Rev. 1.00
1
June 30, 2003
HT36B0
8-Bit Music Synthesizer MCU
Block Diagram
Features
Operating voltage: 3.6V~5.0V
Operating frequency: 3.58MHz~12MHz,
RC typ. 11.059MHz
36 bidirectional I/O lines
Two 16-bit programmable timer/event counters with
overflow interrupts
Watchdog Timer
Built-in 8-bit MCU with 768
8 bits RAM
Built-in 256K
16-bit ROM for program/data shared
Digital output pins for external DAC
Single data format with 16 bits digital stereo audio
output
MIDI interface available
Two High D/A converter resolution: 16 bits
Polyphonic up to 16 notes
Independent pan and volume mix can be assigned to
each sound component
Sampling rate of 44.1kHz as 11.059MHz for system
frequency
Eight-level subroutine nesting
HALT function and wake-up feature to reduce power
consumption
Bit manipulation instructions
16-bit table read instructions
63 powerful instructions
All instructions in 1 or 2 machine cycles
UART input/output 31.25kbps
28-pin SOP, 64-pin QFP package
General Description
The HT36B0 is an 8-bit high performance RISC-like
microcontroller specifically designed for music applica-
tions. It provides an 8-bit MCU and a 16 channel
wavetable synthesizer. The program ROM is composed
of both program control codes and wavetable voice
codes, and can be easily programmed.
The HT36B0 has a built-in 8-bit microprocessor which
programs the synthesizer to generate the melody by
setting the special register from 20H~2AH. A HALT fea-
ture is provided to reduce power consumption.
8 - B i t
M C U
M u l t i p l i e r / P h a s e
G e n e r a l
S t e r e o
1 6 - B i t
D A C
P A 0 ~ P A 7
P B 0 ~ P B 7
P C 0 ~ P C 7
P D 0 ~ P D 7
P E 0 ~ P E 3
O S C 1
O S C 2
R E S
V D D
V S S
V D D A
V S S A
L C H
R C H
I N T
M I D I _ I N
M I D I _ O U T
M I D I _ T H R U
7 6 8 8
R A M
2 5 6 K 1 6 - b i t
R O M
D
C
L
K
L
O
A
D
D
O
U
T
Pin Assignment
HT36B0
Rev. 1.00
2
June 30, 2003
2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
1 5
1 6
1 7
1 8
1 9
5 1
5 0
4 9
4 8
4 7
4 6
4 5
4 4
4 3
4 2
4 1
4 0
3 9
3 8
3 7
3 6
3 5
3 4
3 3
6 1 6 0 5 9 5 8 5 7 5 6 5 5 5 4 5 3 5 2
6 4 6 3 6 2
H T 3 6 B 0
6 4 Q F P - A
R C H
L C H
V D D A
V S S A
O S C 2
O S C 1
V S S
V D D
R E S
M I D I _ O U T
M I D I _ T H R U
M I D I _ I N
P C 7
P C 6
P C 5
P C 4
P C 3
P C 2
N C
P E 2
P E 3
I N T
P A 0
P A 1
P A 2
P A 3
P A 4
P A 5
P A 6
P A 7
P B 0
P B 1
P B 2
P B 3
P B 4
P B 5
P B 6
P B 7
P
C
0
P
C
1
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
P
E
1
P
E
0
P
D
7
P
D
6
P
D
5
P
D
4
P
D
3
P
D
2
P
D
1
P
D
0
D
O
U
T
L
O
A
D
D
C
K
2 8
2 7
2 6
2 5
2 4
2 3
2 2
2 1
2 0
1 9
1 8
1 7
1 6
1 5
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
H T 3 6 B 0
2 8 S O P - A
V S S
V D D
R E S
M I D I _ O U T
M I D I _ T H R U
M I D I _ I N
N C
N C
N C
N C
N C
P A 7
P A 6
P A 5
O S C 1
O S C 2
V S S A
V D D A
L C H
R C H
N C
N C
I N T
P A 0
P A 1
P A 2
P A 3
P A 4
Pad Assignment
Chip size: 132.5
194.7 (mil)
* The IC substrate should be connected to VSS in the PCB layout artwork.
HT36B0
Rev. 1.00
3
June 30, 2003
4 3
4 4
4 5
4 6
4 7
4 8
4 9
5 0
5 1
5 2
1
4 2
4 1
3 6
3 7
3 8
3 9
4 0
3 5
3 4
3 3
3 2
3 1
3 0
2 9
2 8
2 7
2 6
2 5
2 4
2 3
2 2
2 1
2 0
1 9
1 8
1 7
1 6
1 5
1 4
1 3
1 2
1 1
1 0
9
8
7
6
5
4
3
2
( 0 , 0 )
P
C
2
O
S
C
2
O
S
C
1
R
E
S
V
S
S
V
D
D
P
B
0
P
B
1
P
B
2
P
B
3
P
B
4
P
B
5
P
B
6
P B 7
P
A
0
P
A
1
P
A
2
P
A
3
P
A
4
P
A
5
P
A
6
P
A
7
P C 0
P C 1
P
C
3
P
E
3
I
N
T
P E 2
P E 1
P E 0
P D 7
P D 6
P D 5
P D 4
P D 3
P D 2
P D 1
P D 0
D O U T
L O A D
D C K
R
C
H
L
C
H
V
D
D
A
V
S
S
A
M
I
D
I
_
O
U
T
M
I
D
I
_
T
H
R
U
M
I
D
I
_
I
N
P
C
7
P
C
6
P
C
5
P
C
4
Pad Coordinates
Unit:
mm
Pad No.
X
Y
Pad No.
X
Y
1
-1496.60
2302.60
27
1515.85
85.70
2
-1517.35
-1856.15
28
1515.85
196.30
3
-1517.35
-1966.75
29
1515.85
296.30
4
-1517.35
-2066.75
30
1515.85
406.90
5
-1496.90
-2307.35
31
1515.85
506.90
6
-1396.90
-2307.35
32
1515.85
617.50
7
-1286.30
-2307.35
33
1515.85
717.75
8
-1186.30
-2307.35
34
1515.85
825.85
9
-1075.70
-2307.35
35
1515.85
926.35
10
-975.70
-2307.35
36
1517.85
2262.00
11
-865.10
-2307.35
37
1404.55
2262.00
12
546.65
-2307.35
38
1292.11
2262.00
13
657.25
-2307.35
39
1143.45
2262.00
14
757.25
-2307.35
40
975.076
2282.60
15
867.85
-2307.35
41
294.224
2282.60
16
967.85
-2307.35
42
176.10
2300.10
17
1078.45
-2307.35
43
-431.00
2300.10
18
1178.45
-2307.35
44
-547.124
2302.60
19
1289.05
-2307.35
45
-654.20
2302.60
20
1391.25
-2307.35
46
-754.20
2302.60
21
1499.65
-2307.35
47
-864.80
2302.60
22
1515.85
-435.50
48
-964.80
2302.60
23
1515.85
-335.50
49
-1075.40
2302.60
24
1515.85
-224.90
50
-1175.40
2302.60
25
1515.85
-124.90
51
-1286.00
2302.60
26
1515.85
-14.30
52
-1386.00
2302.60
Pad Description
Pad Name
I/O
Internal
Connection
Function
PA7~PA0
I/O
Pull-High
or None
Bidirectional 8-bit Input/Output port, wake-up by mask option
PB7~PB0
I/O
Pull-High
or None
Bidirectional 8-bit Input/Output port
PC7~PC0
I/O
Pull-High
or None
Bidirectional 8-bit Input/Output port
PD0~PD7
I/O
Pull-High
or None
Bidirectional 8-bit Input/Output port
PE0~PE3
I/O
Pull-High
or None
Bidirectional 4-bit Input/Output port
INT
I
Pull-High
External interrupt
DOUT
O
DAC data out
LOAD
O
DAC word clock
DCLK
O
DAC bit clock
RCH
O
R channel audio output
LCH
O
L channel audio output
HT36B0
Rev. 1.00
4
June 30, 2003
Pad Name
I/O
Internal
Connection
Function
VDDA
DAC power supply
VSSA
Negative power supply of DAC, ground
OSC1
OSC2
I
O
OSC1 and OSC2 are connected to an RC network or a crystal (by mask
option) for the internal system clock. In the case of RC operation, OSC2 is
the output terminal for 1/8 system clock. The system clock may come from
the crystal, the two pins cannot be floating.
GND
Negative power supply, ground
VDD
Positive power supply
RES
I
Reset input, active low
MIDI_OUT
O
MIDI Output
MIDI_THRN
O
MIDI through
MIDI_IN
I
MIDI input
Absolute Maximum Ratings
Supply Voltage .............................V
SS
-0.3V to V
SS
+6V
Storage Temperature ...........................
-50C to 125C
Input Voltage .............................V
SS
-0
.
3V to V
DD
+0.3V
Operating Temperature ..........................
-25C to 70C
Note: These are stress ratings only. Stresses exceeding the range specified under
Absolute Maximum Ratings may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
D.C. Characteristics
Ta=25
C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
DD
Conditions
V
DD
Operating Voltage
3.6
4.5
5.5
V
I
DD
Operating Current
4.5V
No load,
f
OSC
=11.0592MHz
16
32
mA
I
STB
Standby Current (WDT Disabled)
4.5V
No load,
System HALT
1
3
mA
I
OH
I/O Ports Source Current
4.5V
V
OH
=4.5V
5
mA
I
OL
I/O Ports Sink Current
4.5V
V
OL
=0.5V
5
mA
V
IH
Input High Voltage for I/O Ports
4.5V
0.8V
DD
V
DD
V
V
IL
Input Low Voltage for I/O Ports
4.5V
0
0.2V
DD
V
R
PH
Pull-High Resistance of I/O Ports (INT) 4.5V
V
IL
=0V
30
k
W
HT36B0
Rev. 1.00
5
June 30, 2003
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