Data Sheet
January 2002

SMLW010 Single-Output Low-Profile

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

The SMLW010 Single-Output, Low-Profile, PCB Mount Power
Modules use advanced, surface-mount technology and
deliver high-quality, compact, dc-dc conversion at an eco-
nomical price.

Applications

Communications equipment

Computer equipment

Distributed power architectures

Surface-mount applications

Features

Low profile: 8.2 mm x 22.6 mm x 47.8 mm

(0.323 in. x 0.89 in. x 1.88 in.)

Wide input voltage range: 36 Vdc to 75 Vdc

Input-to-output isolation: 1500 V

Operating case temperature range: 40 °C to
+105 °C

Overcurrent protection, unlimited duration

Positive remote on/off logic

Output voltage adjustment: 90% to 110% of V

O, nom

Output overvoltage protection

Undervoltage lockout

UL* 60950 Recognized, CSA

C22.2 No. 60950-00

Certified, VDE 0805 (EN60950) Licensed

CE mark meets 73/23/EEC and 93/68/EEC
directives

Within FCC Class A radiated limits

Options

Synchronization

Description

The SMLW010 Single-Output, Low-Profile, PCB Mount Power Modules are low-profile, dc-dc converters that
operate over an input voltage range of 36 Vdc to 75 Vdc and provide a precisely regulated output. The output is
isolated from the input, allowing versatile polarity configurations and grounding connections. Built-in filtering for
both input and output minimizes the need for external filtering. These modules are designed and manufactured
to be gull-winged surface-mounted power modules that are reflowed with other surface-mount components in a
typical surface-mount fashion.

UL is a registered trademark of Underwriters Laboratories, Inc.

CSA is a registered trademark of Canadian Standards Association.

This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should

be followed. (The CE mark is placed on selected products.)

Tyco Electronics Corp.

Data Sheet

January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in
excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect device reliability.

* See derating curves, Figure 8, for details.

Electrical Specifications

Table 1. Input Specifications

Fusing Considerations

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone
operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal
fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse.
The safety agencies require a normal-blow fuse with a maximum rating of 5 A (see Safety Considerations section).
Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same
type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data for further information.

Parameter

Device

Symbol

Min

Typ

Max

Unit

Input Voltage:

Continuous

Transient (100 ms)

SMLW

All

I, trans

100

Vdc

Operating Case Temperature

(See Thermal Considerations section.)

All

105*

°C

Storage Temperature

All

stg

125

°C

I/O Isolation Voltage (for 1 minute)

All

1500

Vdc

Parameter

Device

Symbol

Min

Typ

Max

Unit

Operating Input Voltage

SMLW

Vdc

Maximum Input Current

= 0 to V

I, max

; I

= I

O, max

)

SMLW

I, max

0.6

Inrush Transient

All

0.2

Input Reflected-ripple Current

(5 Hz to 2 0MHz; 12 µH source imped-
ance; T

= 25 °C; see Figure 1 and

Design Considerations section.)

All

mAp-p

Input Ripple Rejection (100 Hz--120 Hz)

All

Tyco Electronics Corp.

Data Sheet
January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Electrical Specifications

(continued)

Table 2. Output Specifications

* For output voltages below 2.5 V, the G is trimmable down to 1.5 V.

Parameter

Device Code

or Suffix

Symbol

Min

Typ

Max

Unit

Output Voltage Set Point

= V

I, nom

; I

= I

O, max

; T

= 25 °C)

O, set

2.45
4.85

2.5
5.0

2.55
5.15

Vdc
Vdc

Output Voltage

(Over all line, load, and temperature conditions
until end of life; see Figure 3.)

2.41
4.80

--
--

2.59
5.20

Vdc
Vdc

Output Regulation:

Line (V

= V

I, min

to V

I, max

)

Load (I

= I

O, min

to I

O, max

)

Temperature (T

= 40 °C to +85 °C)

A, G

--
--
--
--
--
--

0.01

0.1

0.5

--
--
--
--
--
--

Output Ripple and Noise Voltage

(Across one 0.1 µF ceramic capacitor; see
Figure 2.):

RMS

Peak-to-peak (5 Hz to 20 MHz)

A, G

mVrms

mVp-p

External Load Capacitance

A, G

220

µF

Output Current

(At I

< I

O, min

, the modules may exceed output

ripple specifications, but operation is guaran-
teed. For A, and G codes, the output voltage
may exceed specifications when I

< I

O, min

0.15
0.10

3.0

2.0

Output Current-limit Inception

= 90% V

O, set

)

All

115

O, max

Output Short-circuit Current

= 0.25 V at 25 °C)

All

200

O, max

Tyco Electronics Corp.

Data Sheet

January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Electrical Specifications

(continued)

Table 2. Output Specifications (continued)

* For output voltages below 2.5 V, the G is trimmable down to 1.5 V.
Engineering estimate.

Table 3. Isolation Specifications

Table 4. General Specifications

Parameter

Device Code

or Suffix

Symbol

Min

Typ

Max

Unit

Efficiency

= V

I, nom

; I

= I

O, max

; T

= 25 °C; see

Figure 3.)

SMLW010G

SMLW010A

Switching Frequency

475
350

kHz

Dynamic Response

(

t = 1A/10 µs; V

= V

I, nom

; T

= 25 °C):

Load Change from I

= 50% to 75% of I

O, max

Peak Deviation
Settling Time (V

< 10% of peak deviation)

Load Change from I

= 50% to 25% of I

O, max

Peak Deviation
Settling Time (V

< 10% of peak deviation)

All
All

--
--

1.5

--
--

O, set

Parameter

Device

Min

Typ

Max

Unit

Isolation Capacitance (engineering estimate)

All

1100

Isolation Resistance

All

Parameter

Device

Min

Typ

Max

Unit

Calculated MTBF

= 80% of I

O, max

; T

= 40 °C)

All

5,500,000

hours

Weight (engineering estimate)

All

17 (0.6)

g (oz.)

Tyco Electronics Corp.

Data Sheet
January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Electrical Specifications

(continued)

Table 5. Feature Specifications

Parameter

Device Code

or Suffix

Symbol

Min

Typ

Max

Unit

Remote On/Off Signal Interface

= V

I, min

to V

I, max

; open collector or

equivalent compatible; signal referenced to
V

() terminal. See Figure 4 and Feature

Descriptions.):

Logic Low--Module Off
Logic High--Module On

Module Specifications:

On/Off Current--Logic Low
On/Off Voltage:

Logic Low
Logic High (I

on/off

= 0 mA)

Open Collector Switch Specifications:

Leakage Current During Logic High

on/off

= 6 V)

Output Low Voltage During Logic Low

on/off

= 1 mA)

All

All
All

All

on/off

0.7

--
--

1.0

1.2

V
V

µA

Turn-on Delay and Rise Times

(at 80% of I

O, max

; T

= 25 °C):

Case 1: On/Off Input Is Set for Logic High and

then Input Power Is Applied (Delay from
Point at Which V

= V

I, min

until V

= 10% of

O, nom

Case 2: Input Power Is Applied for at Least

One Second, and then the On/Off Input Is
Set to Logic High (Delay from Point at Which
V

on/off

= 0.9 V until V

= 10% of V

O, nom

Output Voltage Rise Time (Time for V

Rise from 10% of V

O, nom

to 90% of V

O, nom

)

Output Voltage Overshoot (at 80% of I

O, max

;

= 25 °C)

All

delay

rise

Output Voltage Set Point Adjustment Range

trim

90
60

--
--

110
110

O, nom

Output Overvoltage Protection (clamp)

O, clamp

3.0
5.6

--
--

5.7
7.7

V
V

Undervoltage Lockout

All

Data Sheet

January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Tyco Electronics Corp.

Test Configurations

8-203

Note: Input reflected-ripple current is measured with a simulated

source impedance of 12 µH. Capacitor Cs offsets possible
battery impedance. Current is measured at the input of the
module.

Figure 1. Input Reflected-Ripple Test Setup

8-513

Note: Use one 0.1 µF ceramic capacitor. Scope measurement should

be made using a BNC socket. Position the load between 50
mm and 75 mm (2 in. and 3 in.) from the module.

Figure 2. Peak-to-Peak Output Noise Measurement

Test Setup

8-204(C)

Note: All measurements are taken at the module terminals. When

socketing, place Kelvin connections at module terminals to
avoid measurement errors due to socket contact resistance.

Figure 3. Output Voltage and Efficiency

Measurement Test Setup

Design Considerations

Input Source Impedance

The power module should be connected to a low
ac-impedance input source. Highly inductive source
impedances can affect the stability of the power mod-
ule. If the source inductance exceeds 10 µH, a 33 µF
electrolytic capacitor (ESR < 0.7

at 100 kHz)

mounted close to the power module helps ensure
stability of the unit. (See Figure 1.)

Solder Recommendations

Large surface-mount components typically require a
thicker stencil than smaller components to ensure a
reliable solder joint. The SMLW010 Single-Output,
Low-Profile, PCB Mount Power Modules have been
evaluated for solder joint reliability and shock and vibra-
tion requirements using 170,000 cubic mils (2. 8mm

)

of solder. This volume can be obtained by printing sol-
der 12 mils thick on the copper pads or overprinting the
copper pads 13 mils (0.33 mm) around the pad area
with 8 mils of printed solder. Although this volume is
recommended, tests have been conducted using lower
volumes with successful results. Contact technical sup-
port for further assistance.

TO OSCILLOSCOPE

12 µH

220 µF

IMPEDANCE < 0.1

@ 20 °C, 100 kHz

(+)

(-)

BATTERY

33 µF

CURRENT

PROBE

TEST

(+)

()

RESISTIVE
LOAD

SCOPE

0.1 µF

COPPER STRIP

(+)

(-)

(+)

(-)

SUPPLY

CONTACT RESISTANCE

CONTACT AND

DISTRIBUTION LOSSES

LOAD

(+)

()

[

(+)

()

[

-----------------------------------------------

100 %

Data Sheet
January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Tyco Electronics Corp.

Safety Considerations

SMLW Modules

For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard,
i.e.,

UL 60950, CSA C22.2 No. 60950-00, and VDE

0805 (EN60950).

If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75 Vdc), for the module's output to be considered
meeting the requirements of safety extra-low voltage
(SELV), all of the following must be true:

The input source is to be provided with reinforced
insulation from any other hazardous voltages, includ-
ing the ac mains.

One V

pin and one V

pin are to be grounded or

both the input and output pins are to be kept floating.

The input pins of the module are not operator acces-
sible.

Another SELV reliability test is conducted on the
whole system, as required by the safety agencies, on
the combination of supply source and the subject
module to verify that under a single fault, hazardous
voltages do not appear at the module's output.

Note: Do not ground either of the input pins of the

module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.

The power module has extra-low voltage (ELV) outputs
when all inputs are ELV.

The input to these units is to be provided with a maxi-
mum 5 A normal-blow fuse in the ungrounded lead.

Feature Descriptions

Overcurrent Protection

To provide protection in a fault (output overload) condi-
tion, the unit is equipped with internal current-limiting
circuitry and can endure current limiting for an unlim-
ited duration. At the point of current-limit inception, the
unit shifts from voltage control to current control. If the
output voltage is pulled very low during a severe fault,
the current-limit circuit can exhibit either foldback or
tailout characteristics (output-current decrease or
increase). The unit operates normally once the output
current is brought back into its specified range.

Remote On/Off

Positive logic remote on/off turns the module on during
a logic-high voltage on the remote ON/OFF pin, and off
during a logic low.

To turn the power module on and off, the user must
supply a switch to control the voltage between the
on/off terminal and the V

() terminal (V

on/off

). The

switch may be an open collector or equivalent (see
Figure 4). A logic low is V

on/off

= 0.7 V to 1.2 V. The

maximum I

on/off

during a logic low is 1 mA. The switch

should maintain a logic-low voltage while sinking 1 mA.

During a logic high, the maximum V

on/off

generated by

the power module is 6 V. The maximum allowable leak-
age current of the switch at V

on/off

= 6 V is 50 µA.

The module has internal capacitance to reduce noise
at the ON/OFF pin. Additional capacitance is not gen-
erally needed and may degrade the start-up character-
istics of the module.

8-758a

Figure 4. Remote On/Off Implementation

Output Voltage Adjustment

Output voltage set-point adjustment allows the user to
increase or decrease the output voltage set point of a
module. This is accomplished by connecting an exter-
nal resistor between the TRIM pin and either the V

(+)

or V

() pins. With an external resistor between the

TRIM and V

(+) pins (R

adj-down

), the output voltage set

point (V

O, adj

) decreases (see Figure 5). The following

equation determines the required external resistor
value to obtain an output voltage change from V

O, nom

O, adj

where R

adj-down

is the resistance value connected

between TRIM and V

(+), and G, H, and L are defined

in the table below.

on/off

REMOTE
ON/OFF

(+)

(-)

adj-down

O a dj

(

)

O no m

O a dj

(

)

---------------------------------------

Tyco Electronics Corp.

Data Sheet

January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Feature Descriptions

(continued)

Output Voltage Adjustment

(continued)

8-715e

Figure 5. Circuit Configuration to Decrease

Output Voltage

With an external resistor connected between the TRIM
and V

() pins (R

adj-up

), the output voltage set point

O, adj

) increases (see Figure 6). The following equa-

tion determines the required external resistor value to
obtain an output voltage from V

O, nom

to V

O, adj

where R

adj-up

is the resistance value connected

between TRIM and V

(), and the values of G, H, K,

and L are shown in the following table.

The combination of the output voltage adjustment
and the output voltage regulation cannot exceed 110%
of the nominal output voltage between the V

(+) and

() terminals.

8-715d

Figure 6. Circuit Configuration to Increase Output

Voltage

The SMLW010 Power Modules have a fixed current-
limit set point. Therefore, as the output voltage is
adjusted down, the available output power is reduced.
In addition, the minimum output current is a function of
the output voltage. As the output voltage is adjusted
down, the minimum required output current can
increase (i.e., minimum power is constant). As the out-
put voltage is adjusted up, the output power should be
held constant (maximum load current decreases).

Output Overvoltage Protection

The output overvoltage clamp consists of control cir-
cuitry, almost entirely independent of the primary regu-
lation loop, that monitors the voltage on the output
terminals. This control loop has a higher voltage set
point than the primary loop (see Feature Specifications
table). In a fault condition, the overvoltage clamp
ensures that the output voltage does not exceed
V

, clamp, max

. This provides a redundant voltage-control

that reduces the risk of output overvoltage.

SMLx010G

2870

511

1.28

1.23

SMLx010A

4750

2490

3.77

1.23

(+)

()

(+)

(-)

TRIM

adj-down

LOAD

adj-up

O a dj

(

)

[

]

-----------------------------------------

(+)

(-)

(+)

(-)

TRIM

adj-up

LOAD

Tyco Electronics Corp.

Data Sheet
January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Feature Descriptions

(continued)

Synchronization (Optional)

With external circuitry, the unit is capable of synchroni-
zation from an independent time base with a switching
rate equal to the nominal switching frequency shown in
the Output Specifications table. Other frequencies may
be available; please consult the factory for application
guidelines and/or a description of the external circuit
needed to use this feature.

Thermal Considerations

The power module operates in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation of the unit.
Heat-dissipating components inside the unit are ther-
mally coupled to the case. Heat is removed by conduc-
tion, convection, and radiation to the surrounding
environment. Proper cooling can be verified by mea-
suring the case temperature. The case temperature
(T

) should be measured at the position indicated in

Figure 7.

8-1363e

Note: Dimensions are in millimeters and (inches). Pin locations are

for reference only.

Figure 7. SMLW Case Temperature

Measurement Location

Note that the view in Figure 7 is of the surface of the
module. The temperature at this location should not
exceed the maximum case temperature indicated on
the derating curves. The output power of the module
should not exceed the rated power for the module as
listed in the Ordering Information table.

Heat Transfer Characteristics

Increasing airflow over the module enhances the heat
transfer via convection. Figure 8 shows the maximum
power that can be dissipated by the module without
exceeding the maximum case temperature versus local
ambient temperature (T

) for natural convection

through 3.0 ms

(600 ft./min.).

Systems in which these power modules are used typi-
cally generate natural convection airflow rates of
0.25 ms

(50 ft./min.) due to other heat-dissipating

components in the system. Therefore, the natural con-
vection condition represents airflow rates of approxi-
mately 0.25 ms

(50 ft./min.). Use of Figure 8 is shown

in the following example.

Example

What is the minimum airflow necessary for an
SMLW010A operating at V

= 48 V, an output current of

1.6 A, and a maximum ambient temperature of 86 °C?

Solution

Given: V

= 48 V, I

= 1.6 A (I

O, max

), T

= 86 °C

Determine P

(Figure 9): P

= 2.1 W

Determine airflow (Figure 8): v = 1 ms

(200 ft./min.)

SMLW010A
DC-DC Power Module

IN:DC 36-75V, 0.6A OUT:DC 5V, 2A

24 (0.94)

(0.45)

Tyco Electronics Corp.

Data Sheet

January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Thermal Considerations

(continued)

Heat Transfer Characteristics

(continued)

8-2793a

Figure 8. SMLW010A and SMLW010G Forced

Convection Power Derating; Either
Orientation

8-2790

Figure 9. SMLW010A Typical Power Dissipation

vs. Normalized Output Current at
T

= 25 °C

Module Derating

The derating curves in Figure 8 were derived by mea-
surements obtained in an experimental apparatus
shown in Figure 10. Note that the module and the
printed-wiring board (PWB) that it is mounted on are
both vertically oriented. The passage has a rectangular

cross section.

8-1126e

Note: Dimensions are in millimeters and (inches).

Figure 10. Experimental Test Setup

Surface-Mount Power Module Solder
Reflow Recommendation

The SMLW010 Single-Output, Low-Profile, PCB Mount
Power Modules are constructed with SMT (surface-
mount technology) components and assembly guide-
lines. Such large mass/low thermal resistance devices
heat up slower than typical SMT components. It is rec-
ommended that the customer review data sheets in
order to customize the solder reflow profile for applica-
tion board assembly.

It is recommended that a reflow profile must be charac-
terized for the module on the application board assem-
bly. The solder paste type, component, and board
thermal sensitivity must be considered in order to form
the desired fused solder fillet. The power module leads
are plated with tin (Sn) solder to prevent corrosion and
ensure good solderability. Typically, the eutectic solder
melts at 183 °C, wets the land, and subsequently wicks
the device lead. Sufficient time must be allocated to
fuse the plating on the lead and ensure a reliable sol-
der joint.

100

0.0

3.0

MAX AMBIENT TEMPERATURE, T

(

°C)

2.0

1.5

2.5

105 110

I
SS

I
P

I
O

,
P

)

1.0

0.5

3.5

3.0 ms

-1

(600 ft./min.)

2.0 ms

-1

(400 ft./min.)

1.5 ms

-1

(300 ft./min.)

1.0 ms

-1

(200 ft./min.)

NATURAL CONVECTION

MAX CASE TEMPERATURE

0.2

0.4

1.2

1.4

1.6

1.8

0.0

2.5

OUTPUT CURRENT, I

(A)

1.5

1.0

2.0

0.0

3.0

0.5

0.8

1.0

0.6

I
S

,
P

)

= 75 V

= 60 V

= 48 V

= 36 V

AIR VELOCITY
AND AMBIENT

TEMPERATURE

MEASURED

BELOW THE

MODULE

AIRFLOW

13 (0.5)

FACING PWB

MODULE

76 (3.0)

PWB

25 (1.0)

Tyco Electronics Corp.

Data Sheet
January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Surface-Mount Power Module Solder Reflow Recommendation

(continued)

There are several types of SMT reflow technologies currently used in the industry. These surface-mount power
modules can be adequately soldered using natural convection, IR (radiant infrared), convection/IR, or forced con-
vection technologies. The surface-mount power module solder reflow profile is established by accurately measur-
ing the module gull-wing lead surface temperature.

The maximum oven temperature and conveyor speed should prevent the lead temperature from exceeding the
maximum thermal profile limits as shown in Figure 11. The lead temperature during a typical reflow profile is shown
in Figure 12. Failure to observe these maximum lead temperatures and duration may result in permanent damage
to the power module.

Relative temperatures of the module gull-wing leads vary according to many factors, including surrounding compo-
nents, internal paths, and connecting paths. Typically, pin 1 is a good choice for a conservative measurement since
it is usually connected to heavy paths for current conduction which also tend to heat the lead faster. These vari-
ables make it difficult to compare various types of surface-mount modules; however, the unit has been found to be
more robust during temperature profiles compared with other SMT modules available in the industry.

8-2275

Figure 11. Maximum Thermal Profile Limits

8-2274a

Figure 12. Typical Reflow Soldering Profile

4 °C/s MAX

90 s MAX

6 MINUTES MAX

230 °C MAX

183 °C

150 °C

120 °C

TIME (s)

GULL-WING LEAD

TEMPERA

TURE (

°
C)

(PEAK)

2:30

5:00

7:30

10:00

MELTING POINT

(60/40 SOLDER)

250

200

150

100

TIME (min.)

GULL-WING LEAD

TEMPERA

TURE (

°
C)

Tyco Electronics Corp.

Data Sheet

January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Packaging Information

Vacuum Formed Trays

The SMLW010 Single-Output, Low-Profile, PCB Mount Power Modules are delivered in plastic vacuum formed
trays (see Figure 13) that allow automated placement of the modules via a surface-mount pick and place machine.

8-2792

Note: Dimensions are in millimeters and (inches).

Figure 13. Vacuum Formed Tray

Specifications:

Material: PVC (ESD protected)

Capacity: 24 pieces/tray

Weight: 90 g (3.2 oz.)

0.00

3 (0.11)

45 (1.78)

105 (4.14)

165 (6.50)

285 (11.22)

345 (13.58)

378 (14.89)

381 (15.00)

12
(0.47)

216 (8.50)

212 (8.33)

184 (7.25)

90 (3.55)

43 (1.70)

12 (0.48)

4 (0.16)

0.00

19
(0.75)

848276036

225 (8.86)

137 (5.40)

Tyco Electronics Corp.

Data Sheet

January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Recommended Hole Pattern

Component-side footprint. Dimensions are in millimeters and (inches).
Tolerances: x.x ± 0.5 mm (0.020 in.); x.xx ± 0.38 mm (0.015 in.).

CAUTION: Care must be taken to ensure the board in the periphery of the footprint is flat.

8-1507d

* The recommended solder paste volume is 2.8 cubic mm (170,000 cubic mils/pin). See Design Considerations section.

NC may be used for internal module connections and should not be connected by the customer.

Pin

SMLW Function

(+)

()

TRIM

ON/OFF

SYNC (optional)

()

(+)

30.0

(1.181)

3.3

(0.13)

5.0

(0.197)

2.8

(0.110)

FOOTPRINT

PERIPHERY

29.87

(1.176)

24.28

(0.956)

PIN 1 PAD*

Data Sheet

January 2002

Power Modules: 36 Vdc to 75 Vdc Input; 10 W

SMLW010 Single-Output Low-Profile

Printed on

Recycled Paper

World Wide Headquarters
Tyco Electronics Power Systems, Inc.

3000 Skyline Drive, Mesquite, TX 75149, USA
+1-800-526-7819 FAX: +1-888-315-5182
(Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900)
www.power.tycoelectronics.com
e-mail: techsupport1@tycoelectronics.com

Tyco Electronics Corporation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application.
No rights under any patent accompany the sale of any such product(s) or information.

January 2002
DS00-089EPS (Replaces DS99-282EPS)

Europe, Middle-East and Africa Headquarters
Tyco Electronics (UK) Ltd
Tel: +44 (0) 1344 469 300, Fax: +44 (0) 1344 469 301

Central America-Latin America Headquarters
Tyco Electronics Power Systems
Tel: +54 11 4316 2866, Fax: +54 11 4312 9508

Asia-Pacific Headquarters
Tyco Electronics Singapore Pte Ltd
Tel: +65 482 0311, Fax: 65 480 9299

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SMLW010

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SMLW010