1
FN6115.1
ISL83070E, ISL83071E, ISL83072E, ISL83073E,
ISL83075E, ISL83076E,
ISL83077E,
ISL83078E
15kV ESD Protected, 3.3V, Full Fail-safe,
Low Power, High Speed or Slew Rate
Limited, RS-485/RS-422 Transceivers
The Intersil ISL8307XE are BiCMOS 3.3V powered, single
transceivers that meet both the RS-485 and RS-422
standards for balanced communication.
These devices have
very low bus currents (+125
A/-100A), so they present a
true "1/8 unit load" to the RS-485 bus. This allows up to 256
transceivers on the network without violating the RS-485
specification's 32 unit load maximum, and without using
repeaters. For example, in a remote utility meter reading
system, individual meter readings are routed to a concentrator
via an RS-485 network, so the high allowed node count
minimizes the number of repeaters required.
Receiver (Rx) inputs feature a "Full Fail-Safe" design, which
ensures a logic high Rx output if Rx inputs are floating,
shorted, or terminated but undriven.
Hot Plug circuitry ensures that the Tx and Rx outputs remain
in a high impedance state while the power supply stabilizes.
The ISL83070E through ISL83075E utilize slew rate limited
drivers which reduce EMI, and minimize reflections from
improperly terminated transmission lines, or unterminated
stubs in multidrop and multipoint applications. Slew rate limited
versions also include receiver input filtering to enhance noise
immunity in the presence of slow input signals.
The ISL83070E, ISL83071E, ISL83073E, ISL83076E
,
ISL83077E
are configured for full duplex (separate Rx input
and Tx output pins) applications. The half duplex versions
multiplex the Rx inputs and Tx outputs to allow transceivers
with output disable functions in 8 lead packages.
Features
Pb-Free Plus Anneal (RoHS Compliant)
RS-485 I/O Pin ESD Protection . . . . . . . . . .
15kV HBM
- Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM
Full Fail-safe (Open, Short, Terminated/Floating)
Receivers
Hot Plug - Tx and Rx Outputs Remain Three-state During
Power-up
True 1/8 Unit Load Allows up to 256 Devices on the Bus
Single 3.3V Supply
High Data Rates. . . . . . . . . . . . . . . . . . . . . up to 20Mbps
Low Quiescent Supply Current . . . . . . . . . . 800
A (Max)
- Ultra Low Shutdown Supply Current . . . . . . . . . . 10nA
-7V to +12V Common Mode Input/Output Voltage Range
Half and Full Duplex Pinouts
Three State Rx and Tx Outputs Available
Current Limiting and Thermal Shutdown for driver
Overload Protection
Tiny MSOP package offering saves 50% board space
Applications
Automated Utility Meter Reading Systems
High Node Count Systems
Field Bus Networks
Security Camera Networks
Building Environmental Control/ Lighting Systems
Industrial/Process Control Networks
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
HALF/FULL
DUPLEX
DATA RATE
(Mbps)
SLEW-RATE
LIMITED?
HOT
PLUG?
# DEVICES
ON BUS
RX / TX
ENABLE?
QUIESCENT
I
CC
(
A)
LOW POWER
SHUTDOWN?
PIN
COUNT
ISL83070E
FULL
0.25
YES
YES
256
YES
510
YES
14
ISL83071E
FULL
0.25
YES
YES
256
NO
510
NO
8
ISL83072E
HALF
0.25
YES
YES
256
YES
510
YES
8
ISL83073E
FULL
0.5
YES
YES
256
YES
510
YES
14
ISL83075E
HALF
0.5
YES
YES
256
YES
510
YES
8
ISL83076E
FULL
20
NO
YES
256
YES
510
YES
14
ISL83077E
FULL
20
NO
YES
256
NO
510
NO
8
ISL83078E
HALF
20
NO
YES
256
YES
510
YES
8
Data Sheet
August 5, 2005
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
2
FN6115.1
August 5, 2005
Pinouts
ISL83072E, ISL83075E, ISL83078E
(MSOP, SOIC)
TOP VIEW
ISL83071E, ISL83077E
(SOIC)
TOP VIEW
ISL83070E, ISL83073E, ISL83076E
(SOIC)
TOP VIEW
RO
RE
DE
DI
1
2
3
4
8
7
6
5
V
CC
B/Z
A/Y
GND
D
R
V
CC
RO
DI
GND
1
2
3
4
8
7
6
5
A
B
Z
Y
D
R
NC
RO
RE
DE
DI
GND
GND
V
CC
NC
A
B
Z
Y
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
D
R
Ordering Information
(Notes 1, 2)
PART NO.
(BRAND)
TEMP.
RANGE (C)
PACKAGE
PKG.
DWG. #
ISL83070EIBZA
(83070EIBZ)
-40 to 85
14 Ld SOIC
(Pb-Free)
M14.15
ISL83071EIBZA
(83071EIBZ)
-40 to 85
8 Ld SOIC
(Pb-Free)
M8.15
ISL83072EIBZA
(83072EIBZ)
-40 to 85
8 Ld SOIC
(Pb-Free)
M8.15
ISL83072EIUZA
(3072Z)
-40 to 85
8 Ld MSOP
(Pb-Free)
M8.118
ISL83073EIBZA
(83073EIBZ)
-40 to 85
14 Ld SOIC
(Pb-Free)
M14.15
ISL83075EIBZA
(83075EIBZ)
-40 to 85
8 Ld SOIC
(Pb-Free)
M8.15
ISL83075EIUZA
(3075Z)
-40 to 85
8 Ld MSOP
(Pb-Free)
M8.118
ISL83076EIBZA
(83076EIBZ)
-40 to 85
14 Ld SOIC
(Pb-Free)
M14.15
ISL83077EIBZA
(83077EIBZ)
-40 to 85
8 Ld SOIC
(Pb-Free)
M8.15
ISL83078EIBZA
(83078EIBZ)
-40 to 85
8 Ld SOIC
(Pb-Free)
M8.15
ISL83078EIUZA
(3078Z)
-40 to 85
8 Ld MSOP
(Pb-Free)
M8.118
NOTES:
1. Units also available in Tape and Reel; Add "-T" to suffix.
2. Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and
100% matte tin plate termination finish, which are RoHS
compliant and compatible with both SnPb and Pb-free soldering
operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the
Pb-free requirements of IPC/JEDEC J STD-020.
Truth Tables
TRANSMITTING
INPUTS
OUTPUTS
RE
DE
DI
Z
Y
X
1
1
0
1
X
1
0
1
0
0
0
X
High-Z
High-Z
1
0
X
High-Z *
High-Z *
NOTE: *Shutdown Mode (See Note 9), except for ISL83071E/77E
RECEIVING
INPUTS
OUTPUT
RE
DE
Half Duplex
DE
Full Duplex
A-B
RO
0
0
X
-0.05V
1
0
0
X
-0.2V
0
0
0
X
Inputs
Open/Shorted
1
1
0
0
X
High-Z *
1
1
1
X
High-Z
NOTE: *Shutdown Mode (See Note 9), except for ISL83071E/77E
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
3
FN6115.1
August 5, 2005
Pin Descriptions
PIN
FUNCTION
RO
Receiver output: If A-B
-50mV, RO is high; If A-B -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted.
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low.
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND
Ground connection.
A/Y
15kV HBM ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if DE = 0;
pin is an output if DE = 1.
B/Z
15kV HBM ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an
output if DE = 1.
A
15kV HBM ESD Protected RS-485/422 level, noninverting receiver input.
B
15kV HBM ESD Protected RS-485/422 level, inverting receiver input.
Y
15kV HBM ESD Protected RS-485/422 level, noninverting driver output.
Z
15kV HBM ESD Protected RS-485/422 level, inverting driver output.
V
CC
System power supply input (3.0V to 3.6V).
NC
No Connection.
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
4
FN6115.1
August 5, 2005
Typical Operating Circuits
ISL83072E, ISL83075E, ISL83078E
ISL83071E, ISL83077E
ISL83070E, ISL83073E, ISL83076E
0.1
F
+
D
R
7
6
8
1
2
3
4
5
V
CC
GND
RO
RE
DE
DI
A / Y
B / Z
+3.3v
0.1
F
+
D
R
6
7
8
1
2
3
4
5
V
CC
GND
RO
RE
DE
DI
A / Y
B / Z
+3.3v
R
T
R
T
0.1
F
+
D
R
8
7
6
5
1
2
3
4
V
CC
GND
RO
DI
A
B
Y
Z
+3.3v
0.1
F
+
D
R
8
7
6
5
1
2
3
4
V
CC
GND
RO
DI
A
B
Y
Z
+3.3v
R
T
R
T
0.1
F
+
D
R
12
11
10
9
14
2
3
4
5
6, 7
V
CC
GND
RO
RE
DE
DI
A
B
Y
Z
+3.3v
0.1
F
+
D
R
12
11
10
9
14
2
3
4
5
6, 7
V
CC
GND
RO
RE
DE
DI
A
B
Y
Z
+3.3v
R
T
R
T
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
5
FN6115.1
August 5, 2005
Absolute Maximum Ratings
Thermal Information
V
CC
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input / Output Voltages
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V
CC
+0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . .-40C to 85C
Thermal Resistance (Typical, Note 3)
JA
(C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
105
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
140
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
128
Maximum Junction Temperature (Plastic Package) . . . . . . . 150C
Maximum Storage Temperature Range . . . . . . . . . . . -65C to 150C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300C
(Lead Tips Only)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: V
CC
= 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at V
CC
= 3.3V, T
A
= 25
C
,
Note 4
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(C)
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Driver Differential V
OUT
V
OD
R
L
= 100
(RS-422) (Figure 1A, Note 15)
Full
2
2.3
-
V
R
L
= 54
(RS-485) (Figure 1A)
Full
1.5
2
V
CC
V
No Load
-
-
V
CC
R
L
= 60
, -7V V
CM
12V (Figure 1B)
Full
1.5
2.2
-
V
Change in Magnitude of Driver
Differential V
OUT
for
Complementary Output States
V
OD
R
L
= 54
or 100 (Figure 1A)
Full
-
0.01
0.2
V
Driver Common-Mode V
OUT
V
OC
R
L
= 54
or 100 (Figure 1A)
Full
-
2
3
V
Change in Magnitude of Driver
Common-Mode V
OUT
for
Complementary Output States
V
OC
R
L
= 54
or 100 (Figure 1A)
Full
-
0.01
0.2
V
Logic Input High Voltage
V
IH
DI, DE, RE
Full
2
-
-
V
Logic Input Low Voltage
V
IL
DI, DE, RE
Full
-
-
0.8
V
Logic Input Hysteresis
V
HYS
DE, RE, (Note 14)
25
-
100
-
mV
Logic Input Current
I
IN1
DI = DE = RE = 0V or V
CC
Full
-2
-
2
A
Input Current (A, B, A/Y, B/Z)
I
IN2
DE = 0V, V
CC
= 0V or
3.6V
V
IN
= 12V
Full
-
80
125
A
V
IN
= -7V
Full
-100
-50
-
A
Output Leakage Current (Y, Z) (Full
Duplex Versions Only)
I
IN3
RE = 0V, DE = 0V,
V
CC
= 0V or 3.6V
V
IN
= 12V
Full
-
10
40
A
V
IN
= -7V
Full
-40
-10
-
A
Output Leakage Current (Y, Z)
in Shutdown Mode (Full Duplex)
I
IN4
RE = V
CC
, DE = 0V,
V
CC
= 0V or 3.6V
V
IN
= 12V
Full
-
10
40
A
V
IN
= -7V
Full
-40
-10
-
A
Driver Short-Circuit Current,
V
O
= High or Low
I
OSD1
DE = V
CC
, -7V
V
Y
or V
Z
12V (Note 6)
Full
-
-
250
mA
Receiver Differential Threshold
Voltage
V
TH
-7V
V
CM
12V
Full
-200
-125
-50
mV
Receiver Input Hysteresis
V
TH
V
CM
= 0V
25
-
15
-
mV
Receiver Output High Voltage
V
OH
I
O
= -4mA, V
ID
= -50mV
Full
V
CC
- 0.6
-
-
V
Receiver Output Low Voltage
V
OL
I
O
= -4mA, V
ID
= -200mV
Full
-
0.17
0.4
V
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
6
FN6115.1
August 5, 2005
Three-State (high impedance)
Receiver Output Current (Note 12)
I
OZR
0.4V
V
O
2.4V
Full
-1
0.015
1
A
Receiver Input Resistance
R
IN
-7V
V
CM
12V
Full
96
150
-
k
Receiver Short-Circuit Current
I
OSR
0V
V
O
V
CC
Full
7
30
60
mA
Thermal Shutdown Threshold
T
SD
Full
-
150
-
C
SUPPLY CURRENT
No-Load Supply Current (Note 5)
I
CC
DI = 0V or V
CC
DE = V
CC
,
RE = 0V or V
CC
Full
-
510
800
A
DE = 0V, RE = 0V
Full
-
480
700
A
Shutdown Supply Current
(Note 12)
I
SHDN
DE = 0V, RE = V
CC
, DI = 0V or V
CC
Full
-
0.01
1
A
ESD PERFORMANCE
RS-485 Pins (A, Y, B, Z)
Human Body Model (HBM), Pin to GND
25
-
15
-
kV
All Other Pins
HBM, per MIL-STD-883 Method 3015
25
-
>7
-
kV
DRIVER SWITCHING CHARACTERISTICS (ISL83070E, ISL83071E, ISL83072E, 250kbps)
Maximum Data Rate
f
MAX
V
OD
=
1.5V, C
D
= 820pF (Figure 4, Note 16)
Full
250
800
-
kbps
Driver Differential Output Delay
t
DD
R
DIFF
= 54
, C
D
= 50pF (Figure 2)
Full
250
1100
1500
ns
Driver Differential Output Skew
t
SKEW
R
DIFF
= 54
, C
D
= 50pF (Figure 2)
Full
-
6
100
ns
Driver Differential Rise or Fall Time
t
R
, t
F
R
DIFF
= 54
, C
D
= 50pF (Figure 2)
Full
350
960
1600
ns
Driver Enable to Output High
t
ZH
R
L
= 500
, C
L
= 50pF, SW = GND (Figure 3),
(Notes 7, 12)
Full
-
26
600
ns
Driver Enable to Output Low
t
ZL
R
L
= 500
, C
L
= 50pF, SW = V
CC
(Figure 3),
(Notes 7, 12)
Full
-
200
600
ns
Driver Disable from Output High
t
HZ
R
L
= 500
, C
L
= 50pF, SW = GND (Figure 3),
(Note 12)
Full
-
28
55
ns
Driver Disable from Output Low
t
LZ
R
L
= 500
, C
L
= 50pF, SW = V
CC
(Figure 3),
(Note 12)
Full
-
30
55
ns
Time to Shutdown
t
SHDN
(Notes 9, 12)
Full
50
200
600
ns
Driver Enable from Shutdown to
Output High
t
ZH(SHDN)
R
L
= 500
, C
L
= 50pF, SW = GND (Figure 3),
(Notes 9, 10, 12)
Full
-
180
700
ns
Driver Enable from Shutdown to
Output Low
t
ZL(SHDN)
R
L
= 500
, C
L
= 50pF, SW = V
CC
(Figure 3),
(Notes 9, 10, 12)
Full
-
100
700
ns
DRIVER SWITCHING CHARACTERISTICS (ISL83073E, ISL83075E, 500kbps)
Maximum Data Rate
f
MAX
V
OD
=
1.5V, C
D
= 820pF (Figure 4, Note 16)
Full
500
1600
-
kbps
Driver Differential Output Delay
t
DD
R
DIFF
= 54
, C
D
= 50pF (Figure 2)
Full
180
350
800
ns
Driver Differential Output Skew
t
SKEW
R
DIFF
= 54
, C
D
= 50pF (Figure 2)
Full
-
1
30
ns
Driver Differential Rise or Fall Time
t
R
, t
F
R
DIFF
= 54
, C
D
= 50pF (Figure 2)
Full
200
380
800
ns
Driver Enable to Output High
t
ZH
R
L
= 500
, C
L
= 50pF, SW = GND (Figure 3),
(Notes 7, 12)
Full
-
26
350
ns
Driver Enable to Output Low
t
ZL
R
L
= 500
, C
L
= 50pF, SW = V
CC
(Figure 3),
(Notes 7, 12)
Full
-
100
350
ns
Driver Disable from Output High
t
HZ
R
L
= 500
, C
L
= 50pF, SW = GND (Figure 3),
(Note 12)
Full
-
28
55
ns
Driver Disable from Output Low
t
LZ
R
L
= 500
, C
L
= 50pF, SW = V
CC
(Figure 3),
(Note 12)
Full
-
30
55
ns
Time to Shutdown
t
SHDN
(Notes 9, 12)
Full
50
200
600
ns
Electrical Specifications
Test Conditions: V
CC
= 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at V
CC
= 3.3V, T
A
= 25
C
,
Note 4 (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(C)
MIN
TYP
MAX
UNITS
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
7
FN6115.1
August 5, 2005
Driver Enable from Shutdown to
Output High
t
ZH(SHDN)
R
L
= 500
, C
L
= 50pF, SW = GND (Figure 3),
(Notes 9, 10, 12)
Full
-
180
700
ns
Driver Enable from Shutdown to
Output Low
t
ZL(SHDN)
R
L
= 500
, C
L
= 50pF, SW = V
CC
(Figure 3),
(Notes 9, 10, 12)
Full
-
100
700
ns
DRIVER SWITCHING CHARACTERISTICS (ISL83076E, ISL83077E, ISL83078E, 20Mbps)
Maximum Data Rate
f
MAX
V
OD
=
1.5V, C
D
= 350pF (Figure 4, Note 16)
Full
20
28
-
Mbps
Driver Differential Output Delay
t
DD
R
DIFF
= 54
, C
D
= 50pF (Figure 2)
Full
-
27
40
ns
Driver Differential Output Skew
t
SKEW
R
DIFF
= 54
, C
D
= 50pF (Figure 2)
Full
-
1
3
ns
Driver Output Skew, Part-to-Part
t
DSKEW
R
DIFF
= 54
, C
D
= 50pF (Figure 2, Note 13)
Full
-
-
11
ns
Driver Differential Rise or Fall Time
t
R
, t
F
R
DIFF
= 54
, C
D
= 50pF (Figure 2)
Full
-
9
15
ns
Driver Enable to Output High
t
ZH
R
L
= 500
, C
L
= 50pF, SW = GND (Figure 3),
(Notes 7, 12)
Full
-
17
50
ns
Driver Enable to Output Low
t
ZL
R
L
= 500
, C
L
= 50pF, SW = V
CC
(Figure 3),
(Notes 7, 12)
Full
-
16
40
ns
Driver Disable from Output High
t
HZ
R
L
= 500
, C
L
= 50pF, SW = GND (Figure 3),
(Note 12)
Full
-
25
40
ns
Driver Disable from Output Low
t
LZ
R
L
= 500
, C
L
= 50pF, SW = V
CC
(Figure 3),
(Note 12)
Full
-
28
50
ns
Time to Shutdown
t
SHDN
(Notes 9, 12)
Full
50
200
600
ns
Driver Enable from Shutdown to
Output High
t
ZH(SHDN)
R
L
= 500
, C
L
= 50pF, SW = GND (Figure 3),
(Notes 9, 10, 12)
Full
-
180
700
ns
Driver Enable from Shutdown to
Output Low
t
ZL(SHDN)
R
L
= 500
, C
L
= 50pF, SW = V
CC
(Figure 3),
(Notes 9, 10, 12)
Full
-
90
700
ns
RECEIVER SWITCHING CHARACTERISTICS (All Versions)
Maximum Data Rate
f
MAX
V
ID
=
1.5V (Note 16)
ISL83070E-75E
Full
12
20
-
Mbps
ISL83076E-78E
Full
20
35
-
Mbps
Receiver Input to Output Delay
t
PLH
, t
PHL
(Figure 5)
ISL83070E-75E
Full
25
70
120
ns
ISL83076E-78E
Full
25
33
60
ns
Receiver Skew | t
PLH
- t
PHL
|
t
SKD
(Figure 5)
Full
-
1.5
4
ns
Receiver Skew, Part-to-Part
t
RSKEW
(Figure 5, Note 13)
Full
-
-
15
ns
Receiver Enable to Output High
t
ZH
R
L
= 1k
, C
L
= 15pF,
SW = GND (Figure 6),
(Notes 8, 12)
ISL83070E-75E
Full
5
15
20
ns
ISL83076E-78E
Full
5
11
17
ns
Receiver Enable to Output Low
t
ZL
R
L
= 1k
, C
L
= 15pF,
SW = V
CC
(Figure 6),
(Notes 8, 12)
ISL83070E-75E
Full
5
15
20
ns
ISL83076E-78E
Full
5
11
17
ns
Receiver Disable from Output High
t
HZ
R
L
= 1k
, C
L
= 15pF,
SW = GND (Figure 6),
(Note 12)
ISL83070E-75E
Full
5
12
20
ns
ISL83076E-78E
Full
4
7
15
ns
Receiver Disable from Output Low
t
LZ
R
L
= 1k
, C
L
= 15pF,
SW = V
CC
(Figure 6),
(Note 12)
ISL83070E-75E
Full
5
13
20
ns
ISL83076E-78E
Full
4
7
15
ns
Time to Shutdown
t
SHDN
(Notes 9, 12)
Full
50
180
600
ns
Receiver Enable from Shutdown to
Output High
t
ZH(SHDN)
R
L
= 1k
, C
L
= 15pF, SW = GND (Figure 6),
(Notes 9, 11, 12)
Full
-
240
500
ns
Receiver Enable from Shutdown to
Output Low
t
ZL(SHDN)
R
L
= 1k
, C
L
= 15pF, SW = V
CC
(Figure 6),
(Notes 9, 11, 12)
Full
-
240
500
ns
Electrical Specifications
Test Conditions: V
CC
= 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at V
CC
= 3.3V, T
A
= 25
C
,
Note 4 (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(C)
MIN
TYP
MAX
UNITS
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
8
FN6115.1
August 5, 2005
NOTE:
4. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
5. Supply current specification is valid for loaded drivers when DE = 0V.
6. Applies to peak current. See "Typical Performance Curves" for more information.
7. When testing devices with the shutdown feature, keep RE = 0 to prevent the device from entering SHDN.
8. When testing devices with the shutdown feature, the RE signal high time must be short enough (typically <100ns) to prevent the device from
entering SHDN.
9. Versions with a shutdown feature are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns, the parts
are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See
"Low-Power Shutdown Mode" section.
10. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.
11. Set the RE signal high time >600ns to ensure that the device enters SHDN.
12. Does not apply to the ISL83071E and ISL83077E.
13.
t
SKEW
is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (V
CC
,
temperature, etc.). Only applies to the ISL83076E - 78E.
14. ISL83070E - ISL83075E only.
15. V
CC
3.15V
16. Guaranteed by design and characterization, but not production tested.
Test Circuits and Waveforms
FIGURE 1A. V
OD
AND V
OC
FIGURE 1B. V
OD
WITH COMMON MODE LOAD
FIGURE 1. DC DRIVER TEST CIRCUITS
Electrical Specifications
Test Conditions: V
CC
= 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at V
CC
= 3.3V, T
A
= 25
C
,
Note 4 (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(C)
MIN
TYP
MAX
UNITS
D
DE
DI
V
CC
V
OD
V
OC
R
L
/2
R
L
/2
Z
Y
D
DE
DI
V
CC
V
OD
375
375
Z
Y
R
L
= 60
V
CM
-7V to +12V
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
9
FN6115.1
August 5, 2005
FIGURE 2A. TEST CIRCUIT
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
FIGURE 3A. TEST CIRCUIT
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES (EXCEPT ISL83071E, ISL83077E)
FIGURE 4A. TEST CIRCUIT
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. DRIVER DATA RATE
Test Circuits and Waveforms
(Continued)
D
DE
DI
V
CC
SIGNAL
GENERATOR
C
D
R
DIFF
Z
Y
OUT (Z)
3V
0V
1.5V
1.5V
V
OH
V
OL
OUT (Y)
t
PLH
t
PHL
DIFF OUT (Y - Z)
t
R
+V
OD
-V
OD
90%
90%
t
F
10%
10%
DI
SKEW = |t
PLH
-
t
PHL
|
D
DE
DI
Z
Y
V
CC
GND
SW
PARAMETER
OUTPUT
RE
DI
SW
t
HZ
Y/Z
X
1/0
GND
t
LZ
Y/Z
X
0/1
V
CC
t
ZH
Y/Z
0 (Note 7)
1/0
GND
t
ZL
Y/Z
0 (Note 7)
0/1
V
CC
t
ZH(SHDN)
Y/Z
1 (Note 10)
1/0
GND
t
ZL(SHDN)
Y/Z
1 (Note 10)
0/1
V
CC
SIGNAL
GENERATOR
500
50pF
OUT (Y, Z)
3V
0V
1.5V
1.5V
V
OH
0V
V
OH
- 0.25V
t
HZ
OUT (Y, Z)
V
CC
V
OL
V
OL
+ 0.25V
t
LZ
DE
OUTPUT HIGH
OUTPUT LOW
t
ZL
, t
ZL(SHDN)
t
ZH
, t
ZH(SHDN)
NOTE 9
50%
50%
NOTE 9
NOTE 9
D
DE
DI
V
CC
SIGNAL
GENERATOR
Z
Y
C
D
V
OD
+
-
54
3V
0V
DIFF OUT (Y - Z)
+V
OD
-V
OD
DI
0V
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
10
FN6115.1
August 5, 2005
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a point-
to-multipoint (multidrop) standard, which allows only one
driver and up to 10 (assuming one unit load devices)
receivers on each bus. RS-485 is a true multipoint standard,
which allows up to 32 one unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 spec requires that
drivers must handle bus contention without sustaining any
damage.
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as
long as 4000', so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
Receiver Features
These devices utilize a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivity
is better than
200mV, as required by the RS-422 and RS-485
specifications.
Receiver input resistance of 96k
surpasses the RS-422
spec of 4k
, and is eight times the RS-485 "Unit Load (UL)"
requirement of 12k
minimum. Thus, these products are
known as "one-eighth UL" transceivers, and there can be up
to 256 of these devices on a network while still complying
with the RS-485 loading spec.
Receiver inputs function with common mode voltages as
great as +9V/-7V outside the power supplies (i.e., +12V and
FIGURE 5A. TEST CIRCUIT
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. RECEIVER PROPAGATION DELAY
FIGURE 6A. TEST CIRCUIT
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES (EXCEPT ISL83071E, ISL83077E)
Test Circuits and Waveforms
(Continued)
SIGNAL
GENERATOR
R
RO
RE
A
B
GND
15pF
RO
+1.5V
-1.5V
t
PLH
0V
0V
V
CC
0V
1.5V
1.5V
t
PHL
A
1k
V
CC
GND
SW
PARAMETER
DE
A
SW
t
HZ
X
+1.5V
GND
t
LZ
X
-1.5V
V
CC
t
ZH
(Note 8)
0
+1.5V
GND
t
ZL
(Note 8)
0
-1.5V
V
CC
t
ZH(SHDN)
(Note 11)
0
+1.5V
GND
t
ZL(SHDN)
(Note 11)
0
-1.5V
V
CC
SIGNAL
GENERATOR
R
RO
RE
A
B
GND
15pF
RO
3V
0V
1.5V
1.5V
V
OH
0V
1.5V
V
OH
- 0.25V
t
HZ
RO
V
CC
V
OL
1.5V
V
OL
+ 0.25V
t
LZ
RE
OUTPUT HIGH
OUTPUT LOW
t
ZL
, t
ZL(SHDN)
t
ZH
, t
ZH(SHDN)
NOTE 9
NOTE 9
NOTE 9
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
11
FN6115.1
August 5, 2005
-7V), making them ideal for long networks where induced
voltages, and ground potential differences, are realistic
concerns.
All the receivers include a "full fail-safe" function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating) or shorted. Fail-safe with shorted
inputs is achieved by setting the Rx upper switching point to
-50mV, thereby ensuring that the Rx sees 0V differential as a
high input level.
Receivers easily meet the data rates supported by the
corresponding driver, and all receiver outputs - except on the
ISL83071E and ISL83077E- are tri-statable via the active
low RE input.
Driver Features
The RS-485/422 driver is a differential output device that
delivers at least 1.5V across a 54
load (RS-485), and at
least 2V across a 100
load (RS-422). The drivers feature
low propagation delay skew to maximize bit width, and to
minimize EMI.
All drivers are tri-statable via the active high DE input, except
on the ISL83071E and ISL83077E.
The 250kbps and 500kbps driver outputs are slew rate
limited to minimize EMI, and to reduce reflections in
unterminated or improperly terminated networks. Outputs of
the ISL83076E, ISL83078E drivers are not limited, so faster
output transition times allow data rates of at least 20Mbps.
Hot Plug Function
When a piece of equipment powers up, there is a period of
time where the processor or ASIC driving the RS-485 control
lines (DE, RE) is unable to ensure that the RS-485 Tx and
Rx outputs are kept disabled. If the equipment is connected
to the bus, a driver activating prematurely during power up
may crash the bus. To avoid this scenario, the ISL8307XE
family incorporates a "Hot Plug" function. During power up,
circuitry monitoring V
CC
ensures that the Tx and Rx outputs
remain disabled for a period of time, regardless of the state of
DE and RE. This gives the processor/ASIC a chance to
stabilize and drive the RS-485 control lines to the proper states.
ESD Protection
All pins on these devices include class 3 (>7kV) Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs and receiver inputs)
incorporate advanced structures allowing them to survive
ESD events in excess of
15kV HBM. The RS-485 pins are
particularly vulnerable to ESD damage because they
typically connect to an exposed port on the exterior of the
finished product. Simply touching the port pins, or
connecting a cable, can cause an ESD event that might
destroy unprotected ICs. These new ESD structures
protect the device whether or not it is powered up, protect
without allowing any latchup mechanism to activate, and
without degrading the RS-485 common mode range of -7V
to +12V. This built-in ESD protection eliminates the need
for board level protection structures (e.g., transient
suppression diodes), and the associated, undesirable
capacitive load they present.
Data Rate, Cables, and Terminations
RS-485/422 are intended for network lengths up to 4000',
but the maximum system data rate decreases as the
transmission length increases. Devices operating at 20Mbps
are limited to lengths less than 100', while the 250kbps
versions can operate at full data rates with lengths of several
thousand feet.
Twisted pair is the cable of choice for RS-485/422 networks.
Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common mode
signals, which are effectively rejected by the differential
receivers in these ICs.
Proper termination is imperative, when using the 20Mbps
devices, to minimize reflections. Short networks using the
250kbps versions need not be terminated, but, terminations
are recommended unless power dissipation is an overriding
concern.
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120
) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as
short as possible. Multipoint (multi-driver) systems require
that the main cable be terminated in its characteristic
impedance at both ends. Stubs connecting a transceiver to
the main cable should be kept as short as possible.
Built-In Driver Overload Protection
As stated previously, the RS-485 spec requires that drivers
survive worst case bus contentions undamaged. These
devices meet this requirement via driver output short circuit
current limits, and on-chip thermal shutdown circuitry.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 spec, even at the common mode
voltage range extremes. Additionally, these devices utilize a
foldback circuit which reduces the short circuit current, and
thus the power dissipation, whenever the contending voltage
exceeds either supply.
In the event of a major short circuit condition, devices also
include a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to cool. The
drivers automatically re-enable after the die temperature
drops about 15 degrees. If the contention persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared.
Receivers stay operational during thermal shutdown.
Low Power Shutdown Mode
These CMOS transceivers all use a fraction of the power
required by their bipolar counterparts, but some also include
a shutdown feature that reduces the already low quiescent
I
CC
to a 10nA trickle. These devices enter shutdown
whenever the receiver and driver are simultaneously
disabled (RE = V
CC
and DE = GND) for a period of at least
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
12
FN6115.1
August 5, 2005
600ns. Disabling both the driver and the receiver for less
than 50ns guarantees that the transceiver will not enter
shutdown.
Note that receiver and driver enable times increase when the
transceiver enables from shutdown. Refer to Notes 7-11, at the
end of the Electrical Specification table, for more information.
Typical Performance Curves
V
CC
= 3.3V, T
A
= 25C; Unless Otherwise Specified
FIGURE 7. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FIGURE 8. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
FIGURE 9. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
FIGURE 10. SUPPLY CURRENT vs TEMPERATURE
DIFFERENTIAL OUTPUT VOLTAGE (V)
DR
IVE
R
OUT
P
UT
CURRENT (mA)
0
0.5
1
1.5
2
2.5
3
3.5
0
20
40
60
80
100
120
-40
0
50
85
TEMPERATURE (C)
DIF
F
E
R
E
N
T
I
AL OUTPUT V
O
LTA
GE
(V)
-25
25
75
R
DIFF
= 54
R
DIFF
= 100
1.85
1.9
1.95
2
2.05
2.1
2.15
2.2
2.25
2.3
2.35
OUTPUT VOLTAGE (V)
-7 -6
-4
-2
0
2
4
6
8
10
12
OUTPUT CURR
E
N
T
(mA)
-50
0
50
100
150
200
-100
-150
Y OR Z = HIGH
Y OR Z = LOW
ISL8307XE
ISL83070E thru ISL83075E
ISL83076E/77/78E
-40
0
50
85
TEMPERATURE (C)
I
CC
(mA)
-25
25
75
0.46
0.47
0.48
0.49
0.5
0.51
0.52
ISL83072/5/8E, DE = V
CC
, RE = X
ISL83070/3/6E, DE = X, RE = 0V; ISL83071/77E
ISL83072/5/8E, DE = 0V, RE = 0V
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
13
FN6115.1
August 5, 2005
FIGURE 11. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL83070E, ISL83071E,
ISL83072E)
FIGURE 12.
DRIVER
DIFFERENTIAL
SKEW
vs
TEMPERATURE (ISL83070E, ISL83071E,
ISL83072E)
FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL83073E, ISL83075E)
FIGURE 14.
DRIVER
DIFFERENTIAL
SKEW
vs
TEMPERATURE (ISL83073E, ISL83075E)
FIGURE 15. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL83076E, 77E, 78E)
FIGURE 16.
DRIVER
DIFFERENTIAL
SKEW
vs
TEMPERATURE (ISL83076E, 77E, 78E)
Typical Performance Curves
V
CC
= 3.3V, T
A
= 25C; Unless Otherwise Specified (Continued)
-40
0
50
85
TEMPERATURE (C)
-25
25
75
PROP
AGATION DELAY
(ns)
t
PLH
t
PHL
1080
1100
1120
1140
1160
1180
1200
1220
-40
0
50
85
TEMPERATURE (C)
SKEW (ns)
-25
25
75
|CROSS PT. OF Y
& Z
- CROSS PT. OF Y
& Z
|
5.5
6
6.5
7
7.5
8
-40
0
50
85
TEMPERATURE (C)
-25
25
75
PROPAGATION DE
L
A
Y
(ns
)
t
PLH
t
PHL
340
345
350
355
360
365
370
-40
0
50
85
TEMPERATURE (C)
SKEW (ns)
-25
25
75
|CROSS PT. OF Y
& Z
- CROSS PT. OF Y
& Z
|
0.2
0.4
0.6
0.8
1
1.2
1.4
-40
0
50
85
TEMPERATURE (C)
-25
25
75
P
R
OPAGAT
ION DELAY (ns)
22
23
24
25
26
27
28
29
30
31
32
t
PHL
t
PLH
-40
0
50
85
TEMPERATURE (C)
SK
EW
(n
s)
-25
25
75
|CROSS PT. OF Y
& Z
- CROSS PT. OF Y
& Z
|
0.6
0.65
0.7
0.75
0.8
0.85
0.9
0.95
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
14
FN6115.1
August 5, 2005
FIGURE 17.
DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH
(ISL83070E, ISL83071E,
ISL83072E)
FIGURE 18.
DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW
(ISL8070E, ISL83071E, ISL83072E
)
FIGURE 19.
DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH
(ISL83073E, ISL83075E)
FIGURE 20.
DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW
(ISL8073E, ISL83075E
)
FIGURE 21.
DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH
(ISL83076E, 77E, 78E)
FIGURE 22.
DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW
(ISL8076E, 77E, 78E
)
Typical Performance Curves
V
CC
= 3.3V, T
A
= 25C; Unless Otherwise Specified (Continued)
TIME (400ns/DIV)
RECE
IV
ER OUT
P
UT (V
)
R
DIFF
= 54
, C
D
= 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIV
E
R INPUT (V)
DI
RO
0
0.5
1
1.5
2
2.5
3
B/Z
A/Y
TIME (400ns/DIV)
RECE
IVE
R
OUT
P
UT
(V
)
R
DIFF
= 54
, C
D
= 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIV
E
R INPUT
(V)
DI
RO
0
0.5
1
1.5
2
2.5
3
B/Z
A/Y
TIME (200ns/DIV)
RE
CE
IV
ER OUT
P
UT
(V
)
R
DIFF
= 54
, C
D
= 50pF
0
5
D
R
IV
ER
O
U
TP
UT (
V
)
0
5
DRI
VER INPUT (V)
DI
RO
0
0.5
1
1.5
2
2.5
3
B/Z
A/Y
TIME (200ns/DIV)
RECE
IV
ER OUTPUT (V
)
R
DIFF
= 54
, C
D
= 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIV
E
R INPUT (V)
DI
RO
0
0.5
1
1.5
2
2.5
3
B/Z
A/Y
TIME (10ns/DIV)
RECEIVER OUTPUT (V)
R
DIFF
= 54
, C
D
= 50pF
0
5
DRIV
E
R OUTPUT
(
V
)
0
5
D
R
IV
ER INP
U
T (V
)
DI
RO
0
0.5
1
1.5
2
2.5
3
B/Z
A/Y
TIME (10ns/DIV)
RECEIVER OUTPUT (V)
R
DIFF
= 54
, C
D
= 50pF
0
5
DRIV
E
R OUTPUT (V
)
0
5
D
R
IV
ER
INP
U
T
(
V
)
DI
RO
0
0.5
1
1.5
2
2.5
3
B/Z
A/Y
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
15
FN6115.1
August 5, 2005
FIGURE 23. RECEIVER OUTPUT CURRENT vs RECEIVER
OUTPUT VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
535
PROCESS:
Si Gate BiCMOS
Typical Performance Curves
V
CC
= 3.3V, T
A
= 25C; Unless Otherwise Specified (Continued)
RECEIVER OUTPUT VOLTAGE (V)
RE
CEIVER OUTPUT
CURRENT (m
A)
0
1
2
3
3.5
1.5
2.5
0.5
0
5
10
15
20
25
30
35
V
OH
, 25C
V
OH
, 85C
V
OL
, 25C
V
OL
, 85C
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
16
FN6115.1
August 5, 2005
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension "D" does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension "E1" does not include interlead flash or protrusions
and are measured at Datum Plane.
Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. "L" is the length of terminal for soldering to a substrate.
7. "N" is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension "b" does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of "b" dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums
and
to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
L
0.25
(0.010)
L1
R1
R
4X
4X
GAUGE
PLANE
SEATING
PLANE
E
E1
N
1 2
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008)
A B C
SEATING
PLANE
0.20 (0.008)
C
0.10 (0.004)
C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008)
C D
E
1
CL
C
a
- H -
-A -
- B -
- H -
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
e
0.026 BSC
0.65 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
L1
0.037 REF
0.95 REF
-
N
8
8
7
R
0.003
-
0.07
-
-
R1
0.003
-
0.07
-
-
0
5
o
15
o
5
o
15
o
-
0
o
6
o
0
o
6
o
-
Rev. 2 01/03
17
FN6115.1
August 5, 2005
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
C
H
0.25(0.010)
B
M
M
NOTES:
1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension "D" does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension "E" does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. "L" is the length of terminal for soldering to a substrate.
7. "N" is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width "B", as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15
(JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
8
8
7
0
8
0
8
-
Rev. 1 6/05
18
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6115.1
August 5, 2005
ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension "D" does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension "E" does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. "L" is the length of terminal for soldering to a substrate.
7. "N" is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width "B", as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010)
B
M
M
M14.15
(JEDEC MS-012-AB ISSUE C)
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3367
0.3444
8.55
8.75
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
14
14
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
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