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Электронный компонент: DS1339

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GENERAL DESCRIPTION
The DS1339 serial real-time clock (RTC) is a low-
power clock/date device with two programmable time-
of-day alarms and a programmable square-wave
output. Address and data are transferred serially
through an I
2
C* bus. The clock/date provides seconds,
minutes, hours, day, date, month, and year
information. The date at the end of the month is
automatically adjusted for months with fewer than 31
days, including corrections for leap year. The clock
operates in either the 24-hour or 12-hour format with
AM/PM indicator. The DS1339 has a built-in power-
sense circuit that detects power failures and
automatically switches to the backup supply,
maintaining time and date operation.
APPLICATIONS
Handhelds (GPS, POS Terminals)
Consumer Electronics (Set-Top Box, Digital
Recording, Network Appliance)
Office Equipment (Fax/Printers, Copier)
Medical (Glucometer, Medicine Dispenser)
Telecommunications (Routers, Switches, Servers)
Other (Utility Meter, Vending Machine, Thermostat,
Modem
)
FEATURES
Real-Time Clock (RTC) Counts Seconds, Minutes,
Hours, Day, Date, Month, and Year with Leap-
Year Compensation Valid Up to 2100
Available in a Surface-Mount Package with an
Integrated Crystal (DS1339C)
I
2
C Serial Interface
Two Time-of-Day Alarms
Programmable Square-Wave Output
Oscillator Stop Flag
Automatic Power-Fail Detect and Switch Circuitry
Trickle-Charge Capability
Underwriters Laboratory (UL) Recognized
Pin Configurations appear at end of data sheet.
*I
2
C is a trademark of Philips Corp. Purchase of I
2
C components
from Maxim Integrated Products, Inc., or one of its sublicensed
Associated Companies, conveys a license under the Philips I
2
C
Patent Rights to use these components in an I
2
C system, provided
that the system conforms to the I
2
C Standard Specification as
defined by Philips.
ORDERING INFORMATION
PART
TEMP RANGE
VOLTAGE (V)
PIN-PACKAGE
TOP MARK*
DS1339C-2
-40C to +85C
2.0
16 SO (300 mils)
DS1339C-2
DS1339C-2+
-40C to +85C
2.0
16 SO (300 mils)
DS1339C-2
DS1339C-3
-40C to +85C
3.0
16 SO (300 mils)
DS1339C-3
DS1339C-3+
-40C to +85C
3.0
16 SO (300 mils)
DS1339C-3
DS1339C-33
-40C to +85C
3.3
16 SO (300 mils)
DS1339C-33
DS1339C-33+
-40C to +85C
3.3
16 SO (300 mils)
DS1339C-33
DS1339U-2
-40C to +85C
2.0
8
mSOP
1339 ##-2
DS1339U-3
-40C to +85C
3.0
8
mSOP
1339 ##-3
DS1339U-3+
-40C to +85C
3.0
8
mSOP
1339 ##-3
DS1339U-33
-40C to +85C
3.3
8
mSOP
1339 ##-33
DS1339U-33+
-40C to +85C
3.3
8
mSOP
1339 ##-33
+ Denotes a lead-free/RoHS-compliant device.
## = second line, revision code
2 = 2.0V (V
CC
10%)
3 = 3.0V (V
CC
10%)
33 = 3.3V (V
CC
10%)
* A "+" on the top mark indicates a lead-free device.
DS1339
I
2
C Serial Real-Time Clock
www.maxim-ic.com
DS1339 I
2
C Serial Real-Time Clock
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ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground........................................................................-0.3V to +6.0V
Operating Temperature Range...(Noncondensing).................................................................-40C to +85C
Storage Temperature Range............................................................................................-55C to +125C
Soldering Temperature Range.............See precautions in the Handling, PC Board Layout, and Assembly section.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is
not implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
(T
A
= -40C to +85C) (Note 1)
PARAMETER SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DS1339-2
1.8 2.0 2.2
DS1339-3
2.7 3.0 3.3
Supply Voltage
V
CC
DS1339-33
2.97 3.3 3.63
V
Backup Supply Voltage
V
BACKUP
1.3 3.0 3.7 V
Pullup Resistor Voltage (SQW/
INT,
SDA, SCL), V
CC
= 0V
V
PU
5.5 V
Logic 1
V
IH
0.7 x
V
CC
V
CC
+
0.5
V
Logic 0
V
IL
-0.5
+0.3 x
V
CC
V
DS1339-2
1.58 1.70 1.80
DS1339-3
2.45 2.59 2.70
Power-Fail Voltage
V
PF
DS1339-33
2.70 2.85 2.97
V
DC ELECTRICAL CHARACTERISTICS
(V
CC
= MIN to MAX, T
A
= -40C to +85C.) (Note 1)
PARAMETER SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Input Leakage
I
LI
(Note
2)
1 mA
I/O Leakage
I
LO
(Note
3)
1 mA
Logic 0 Out
V
OL
= 0.4V; V
CC
> V
CC
MIN (-3, -33);
V
CC
2.0V (-2)
I
OL
(Note
3)
3 mA
Logic 0 Out
V
OL
= 0.2 (V
CC
);
1.8V < V
CC
< 2.0V (DS1339-2)
I
OL
(Note
3)
3 mA
Logic 0 Out
V
OL
= 0.2 (V
CC
);
1.3V < V
CC
< 1.8V (DS1339-2)
I
OL
(Note
3)
250 mA
V
CC
Active Current
I
CCA
(Note
4)
450 mA
V
CC
Standby Current
I
CCS
(Note
5)
80 150 mA
DS1339 I
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C Serial Real-Time Clock
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DC ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= MIN to MAX, T
A
= -40C to +85C.) (Note 1)
PARAMETER SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Trickle-Charger Resistor Register
10h = A5h, V
CC
= Typ, V
BACKUP
= 0V
R1
250 W
Trickle-Charger Resistor Register
10h = A6h, V
CC
= Typ, V
BACKUP
= 0V
R2
2000 W
Trickle-Charger Resistor Register
10h = A7h, V
CC
= Typ, V
BACKUP
= 0V
R3
4000 W
V
BACKUP
Leakage Current
I
BKLKG
25 100 nA
DC ELECTRICAL CHARACTERISTICS
(V
CC
= 0V, T
A
= -40C to +85C.) (Note 1)
PARAMETER SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
V
BACKUP
Current
EOSC = 0, SQW Off
I
BKOSC
(Note
6)
400 700 nA
V
BACKUP
Current
EOSC = 0, SQW On
I
BKSQW
(Note
6)
600 1000 nA
V
BACKUP
Current
EOSC = 1
I
BKDR
(Note
6)
10 100 nA
DS1339 I
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C Serial Real-Time Clock
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AC ELECTRICAL CHARACTERISTICS
(V
CC
= MIN to MAX, T
A
= -40C to +85C.) (Note 12)
PARAMETER SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
Fast mode
100
400
SCL Clock Frequency
f
SCL
Standard mode
100
kHz
Fast mode
1.3
Bus Free Time Between a STOP
and START Condition
t
BUF
Standard mode
4.7
ms
Fast mode
0.6
Hold Time (Repeated) START
Condition (Note 7)
t
HD:STA
Standard mode
4.0
ms
Fast mode
1.3
LOW Period of SCL Clock
t
LOW
Standard mode
4.7
ms
Fast mode
0.6
HIGH Period of SCL Clock
t
HIGH
Standard mode
4.0
ms
Fast mode
0.6
Setup Time for a Repeated
START Condition
t
SU:STA
Standard mode
4.7
ms
Fast mode
0
0.9
Data Hold Time (Notes 8, 9)
t
HD:DAT
Standard mode
0
ms
Fast mode
100
Data Setup Time (Note 10)
t
SU:DAT
Standard mode
250
ns
Fast mode
20 + 0.1C
B
300
Rise Time of Both SDA and SCL
Signals (Note 11)
t
R
Standard mode
20 + 0.1C
B
1000
ns
Fast mode
20 + 0.1C
B
300
Fall Time of Both SDA and SCL
Signals (Note 11)
t
F
Standard mode
20 + 0.1C
B
300
ns
Fast mode
0.6
Setup Time for STOP Condition
t
SU:STO
Standard mode
4.0
ms
Capacitive Load for Each Bus
Line (Note 11)
C
B
400 pF
I/O Capacitance (SDA, SCL)
C
I/O
(Note
12)
10 pF
Oscillator Stop Flag (OSF) Delay
t
OSF
(Note
13)
100 ms

DS1339 I
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C Serial Real-Time Clock
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POWER-UP/DOWN CHARACTERISTICS
(T
A
= -40 C to +85C) (Note 1, Figure 1)
PARAMETER SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Recovery at Power-Up
t
REC
(Note
14)
2 ms
V
CC
Fall Time; V
PF(MAX)
to V
PF(MIN)
t
VCCF
300
ms
V
CC
Rise Time; V
PF(MIN)
to V
PF(MAX)
t
VCCR
0
ms

WARNING: Under no circumstances are negative undershoots, of any amplitude, allowed when device is in
battery-backup mode.
Note 1:
Limits at -40C are guaranteed by design and are not production tested.
Note 2:
SCL only.
Note 3:
SDA and SQW/
INT.
Note 4:
I
CCA
--SCL at f
SC
max, V
IL
= 0.0V, V
IH
= V
CC
, trickle charger disabled.
Note 5:
Specified with the I
2
C bus inactive, V
IL
= 0.0V, V
IH
= V
CC
, trickle charger disabled.
Note 6:
Using recommended crystal on X1 and X2.
Note 7:
After this period, the first clock pulse is generated.
Note 8:
A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V
IHMIN
of the SCL signal) to bridge
the undefined region of the falling edge of SCL.
Note 9:
The maximum t
HD:DAT
need only be met if the device does not stretch the LOW period (t
LOW
) of the SCL signal.
Note 10:
A fast-mode device can be used in a standard-mode system, but the requirement t
SU:DAT
to 250ns must then be met. This is
automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW
period of the SCL signal, it must output the next data bit to the SDA line t
R(MAX)
+
t
SU:DAT
= 1000 + 250 = 1250ns before the SCL line
is released.
Note 11:
C
B
--total capacitance of one bus line in pF.
Note 12:
Guaranteed by design. Not production tested.
Note 13:
The parameter t
OSF
is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of 0.0V
V
CC
V
CCMAX
and 1.3V
V
BACKUP
3.7V.
Note 14:
This delay applies only if the oscillator is running. If the oscillator is disabled or stopped, no power-up delay occurs.

Figure 1. Power-Up/Down Timing
OUTPUTS
V
CC
V
PF(MAX)
V
PF(MIN)
INPUTS
HIGH-Z
DON'T CARE
VALID
RECOGNIZED
RECOGNIZED
VALID
t
VCCF
t
VCCR
t
REC
DS1339 I
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C Serial Real-Time Clock
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Figure 2. Timing Diagram

Figure 3. Block Diagram























ALARM,
TRICKLE
CHARGE, AND
CONTROL
REGISTERS
SERIAL BUS
INTERFACE AND
ADDRESS
REGISTER
OSCILLATOR AND
DIVIDER
CONTROL
LOGIC
X1
X2
SCL
SDA
1Hz
1Hz/4.096kHz/8.192kHz/32.768kHz
MUX/
BUFFER
SQW
/INT
USER BUFFER
(7 BYTES)
CLOCK AND
CALENDAR
REGISTERS
"C" VERSION
ONLY
POWER
CONTROL
V
CC
V
BACKUP
Dallas Semiconductor
DS1339
DS1339 I
2
C Serial Real-Time Clock
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PIN DESCRIPTION
PIN
mSOP
SO
NAME FUNCTION
1 -- X1
2 -- X2
Connections for Standard 32.768kHz Quartz Crystal. The internal oscillator
circuitry is designed for operation with a crystal having a specified load
capacitance (C
L
) of 6pF. An external 32.768kHz oscillator can also drive the
DS1339. In this configuration, the X1 pin is connected to the external oscillator
signal and the X2 pin is floated.
For more information about crystal selection and crystal layout considerations,
refer to Application Note 58: Crystal Considerations with Dallas Real-Time
Clocks
.
3 14 V
BACKUP
Secondary Power Supply. Supply voltage must be held between 1.3V and 3.7V
for proper operation. This pin can be connected to a primary cell, such as a
lithium button cell. Additionally, this pin can be connected to a rechargeable cell
or a super cap when used in conjunction with the trickle-charge feature. Diodes
should not be placed in series between the battery and the V
BACKUP
input, or
improper operation will result. UL recognized to ensure against reverse charging
current when used with a lithium battery If a back up supply is not required,
V
BACKUP
must be grounded.
4
15
GND
Ground. DC power is provided to the device on these pins.
5 16 SDA
Serial Data Input/Output. SDA is the input/output pin for the I
2
C serial interface.
The SDA pin is an open-drain output and requires an external pullup resistor.
6 1 SCL
Serial Clock Input. SCL is used to synchronize data movement on the serial
interface.
7 2
SQW/
INT
Square-Wave/Interrupt Output. Programmable square-wave or interrupt output
signal. The SQW/
INT pin is an open-drain output and requires an external pullup
resistor.
8 3 V
CC
Power Supply. DC power is provided to the device on these pins.
--
413
N.C.
No Connection. These pins are unused and must be connected to ground.
TYPICAL OPERATING CIRCUIT












DS1339
4
CPU
VCC
VCC
VCC
5
6
8
1
2
SDA
SCL
GND
X2
X1
VCC
RPU
RPU
CRYSTAL
SQW /INT
V
BACKUP
3
7
i
DS1339 I
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C Serial Real-Time Clock
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DETAILED DESCRIPTION
The DS1339 serial real-time clock (RTC) is a low-power clock/date device with two programmable time-of-day
alarms and a programmable square-wave output. Address and data are transferred serially through an I
2
C bus.
The clock/date provides seconds, minutes, hours, day, date, month, and year information. The date at the end of
the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The
clock operates in either the 24-hour or 12-hour format with AM/PM indicator. The DS1339 has a built-in power-
sense circuit that detects power failures and automatically switches to the backup supply, maintaining time and
date operation.
OPERATION
The DS1339 operates as a slave device on the serial bus. Access is obtained by implementing a START condition
and providing a device identification code followed by data. Subsequent registers can be accessed sequentially
until a STOP condition is executed. The device is fully accessible and data can be written and read when V
CC
is
greater than V
PF
. However, when V
CC
falls below V
PF
, the internal clock registers are blocked from any access. If
V
PF
is less than V
BACKUP
, the device power is switched from V
CC
to V
BACKUP
when V
CC
drops below V
PF
. If V
PF
is
greater than V
BACKUP
, the device power is switched from V
CC
to V
BACKUP
when V
CC
drops below V
BACKUP
. The
registers are maintained from the V
BACKUP
source until V
CC
is returned to nominal levels. The block diagram in
Figure 3 shows the main elements of the serial real-time clock.
OSCILLATOR CIRCUIT
The DS1339 uses an external 32.768kHz crystal. The oscillator circuit does not require any external resistors or
capacitors to operate. Table 1 specifies several crystal parameters for the external crystal. Figure 4 shows a
functional schematic of the oscillator circuit. The startup time is usually less than 1 second when using a crystal
with the specified characteristics.
DS1339 I
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C Serial Real-Time Clock
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Table 1. Crystal Specifications*
PARAMETER SYMBOL
MIN
TYP
MAX
UNITS
Nominal Frequency
f
O
32.768
kHz
Series Resistance
ESR
45
k
W
Load Capacitance
C
L
6 pF
*The crystal, traces, and crystal input pins should be isolated from RF generating signals. Refer to
Application Note 58: Crystal Considerations for Dallas Real-Time Clocks for additional specifications.
Figure 4. Oscillator Circuit Showing Internal Bias Network











CLOCK ACCURACY
The accuracy of the clock is dependent upon the accuracy of the crystal and the accuracy of the match between
the capacitive load of the oscillator circuit and the capacitive load for which the crystal was trimmed. Additional
error is added by crystal frequency drift caused by temperature shifts. External circuit noise coupled into the
oscillator circuit may result in the clock running fast. Figure 5 shows a typical PC board layout for isolating the
crystal and oscillator from noise. Refer to Application Note 58: Crystal Considerations with Dallas Real-Time
Clocks
for detailed information
DS1339C ONLY
The DS1339C integrates a standard 32,768Hz crystal in the package. Typical accuracy at nominal V
CC
and +25C
is approximately 10ppm. Refer to Application Note 58 for information about crystal accuracy vs. temperature.

Figure 5. Typical PC Board Layout for Crystal








COUNTDOWN
CHAIN
RTC
REGISTERS
RTC
X1
X2
CRYSTAL
C
L
1
C
L
2
LOCAL GROUND PLANE (LAYER 2)
CRYSTAL
X1
X2
GND
NOTE: AVOID ROUTING SIGNALS IN
THE CROSSHATCHED AREA (UPPER
LEFT-HAND QUADRANT) OF THE
PACKAGE UNLESS THERE IS A
GROUND PLANE BETWEEN THE
SIGNAL LINE AND THE PACKAGE.
DS1339 I
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C Serial Real-Time Clock
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ADDRESS MAP
Figure 6 shows the address map for the DS1339 registers. During a multibyte access, when the address pointer
reaches the end of the register space (10h), it wraps around to location 00h. On an I
2
C START, STOP, or address
pointer incrementing to location 00h, the current time is transferred to a second set of registers. The time
information is read from these secondary registers, while the clock may continue to run. This eliminates the need
to re-read the registers in case of an update of the main registers during a read.
Figure 6. Timekeeper Registers
ADDRESS
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
FUNCTION
RANGE
00H 0
10
Seconds
Seconds
Seconds
0059
01H 0
10
Minutes
Minutes
Minutes
0059
AM/PM
02H 0
12/
24
10 Hour
10 Hour
Hour
Hours
112
+AM/PM
0023
03H 0 0 0 0 0
Day
Day 17
04H 0 0 10
Date
Date
Date
0131
05H Century 0
0
10
Month
Month
Month/
Century
0112 +
Century
06H 10
Year
Year Year
0099
07H A1M1
10
Seconds
Seconds
Alarm 1
Seconds
0059
08H A1M2
10
Minutes
Minutes
Alarm 1
Minutes
0059
AM/PM
09H A1M3
12/
24
10 Hour
10 Hour
Hour
Alarm 1
Hours
112 +
AM/PM
0023
0AH
A1M4
DY/DT
10 Date
Day, Date
Alarm 1
Day,
Alarm 1
Date
1-7, 1-31
0BH A2M2
10
Minutes
Minutes
Alarm 2
Minutes
0059
AM/PM
0CH A2M3
12/
24
10 Hour
10 Hour
Hour
Alarm 2
Hours
112 +
AM/PM
0023
0DH A2M4
DY/
DT
10 Date
Day, Date
Alarm 2
Day,
Alarm 2
Date
17, 131
0EH
EOSC
0 0 RS2
RS1
INTCN
A2IE
A1IE
Control
0FH OSF 0 0 0 0 0
A2F
A1F
Status
10H TCS3
TCS2
TCS1
TCS0
DS1
DS0
ROUT1 ROUT0
Trickle
Charger
Note: Unless otherwise specified, the state of the registers are not defined when power is first applied or when V
CC
and V
BACKUP
falls below the
V
BACKUP(MIN)
.
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TIME AND DATE OPERATION
The time and date information is obtained by reading the appropriate register bytes. Figure 6 shows the RTC
registers. The time and date are set or initialized by writing the appropriate register bytes. The contents of the time
and date registers are in the BCD format. The DS1339 can be run in either 12-hour or 24-hour mode. Bit 6 of the
hours register is defined as the 12- or 24-hour mode-select bit. When high, the 12-hour mode is selected. In the
12-hour mode, bit 5 is the
AM/PM bit with logic high being PM. In the 24-hour mode, bit 5 is the second 10-hour bit
(20 to 23 hours). All hours values, including the alarms, must be re-entered whenever the 12/
24-hour mode bit is
changed. The century bit (bit 7 of the month register) is toggled when the years register overflows from 99 to 00.
The day-of-week register increments at midnight. Values that correspond to the day of week are user-defined, but
must be sequential (i.e., if 1 equals Sunday, then 2 equals Monday and so on). Illogical time and date entries result
in undefined operation.

When reading or writing the time and date registers, secondary (user) buffers are used to prevent errors when the
internal registers update. When reading the time and date registers, the user buffers are synchronized to the
internal registers on any start or stop, and when the address pointer rolls over to zero. The countdown chain is
reset whenever the seconds register is written. Write transfers occurs on the acknowledge pulse from the device.
To avoid rollover issues, once the countdown chain is reset, the remaining time and date registers must be written
within one second. If enabled, the 1Hz square-wave output transitions high 500ms after the seconds data transfer,
provided the oscillator is already running.
ALARMS
The DS1339 contains two time of day/date alarms. Alarm 1 can be set by writing to registers 07h to 0Ah. Alarm 2
can be set by writing to registers 0Bh to 0Dh. The alarms can be programmed (by the Alarm Enable and INTCN
bits of the Control Register) to activate the SQW/
INT output on an alarm match condition. Bit 7 of each of the time
of day/date alarm registers are mask bits (Table 2). When all the mask bits for each alarm are logic 0, an alarm
only occurs when the values in the timekeeping registers 00h to 06h match the values stored in the time of
day/date alarm registers. The alarms can also be programmed to repeat every second, minute, hour, day, or date.
Table 2 shows the possible settings. Configurations not listed in the table result in illogical operation.

The DY/
DT bits (bit 6 of the alarm day/date registers) control whether the alarm value stored in bits 0 to 5 of that
register reflects the day of the week or the date of the month. If DY/
DT is written to a logic 0, the alarm is the result
of a match with date of the month. If DY/
DT is written to a logic 1, the alarm is the result of a match with day of the
week.

The device checks for an alarm match once per second. When the RTC register values match alarm register
settings, the corresponding Alarm Flag `A1F' or `A2F' bit is set to logic 1. If the corresponding Alarm Interrupt
Enable `A1IE' or `A2IE' is also set to logic 1 and the INTCN bit is set to logic 1, the alarm condition activates the
SQW/
INT) signal. If the BBSQI bit is set to 1, the INT output activates while the part is being powered by V
BACKUP
.
The alarm output remains active until the alarm flag is cleared by the user.
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Table 2. Alarm Mask Bits
ALARM 1 REGISTER MASK BITS
(Bit 7)
DY/
DT
A1M4 A1M3 A1M2 A1M1
ALARM RATE
X
1
1
1
1
Alarm once per second
X
1
1
1
0
Alarm when seconds match
X
1
1
0
0
Alarm when minutes and seconds match
X
1
0
0
0
Alarm when hours, minutes, and seconds match
0 0 0 0 0
Alarm when date, hours, minutes, and seconds
match
1
0
0
0
0
Alarm when day, hours, minutes, and seconds match
ALARM 2 REGISTER MASK BITS
(Bit 7)
DY/
DT
A2M4 A2M3 A2M2
ALARM RATE
X
1
1
1
Alarm once per minute (00 sec. of every min.)
X
1
1
0
Alarm when minutes match
X
1
0
0
Alarm when hours and minutes match
0
0
0
0
Alarm when date, hours, and minutes match
1
0
0
0
Alarm when day, hours, and minutes match

SPECIAL-PURPOSE REGISTERS
The DS1339 has two additional registers (control and status) that control the RTC, alarms, and square-wave
output.
CONTROL REGISTER (0Eh)
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
EOSC
0 BBSQI
RS2 RS1
INTCN
A2IE A1IE

Bit 7: Enable Oscillator
(EOSC). This bit when set to logic 0 starts the oscillator. When this bit is set to a logic 1,
the oscillator is stopped. This bit is enabled (logic 0) when power is first applied.

Bit 5: Battery-Backed Square-Wave and Interrupt Enable (BBSQI). This bit when set to a logic 1 enables the
square wave or interrupt output when V
CC
is absent and the DS1339 is being powered by the V
BACKUP
pin. When
BBSQI is a logic 0, the SQW/
INT pin goes high impedance when V
CC
falls below the power-fail trip point. This bit is
disabled (logic 0) when power is first applied.

Bits 4 and 3: Rate Select (RS2 and RS1). These bits control the frequency of the square-wave output when the
square wave has been enabled. The table below shows the square-wave frequencies that can be selected with the
RS bits. These bits are both set to logic 1 (32kHz) when power is first applied.
Square-Wave Output Frequency
RS2 RS1
SQUARE-WAVE
OUTPUT
FREQUENCY
0 0
1Hz
0 1 4.096kHz
1 0 8.192kHz
1 1 32.768kHz
DS1339 I
2
C Serial Real-Time Clock
13 of 18
Bit 2: Interrupt Control (INTCN). This bit controls the relationship between the two alarms and the interrupt output
pins. When the INTCN bit is set to logic 1, a match between the timekeeping registers and the alarm 1 or alarm 2
registers activate the SQW/
INT pin (provided that the alarm is enabled). When the INTCN bit is set to logic 0, a
square wave is output on the SQW/
INT pin. This bit is set to logic 0 when power is first applied.

Bit 1: Alarm 2 Interrupt Enable (A2IE). When set to a logic 1, this bit permits the Alarm 2 Flag (A2F) bit in the
status register to assert SQW/
INT (when INTCN = 1). When the A2IE bit is set to logic 0 or INTCN is set to logic 0,
the A2F bit does not initiate an interrupt signal. The A2IE bit is disabled (logic 0) when power is first applied.

Bit 0: Alarm 1 Interrupt Enable (A1IE). When set to logic 1, this bit permits the Alarm 1 Flag (A1F) bit in the
status register to assert SQW/
INT (when INTCN = 1). When the A1IE bit is set to logic 0 or INTCN is set to logic 0,
the A1F bit does not initiate an interrupt signal. The A1IE bit is disabled (logic 0) when power is first applied.


STATUS REGISTER (0Fh)
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
OSF
0 0 0 0 0
A2F
A1F

Bit 7: Oscillator Stop Flag (OSF). A logic 1 in this bit indicates that the oscillator either is stopped or was stopped
for some period of time and may be used to judge the validity of the clock and date data. This bit is edge triggered
and is set to logic 1 when the oscillator stops. The following are examples of conditions that can cause the OSF bit
to be set:

1) The first time power is applied.
2) The voltage on both V
CC
and V
BACKUP
are insufficient to support oscillation.
3) The
EOSC bit is turned off.
4) External influences on the crystal (e.g., noise, leakage, etc.).

This bit remains at logic 1 until written to logic 0. This bit can only be written to a logic 0.

Bit 1: Alarm 2 Flag (A2F). A logic 1 in the Alarm 2 Flag bit indicates that the time matched the alarm 2 registers. If
the A2IE bit is a logic 1 and the INTCN bit is set to a logic 1, the SQW/
INT pin is also asserted. A2F is cleared
when written to logic 0. This bit can only be written to logic 0. Attempting to write to logic 1 leaves the value
unchanged.

Bit 0: Alarm 1 Flag (A1F).
A logic 1 in the Alarm 1 Flag bit indicates that the time matched the alarm 1 registers. If
the A1IE bit is a logic 1 and the INTCN bit is set to a logic 1, the SQW/
INT pin is also asserted. A1F is cleared
when written to logic 0. This bit can only be written to logic 0. Attempting to write to logic 1 leaves the value
unchanged.

DS1339 I
2
C Serial Real-Time Clock
14 of 18
TRICKLE CHARGER REGISTER (10h)
The simplified schematic in Figure 7 shows the basic components of the trickle charger. The trickle-charge select
(TCS) bits (bits 4 to 7) control the selection of the trickle charger. To prevent accidental enabling, only a pattern on
1010 enables the trickle charger. All other patterns disable the trickle charger. The trickle charger is disabled when
power is first applied. The diode-select (DS) bits (bits 2 and 3) select whether or not a diode is connected between
V
CC
and V
BACKUP
. The ROUT bits (bits 0 and 1) select the value of the resistor connected between V
CC
and V
BACKUP
.
Table 3 shows the bit values.
Table 3. Trickle Charger Register (10h)
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
TCS3 TCS2 TCS1 TCS0 DS1 DS0 ROUT1 ROUT0
FUNCTION
X X X X 0 0 X X
Disabled
X X X X 1 1 X X
Disabled
X X X X X X 0 0
Disabled
1 0 1 0 0 1 0 1
No diode, 250
W resistor
1 0 1 0 1 0 0 1
One diode, 250
W resistor
1 0 1 0 0 1 1 0
No diode, 2k
W resistor
1 0 1 0 1 0 1 0
One diode, 2k
W resistor
1 0 1 0 0 1 1 1
No diode, 4k
W resistor
1 0 1 0 1 0 1 1
One diode, 4k
W resistor
0 0 0 0 0 0 0 0
Initial
power-up
values

The user determines diode and resistor selection according to the maximum current desired for battery or super
cap charging. The maximum charging current can be calculated as illustrated in the following example. Assume
that a 3.3V system power supply is applied to V
CC
and a super cap is connected to V
BACKUP
. Also assume that the
trickle charger has been enabled with a diode and resistor R2 between V
CC
and V
BACKUP
. The
maximum current I
MAX
would therefore be calculated as follows:
I
MAX
= (3.3V - diode drop) / R2
(3.3V - 0.7V) / 2kW 1.3mA

As the super cap or battery charges, the voltage drop between V
CC
and V
BACKUP
decreases and therefore the
charge current decreases.
DS1339 I
2
C Serial Real-Time Clock
15 of 18
Figure 7. Programmable Trickle Charger

























I
2
C SERIAL DATA BUS
The DS1339 supports the I
2
C bus protocol. A device that sends data onto the bus is defined as a transmitter and a
device receiving data as a receiver. The device that controls the message is called a master. The devices that are
controlled by the master are referred to as slaves. The bus must be controlled by a master device that generates
the serial clock (SCL), controls the bus access, and generates the START and STOP conditions. The DS1339
operates as a slave on the I
2
C bus. Within the bus specifications, a standard mode (100kHz cycle rate) and a fast
mode (400kHz cycle rate) are defined. The DS1339 works in both modes. Connections to the bus are made via the
open-drain I/O lines SDA and SCL.

The following bus protocol has been defined (Figure 8):
Data transfer may be initiated only when the bus is not busy.
During data transfer, the data line must remain stable whenever the clock line is HIGH. Changes in the data
line while the clock line is HIGH are interpreted as control signals.

Accordingly, the following bus conditions have been defined:

Bus not busy: Both data and clock lines remain HIGH.

Start data transfer: A change in the state of the data line, from HIGH to LOW, while the clock is HIGH, defines a
START condition.

Stop data transfer: A change in the state of the data line, from LOW to HIGH, while the clock line is HIGH,
defines the STOP condition.

Data valid: The state of the data line represents valid data when, after a START condition, the data line is stable
for the duration of the HIGH period of the clock signal. The data on the line must be changed during the LOW
period of the clock signal. There is one clock pulse per bit of data.













1 OF 16 SELECT
NOTE: ONLY 1010 ENABLES CHARGER
1 OF 2
SELECT
1 OF 3
SELECT


TCS3 TCS2 TCS1 TCS0 DS1 DS0 ROUT1 ROUT0
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3
BIT 2
BIT 1 BIT 0
250
W
2k
W
4k
W
R1
R3
R2
TRICKLE CHARGE REGISTER
TCS
0-3
= TRICKLE CHARGER SELECT
DS
0-1
= DIODE SELECT
ROUT
0-1
= RESISTOR SELECT
V
CC
V
BACKUP
DS1339 I
2
C Serial Real-Time Clock
16 of 18
Each data transfer is initiated with a START condition and terminated with a STOP condition. The number of data
bytes transferred between START and STOP conditions is not limited, and is determined by the master device.
The information is transferred byte-wise and each receiver acknowledges with a ninth bit.

Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge after the reception
of each byte. The master device must generate an extra clock pulse that is associated with this acknowledge bit.
A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that
the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. Of course, setup and
hold times must be taken into account. A master must signal an end of data to the slave by not generating an
acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave must leave the data
line HIGH to enable the master to generate the STOP condition.
Figure 8. Data Transfer on I
2
C Serial Bus
Depending upon the state of the R/
W bit, two types of data transfer are possible:

1) Data transfer from a master transmitter to a slave receiver. The first byte transmitted by the master is the
slave address. Next follows a number of data bytes. The slave returns an acknowledge bit after each received
byte. Data is transferred with the most significant bit (MSB) first.

2) Data transfer from a slave transmitter to a master receiver. The first byte (the slave address) is transmitted
by the master. The slave then returns an acknowledge bit. This is followed by the slave transmitting a number
of data bytes. The master returns an acknowledge bit after all received bytes other than the last byte. At the
end of the last received byte, a "not acknowledge" is returned. The master device generates all of the serial
clock pulses and the START and STOP conditions. A transfer is ended with a STOP condition or with a
repeated START condition. Since a repeated START condition is also the beginning of the next serial transfer,
the bus is not released. Data is transferred with the most significant bit (MSB) first.

The DS1339 can operate in the following two modes:

1) Slave Receiver Mode (Write Mode): Serial data and clock are received through SDA and SCL. After each
byte is received an acknowledge bit is transmitted. START and STOP conditions are recognized as the
beginning and end of a serial transfer. Address recognition is performed by hardware after reception of the
slave address and direction bit (Figure 9). The slave address byte is the first byte received after the START
condition is generated by the master. The slave address byte contains the 7-bit DS1339 address, which is
1101000, followed by the direction bit (R/
W), which is 0 for a write. After receiving and decoding the slave
address byte the slave outputs an acknowledge on the SDA line. After the DS1339 acknowledges the slave
address + write bit, the master transmits a register address to the DS1339. This sets the register pointer on the
DS1339, with the DS1339 acknowledging the transfer. The master may then transmit zero or more bytes of
DS1339 I
2
C Serial Real-Time Clock
17 of 18
data, with the DS1339 acknowledging each byte received. The address pointer increments after each data
byte is transferred. The master generates a STOP condition to terminate the data write.

2) Slave Transmitter Mode (Read Mode): The first byte is received and handled as in the slave receiver mode.
However, in this mode, the direction bit indicates that the transfer direction is reversed. Serial data is
transmitted on SDA by the DS1339 while the serial clock is input on SCL. START and STOP conditions are
recognized as the beginning and end of a serial transfer (Figure 10). The slave address byte is the first byte
received after the START condition is generated by the master. The slave address byte contains the 7-bit
DS1339 address, which is 1101000, followed by the direction bit (R/
W), which is 1 for a read. After receiving
and decoding the slave address byte the slave outputs an acknowledge on the SDA line. The DS1339 then
begins to transmit data starting with the register address pointed to by the register pointer. If the register
pointer is not written to before the initiation of a read mode the first address that is read is the last one stored in
the register pointer. The address pointer is incremented after each byte is transferred. The DS1339 must
receive a "not acknowledge" to end a read.

Figure 9. Data Write--Slave Receiver Mode














Figure 10. Data Read--Slave Transmitter Mode















S 1101000
0 A XXXXXXXX A XXXXXXXX
A XXXXXXXX
A XXXXXXXX
P
DATA TRANSFERRED
(X+1 BYTES + ACKNOWLEDGE)
slave address
R/
W
register address (n)
S - START
A - ACKNOWLEDGE
P - STOP
R/
W - READ/WRITE OR DIRECTION BIT
Data (n)
Data (n+1)
Data (n+x)
S 1101000
1 A XXXXXXXX A XXXXXXXX
A XXXXXXXX
A XXXXXXXX
/A
DATA TRANSFERRED
(X+1 BYTES + ACKNOWLEDGE)
slave address
R/
W
S - START
A - ACKNOWLEDGE
P - STOP
/A - NOT ACKNOWLEDGE
R/
W - READ/WRITE OR DIRECTION BIT
Data (n)
Data (n+1)
Data (n+x)
Data (n+2)
DS1339 I
2
C Serial Real-Time Clock
18 of 18
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
Ma xi m I nt e gr at e d Pr o du ct s, 1 2 0 S a n G abr i el Dr i ve, S un n yv al e, C A 94 0 8 6 40 8- 7 37- 7 60 0
2005 Maxim Integrated Products
Printed USA
are registered trademarks of Maxim Integrated Products, Inc., and Dallas Semiconductor Corporation.
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY
The DS1339C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.

Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.

The SO package may be reflowed as long as the peak temperature does not exceed 240C. Peak reflow
temperature ( 230C) duration should not exceed 10 seconds, and the total time above 200C should not exceed
40 seconds (30 seconds nominal). Exposure to reflow is limited to 2 times maximum.

Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020B standard for
moisture-sensitive device (MSD) classifications.
PIN CONFIGURATIONS












CHIP INFORMATION
TRANSISTOR COUNT: 11,325
PROCESS: CMOS
THERMAL INFORMATION
PART
THETA-J
A
(C/W)
THETA-J
C
(C/W)
CONDITIONS
SOP 229
39
SO 73
23
Typical
PACKAGE INFORMATION
For the latest package outline information, go to
www.maxim-ic.com/DallasPackInfo
.
mSOP
SQW/
INT
X1
X2
GND
V
CC
SCL
SDA
V
BACKUP
DS1339
TOP VIEW
SQW/INT
SCL
SDA
GND
V
BACKUP
V
CC
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
DS1339C
SO (300 mils)
TOP VIEW