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Электронный компонент: MRF9582NT1

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MRF9582NT1
1
RF Device Data
Freescale Semiconductor
Silicon Lateral FET, N-Channel
Enhancement-Mode MOSFET
Designed for use in medium voltage, moderate power amplifiers such as
portable analog and digital cellular radios and PC RF modems.
Typical CW RF Performance @ 849 MHz: V
DD
= 12.5 Volts, I
DQ
= 300 mA,
P
out
= 38 dBm
Power Gain -- 10.5 dB
Drain Efficiency -- 55%
Capable of Handling 10:1 VSWR, @ 12.5 Vdc, 849 MHz, 38 dBm
RoHS Compliant
In Tape and Reel. T1 Suffix = 1,000 Units per 12 mm, 7 inch Reel
Table 1. Maximum Ratings
Rating
Symbol
Value
Unit
Drain-Source Voltage
V
DSS
17
Vdc
Drain-Gate Voltage (R
GS
= 1.0 M)
V
DGO
17
Vdc
Gate-Source Voltage
V
GS
4.0
Vdc
Drain Current - Continuous
I
D
1.5
Adc
Total Device Dissipation @ T
C
= 85C
P
D
10.5
W
Storage Temperature Range
T
stg
-65 to 150
C
Operating Junction Temperature
T
J
150
C
Table 2. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction-to-Case
R
JC
6
C/W
Table 3. Moisture Sensitivity Level
Test Methodology
Rating
Package Peak Temperature
Unit
Per JESD 22-A113, IPC/JEDEC J-STD-020
1
260
C
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
Document Number: MRF9582NT1
Rev. 1, 7/2006
Freescale Semiconductor
Technical Data
MRF9582NT1
849 MHz, 38 dBm, 12.5 V
HIGH FREQUENCY
POWER TRANSISTOR
LDMOS FET
CASE 449-02, STYLE 1
PLD-1
4
1
2
3
Freescale Semiconductor, Inc., 2006. All rights reserved.
2
RF Device Data
Freescale Semiconductor
MRF9582NT1
Table 4. Electrical Characteristics
(T
C
= 25C, unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Off Characteristics
Drain-Source Breakdown Voltage (V
GS
= 0, I
D
= 100 nAdc)
V
(BR)DSS
--
45
--
Vdc
Drain-Source Leakage Current (V
DS
= 12.5 Vdc, V
GS
= 0)
I
DSS
--
--
100
nAdc
Gate-Source Leakage Current (V
GS
= 5 Vdc, V
DS
= 0)
I
GSS
--
--
100
nAdc
On Characteristics
Gate Threshold Voltage
V
GS
--
2.4
--
Vdc
Resistance Drain-Source (V
GS
= 5 Vdc, I
D
= 300 mA)
R
DS(on)
0.05
0.5
0.8
Dynamic Characteristics
Input Capacitance (V
DS
= 12.5 Vdc, V
GS
= 0, f = 1.0 MHz)
C
iss
--
30.77
--
pF
Output Capacitance (V
DS
= 12.5 Vdc, V
GS
= 0, f = 1.0 MHz)
C
oss
--
15.6
--
pF
Feedback Capacitance (V
DS
= 12.5 Vdc, V
GS
= 0, f = 1.0 MHz)
C
rss
--
0.82
--
pF
Typical Characteristics
Power Gain (V
DD
= 12.5 Vdc, P
in
= 27.5 dBm, f = 849 MHz)
G
ps
--
10.5
--
dB
Drain Efficiency (V
DD
= 12.5 Vdc, P
in
= 27.5 dBm, f = 849 MHz)
D
--
55
--
%
Output Power
P
out
--
38
--
dBm
MRF9582NT1
3
RF Device Data
Freescale Semiconductor
TYPICAL CHARACTERISTICS
I
DQ
, QUIESCENT CURRENT (mA)
OUTPUT POWER (dBm)
EFFICIENCY (%)
OUTPUT POWER (dBm)
400
820
70
820
39
820
40
820
f, FREQUENCY (MHz)
f, FREQUENCY (MHz)
f, FREQUENCY (MHz)
Figure 1. Output Power versus Frequency
f, FREQUENCY (MHz)
Figure 2. Efficiency versus Frequency
P
in
= 27.5 dBm
T
A
= 25
C
V
g
= 2.4 V
Figure 3. Output Power versus Frequency
Figure 4. Quiescent Current versus Frequency
825
830
835
840
845
850
855
39.5
39
38.5
38
37.5
37
11.25 V
12.50 V
13.75 V
P
in
= 27.5 dBm
T
A
= 25
C
V
g
= 2.4 V
825
830
835
840
845
850
855
68
66
64
62
60
11.25 V
12.50 V
13.75 V
825
830
835
840
845
850
855
38.8
38.6
38.4
38.2
38
P
in
= 27.5 dBm
V
DD
= 12.5 V
V
g
= 2.4 V
85
C
25
C
-35
C
85
C
25
C
-35
C
825
830
835
840
845
850
855
P
in
= 27.5 dBm
V
DD
= 12.5 V
V
g
= 2.4 V
350
300
250
200
150
100
4
RF Device Data
Freescale Semiconductor
MRF9582NT1
Figure 5. Series Equivalent Source and Load Impedance
f
MHz
Z
source
Z
load
849
2.5 - j2.5
2.5 + j0.5
V
DD
= 12.5 Vdc, I
DQ
= 300 mA, P
out
= 38 dBm
Z
o
= 5
Z
load
f = 849
MHz
Z
source
=
Test circuit impedance as measured from
gate to ground.
Z
load
=
Test circuit impedance as measured
from drain to ground.
Z source
Z load
Input
Matching
Network
Device
Under
Test
Output
Matching
Network
Z
source
f = 849
MHz
MRF9582NT1
5
RF Device Data
Freescale Semiconductor
NOTES
6
RF Device Data
Freescale Semiconductor
MRF9582NT1
NOTES
MRF9582NT1
7
RF Device Data
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 449-02
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DRAFT
A
STYLE 1:
PIN 1. DRAIN
2. GATE
3. SOURCE
4. SOURCE
L
S
K
B
R
Q
4
1
3
2
N
M
4 PL
F
2 PL
ZONE V
P
C
E
W
8 PL
ZONE U
RESIN BLEED/FLASH
ALLOWABLE
D
2 PL
J
8 PL
G
H
T
Y
X
Z
AA
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.185
0.195
4.70
4.95
B
0.175
0.185
4.44
4.70
C
0.058
0.064
1.47
1.63
D
0.017
0.023
0.43
0.58
E
0.014
0.017
0.36
0.43
F
0.027
0.033
0.69
0.84
G
0.071
0.077
1.80
1.96
H
0.017
0.023
0.43
0.58
J
0.000
0.007
0.00
0.18
K
0.018
0.026
0.46
0.66
L
0.253
0.263
6.43
6.68
M
5 REF
5 REF
N
1.75 REF
4.44 REF
P
0.000
0.006
0.00
0.15
Q
0.120
0.130
3.05
3.30
R
0.220
0.230
5.59
5.84
S
0.030
0.038
0.76
0.97
T
0.050
0.060
1.27
1.52
U
0.000
0.018
0.00
0.46
V
0.000
0.014
0.00
0.36
W
0.004
0.016
0.10
0.41
X
0.131
0.141
3.33
3.58
Y
0.065
0.075
1.65
1.90
Z
0.089
0.099
2.26
2.51
AA
0.056
0.066
1.42
1.67
_
_
8
RF Device Data
Freescale Semiconductor
MRF9582NT1
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Freescale Semiconductor, Inc. 2006. All rights reserved.
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Document Number: MRF9582NT1
Rev. 1, 7/2006