to VEE, resulting in a differential output voltage
greater than that shown in Figure 6. The Enable pins will
operate the same as previously described.
2) The device may be operated in the singleended mode
(Pin 4 = 1) with VEE connected to any voltage between
ground and 5.25 V. Outputs in the high state will be at a
voltage as shown in Figure 10, while outputs in a low state
will be referenced to VEE.
Termination Resistors
Transmission line theory states that, in order to preserve
the shape and integrity of a waveform traveling along a cable,
the cable must be terminated in an impedance equal to its
characteristic impedance. In a system such as that depicted
in Figure 17, in which data can travel in both directions, both
physical ends of the cable must be terminated. Stubs leading
to each receiver and driver should be as short as possible.
In a system such as that depicted in Figure 18, in which
data normally travels in one direction only, a terminator is
theoretically required only at the receiving end of the cable.
However, if the cable is in a location where noise spikes of
several volts can be induced onto it, then a terminator
(preferably a series resistor) should be placed at the driver
end to prevent damage to the driver.
Leaving off the terminations will generally result in
reflections which can have amplitudes of several volts above
VCC or several volts below ground or VEE. These
overshoots/undershoots can disrupt the driver and/or
receiver, create false data, and in some cases, damage
components on the bus.
AM26LS30
11
MOTOROLA ANALOG IC DEVICE DATA
Figure 17. EIA422A Example
NOTES: 1. Terminating resistors RT should be located at the physical ends of the cable.
2. Stubs should be as short as possible.
3. Receivers = AM26LS32, MC3486, SN75173 or SN75175.
4. Circuit grounds must be connected together through a dedicated wire.
Figure 18. EIA423A Example
En
TTL
R
AM26LS32, MC3486, SN75173, or SN75175
TTL
CC
D
RT
+
AM26LS30
D
TTL
R
D
R
D
TTL
TTL
TTL
D
TTL
D
TTL
TTL
TTL
En
R
Twisted
Pair
RT
D
RT
En
En
TTL
R
En
R
TTL
En
TTL
TTL
R
RT
+
TTL
R
RT
+
TTL
R
RT
+
TTL
CC
D
TTL
CC
D
TTL
CC
D
AM26LS30
12
MOTOROLA ANALOG IC DEVICE DATA
OUTLINE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1
8
9
16
K
PLANE
T
M
A
M
0.25 (0.010)
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.740
0.770
18.80
19.55
B
0.250
0.270
6.35
6.85
C
0.145
0.175
3.69
4.44
D
0.015
0.021
0.39
0.53
F
0.040
0.70
1.02
1.77
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J
0.008
0.015
0.21
0.38
K
0.110
0.130
2.80
3.30
L
0.295
0.305
7.50
7.74
M
0
10
0
10
S
0.020
0.040
0.51
1.01
_
_
_
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1
8
16
9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PL
P
B
A
M
0.25 (0.010)
B
S
T
D
K
C
16 PL
S
B
M
0.25 (0.010)
A
S
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
9.80
10.00
0.386
0.393
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
M
0
7
0
7
P
5.80
6.20
0.229
0.244
R
0.25
0.50
0.010
0.019
_
_
_
_
PC SUFFIX
PLASTIC PACKAGE
CASE 64808
ISSUE R
D SUFFIX
PLASTIC PACKAGE
CASE 751B05
(SO16)
ISSUE J
AM26LS30
13
MOTOROLA ANALOG IC DEVICE DATA
OUTLINE DIMENSIONS
M
N
L
Y BRK
W
V
D
D
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
S
LM
S
0.010 (0.250)
N
S
T
X
G1
B
U
Z
VIEW DD
20
1
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
S
LM
S
0.010 (0.250)
N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
T
SEATING
PLANE
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
H
VIEW S
K
K1
F
G1
NOTES:
1. DATUMS L, M, AND N DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM T, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.385
0.395
9.78
10.03
B
0.385
0.395
9.78
10.03
C
0.165
0.180
4.20
4.57
E
0.090
0.110
2.29
2.79
F
0.013
0.019
0.33
0.48
G
0.050 BSC
1.27 BSC
H
0.026
0.032
0.66
0.81
J
0.020
0.51
K
0.025
0.64
R
0.350
0.356
8.89
9.04
U
0.350
0.356
8.89
9.04
V
0.042
0.048
1.07
1.21
W
0.042
0.048
1.07
1.21
X
0.042
0.056
1.07
1.42
Y
0.020
0.50
Z
2
10
2
10
G1
0.310
0.330
7.88
8.38
K1
0.040
1.02
_
_
_
_
FN SUFFIX
PLASTIC PACKAGE
CASE 77502
ISSUE C
AM26LS30
14
MOTOROLA ANALOG IC DEVICE DATA
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different
applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does
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against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
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AM26LS30/D
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