1
Motorola Sensor Device Data
Media Resistant, Integrated Silicon
Pressure Sensor for Manifold
Absolute Pressure, Altimeter or
Barometer Applications
On-Chip Signal Conditioned,
Temperature Compensated, and
Calibrated
Motorola's MPXAZ4115A series sensor integrates onchip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature compensation.
The small form factor and high reliability of onchip integration make the Motorola pressure
sensor a logical and economical choice for the system designer.
The MPXAZ4115A series piezoresistive transducer is a stateoftheart, monolithic,
signal conditioned, silicon pressure sensor. This sensor combines advanced
micromachining techniques, thin film metallization, and bipolar semiconductor processing to
provide an accurate, high level analog output signal that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure
sensor chip.
Features
Resistant to high humidity and common automotive media
1.5% Maximum Error over 0
to 85
C
Ideally suited for Microprocessor or Microcontroller
Based Systems
Temperature Compensated from 40
to +125
C
Durable Thermoplastic (PPS) Surface Mount Package
Application Examples
Aviation Altimeters
Industrial Controls
Engine Control
Weather Stations and Weather Reporting Devices
Figure 1. Fully Integrated Pressure Sensor Schematic
V
S
SENSING
ELEMENT
V
out
GND
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS
FOR SMALL OUTLINE PACKAGE DEVICE
Order this document
by MPXAZ4115A/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 2001
5
6
7
8
Gnd
V
out
4
1
2
3
MPXAZ4115A
SERIES
INTEGRATED
PRESSURE SENSOR
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.8 V Output
PIN NUMBER
N/C
V
S
N/C
N/C
N/C
N/C
NOTE: Pins 1, 5, 6, 7, and 8 are not
device connections. Do not connect to
external circuitry or ground. Pin 1 is
noted by the notch in the lead.
MPXAZ4115AC6U
CASE 482A
SMALL OUTLINE PACKAGE
MPXAZ4115A6U
CASE 482
Rev 0
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MPXAZ4115A SERIES
2
Motorola Sensor Device Data
MAXIMUM RATINGS
(NOTE)
Parametrics
Symbol
Value
Units
Maximum Pressure (P1
u
P2)
P
max
400
kPa
Storage Temperature
T
stg
40
to +125
C
Operating Temperature
T
A
40
to +125
C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS
(V
S
= 5.1 Vdc, T
A
= 25
C unless otherwise noted, P1
u
P2. Decoupling circuit shown in Figure 3
required to meet Electrical Specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
P
OP
15
--
115
kPa
Supply Voltage
(1)
V
S
4.85
5.1
5.35
Vdc
Supply Current
I
o
--
7.0
10
mAdc
Minimum Pressure Offset
(2)
(0 to 85
C)
@ V
S
= 5.1 Volts
V
off
0.135
0.204
0.273
Vdc
Full Scale Output
(3)
(0 to 85
C)
@ V
S
= 5.1 Volts
V
FSO
4.725
4.794
4.863
Vdc
Full Scale Span
(4)
(0 to 85
C)
@ V
S
= 5.1 Volts
V
FSS
4.521
4.590
4.659
Vdc
Accuracy
(5)
(0 to 85
C)
--
--
--
1.5
%V
FSS
Sensitivity
V/P
--
45.9
--
mV/kPa
Response Time
(6)
t
R
--
1.0
--
ms
Output Source Current at Full Scale Output
I
o+
--
0.1
--
mAdc
WarmUp Time
(7)
--
--
20
--
ms
Offset Stability
(8)
--
--
0.5
--
%V
FSS
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (V
FSO
) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25
C due to all sources of error including the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential
pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25
C.
TcSpan:
Output deviation over the temperature range of 0
to 85
C, relative to 25
C.
TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0
to 85
C, relative
to 25
C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warmup Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
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2005
MPXAZ4115A SERIES
3
Motorola Sensor Device Data
WIRE BOND
STAINLESS
STEEL CAP
THERMOPLASTIC
CASE
DIE BOND
SEALED VACUUM REFERENCE
DIE
P1
FLUORO SILICONE
GEL DIE COAT
LEAD
FRAME
ABSOLUTE ELEMENT
Figure 2. Cross Sectional Diagram SOP
(not to scale)
1.0 mF
IPS
470 pF
OUTPUT
Vs
+5 V
0.01 mF
GND
Vout
Figure 3. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 482).
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
OUTPUT
(V
olts)
5.0
4.5
4.0
3.5
3.0
Pressure (ref: to sealed vacuum) in kPa
TYP
MAX
MIN
5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95
100 105
2.5
2.0
1.5
1.0
0.5
0
11
0
Figure 4. Output versus Absolute Pressure
TRANSFER FUNCTION:
V
out
= V
s
* (.009*P-.095)
Error
V
S
= 5.1 Vdc
TEMP = 0 to 85
C
11
5
120
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical minimum and maximum output curves
are shown for operation over a temperature range of 0 to
85
C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
A gel die coat isolates the die surface and wire bonds
from the environment, while allowing the pressure signal
to be transmitted to the sensor diaphragm. The gel die
coat and durable polymer package provide a media resis-
tant barrier that allows the sensor to operate reliably in
high humidity conditions as well as environments contain-
ing common automotive media. Contact the factory for
more information regarding media compatibility in your
specific application.
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MPXAZ4115A SERIES
4
Motorola Sensor Device Data
Transfer Function (MPXAZ4115A)
Nominal Transfer Value: V
out
= V
S
x (0.009 x P 0.095)
(Pressure Error x Temp. Factor x 0.009 x V
S
)
V
S
= 5.1
0.25 Vdc
Temperature Error Band
MPXAZ4115A Series
Break Points
Temp
Multiplier
- 40
3
0 to 85
1
125
3
Temperature in C
4.0
3.0
2.0
0.0
1.0
-40
-20
0
20
40
60
140
120
100
80
Temperature
Error
Factor
NOTE: The Temperature Multiplier is a linear response from 0
C to 40
C and from 85
C to 125
C
Pressure Error Band
Error Limits for Pressure
3.0
2.0
1.0
-1.0
- 2.0
- 3.0
0.0
20
Pressure (in kPa)
Pressure Error (kPa)
Pressure
Error (Max)
15 to 115 (kPa)
1.5 (kPa)
40
60
80
100
120
ORDERING INFORMATION -- SMALL OUTLINE PACKAGE
Device Type
Options
Case No.
MPX Series Order No.
Packing Options
Marking
Basic Element
Absolute, Element Only
482
MPXAZ4115A6U
Rails
MPXAZ4115A
Absolute, Element Only
482
MPXAZ4115A6T1
Tape and Reel
MPXAZ4115A
Ported Element
Absolute, Axial Port
482A
MPXAZ4115AC6U
Rails
MPXAZ4115A
Absolute, Axial Port
482A
MPXAZ4115AC6T1
Tape and Reel
MPXAZ4115A
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Freescale Semiconductor, Inc.
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ARCHIVED BY FREESCALE SEMICONDUCT
OR,
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2005
MPXAZ4115A SERIES
5
Motorola Sensor Device Data
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
fottprint, the packages will selfalign when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and short-
ing between solder pads.
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
Figure 5. SOP Footprint (Case 482)
inch
mm
SCALE 2:1
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MPXAZ4115A SERIES
6
Motorola Sensor Device Data
SMALL OUTLINE PACKAGE DIMENSIONS
CASE 48201
ISSUE O
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
5.38
0.230
0.212
5.84
D
0.96
0.042
0.038
1.07
G
0.100 BSC
2.54 BSC
H
0.002
0.010
0.05
0.25
J
0.009
0.011
0.23
0.28
K
0.061
0.071
1.55
1.80
M
0
7
0
7
N
0.405
0.415
10.29
10.54
S
0.709
0.725
18.01
18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
_
_
_
_
S
D
G
8 PL
4
5
8
1
N
S
B
M
0.25 (0.010)
A
S
T
A
B
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
T
CASE 482A01
ISSUE A
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
12.70
0.520
0.500
13.21
D
0.96
0.042
0.038
1.07
G
0.100 BSC
2.54 BSC
H
0.002
0.010
0.05
0.25
J
0.009
0.011
0.23
0.28
K
0.061
0.071
1.55
1.80
M
0
7
0
7
N
0.444
0.448
11.28
11.38
S
0.709
0.725
18.01
18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
_
_
_
_
S
D
G
8 PL
4
5
8
1
S
B
M
0.25 (0.010)
A
S
T
A
B
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
T
N
V
W
V
0.245
0.255
6.22
6.48
W
0.115
0.125
2.92
3.17
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2005
MPXAZ4115A SERIES
7
Motorola Sensor Device Data
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental
damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application
by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are
not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized app lication,
Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs,
damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated
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2, Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong.
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HOME PAGE: http://www.motorola.com/semiconductors/
MPXAZ4115A/D
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