1
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LAA100L
DS-LAA100L-R1
LAA100L is a 350V, 120mA, 25
2-Form-A relay. It fea-
tures improved on-resistance. Current limiting version is
available ("L" suffix).
Telecommunications
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Hookswitch
Dial Pulsing
Ground Start
Ringer Injection
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
UL Recognized: File Number E76270
CSA Certified: File Number LR 43639-10
BSI Certified to:
BS EN 60950:1992 (BS7002:1992)
Certificate #: 7344
BS EN 41003:1993
Certificate #: 7344
Small 8 Pin DIP Package
Low Drive Power Requirements (TTL/CMOS
Compatible)
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
3750V
RMS
Input/Output Isolation
FCC Compatible
VDE Compatible
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Current Limiting Surface Mount and Tape & Reel
Versions Available
Applications
Features
Description
Approvals
DUAL POLE OptoMOS
Relay
Ordering Information
Part #
Description
LAA100L
8 Pin DIP (50/Tube)
LAA100PL
8 Pin Flatpack (50/Tube)
LAA100PLTR
8 Pin Flatpack (1000/Reel)
LAA100LS
8 Pin Surface Mount (50/Tube)
LAA100LSTR
8 Pin Surface Mount (1000/Reel)
LAA100L
Units
Load Voltage
350
V
Load Current
120
mA
Max R
ON
25
Pin Configuration
Switching Characteristics of
Normally Open (Form A) Devices
CONTROL
LOAD
10ms
10%
10%
90%
+
T
ON
T
OFF
+
+
1
2
3
4
8
7
6
5
+ Control - Switch #1
Control - Switch #1
+ Control - Switch #2
Control - Switch #2
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
AC/DC Configuration
LAA100/LAA100L Pinout
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LAA100L
Rev. 1
Absolute Maximum Ratings are stress ratings. Stresses
in excess of these ratings can cause permanent damage
to the device. Functional operation of the device at these
or any other conditions beyond those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to the absolute maximum ratings
for an extended period may degrade the device and effect
its reliability.
Absolute Maximum Ratings (@ 25 C)
2
Parameter
Min
Typ
Max Units
Input Power Dissipation
-
-
150
1
mW
Input Control Current
-
-
50
mA
Peak (10ms)
-
-
1
A
Reverse Input Voltage
-
-
5
V
Total Power Dissipation
-
-
800
2
mW
Isolation Voltage
Input to Output
3750
-
-
V
RMS
Operational Temperature
-40
-
+85
C
Storage Temperature
-40
-
+125
C
Soldering Temperature
DIP Package
-
-
+260
C
Flatpack/Surface Mount Pkg
-
-
+220
C
(10 Seconds Max.)
1
Derate Linearly 1.33 mw/C
2
Derate Linearly 6.67 mw/C
Electrical Characteristics
Parameter
Conditions
Symbol
Min
Typ
Max
Units
Output Characteristics @ 25C
Load Voltage (Peak)
-
V
L
-
-
350
V
Load Current (Continuous)
AC/DC Configuration
-
I
L
-
-
120
mA
Peak Load Current
10ms
I
LPK
-
-
350
mA
On-Resistance
AC/DC Configuration
I
L
=120mA
R
ON
-
-
25
Off-State Leakage Current
V
L
=35OV
I
LEAK
-
-
1
A
Switching Speeds
Turn-On
I
F
=5mA, V
L
=10V
T
ON
-
-
5
ms
Turn-Off
I
F
=5mA, V
L
=10V
T
OFF
-
5
ms
Output Capacitance
50V; f=1MHz
C
OUT
-
35
-
pF
Capacitance
Input to Output
-
-
-
3
-
pF
Input Characteristics @ 25C
Input Control Current
I
L
=120mA
I
F
5
-
50
mA
Input Dropout Current
-
I
F
0.4
0.7
-
mA
Input Voltage Drop
I
F
=5mA
V
F
0.9
1.2
1.4
V
Reverse Input Voltage
-
V
R
-
-
5
V
Reverse Input Current
V
R
=5V
I
R
-
-
10
A
LAA100L
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3
Rev. 1
Dimensions
mm
(inches)
Mechanical Dimensions
PC Board Pattern
(Top View)
6.350
.127
(.250
.005)
2.540
.127
(.100
.005)
7.620
.127
(.300
.005)
7.620
.127
(.300
.005)
8-.800 DIA.
(8-.031 DIA.)
7.239 TYP.
(.285)
3.302
(.130)
7.620
.254
(.300
.010)
9.144 TYP.
(.360)
6.350
.127
(.250
.005)
9.652
.381
(.380
.015)
2.540
.127
(.100
.005)
9.144
.508
(.360
.020)
8.077
.127
(.318
.005 )
8 Pin DIP Through Hole (Standard)
.457
.076
(.018
.003)
PC Board Pattern
(Top View)
2.540
.127
(.100
.005)
8.763
.127
(.345
.005)
1.193
(.047)
.787
(.031)
8 Pin Flatpack ("P" Suffix)
7.620
.254
(.300
.010)
2.159 TYP.
(.085)
2.286 MAX.
(.090)
9.398
.127
(.370
.005)
6.350
.127
(.250
.005)
9.652
.381
(.380
.015)
2.540
.127
(.100
.005)
8.077
.127
(.318
.005)
.457
.076
(.018
.003)
.203
(.008)
.635
.127
(.025)
PC Board Pattern
(Top View)
2.540
.127
(.100
.005)
8.305
.127
(.327
.005)
1.905
.127
(.075
.005)
1.498
.127
(.059
.005)
4.445
.127
(.175
.005)
3.302
(.130)
7.620
.254
(.300
.010)
6.350
.127
(.250
.005)
8.077
.127
(.318
.005)
2.540
.127
(.100
.005)
9.525
.254
(.375
.010)
.457
.076
(.018
.003)
.254 TYP.
(.010)
.635 TYP.
(.025)
8 Pin DIP Surface Mount ("S" Suffix)
9.652
.381
(.380
.015)
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4
LAA100L
Rev. 1
Tape and Reel Packaging for 8 Pin Flatpack Package
7.493
.102
(.295
.004)
12.090
(.476)
1.753
0.102
(.069
.004)
3.987
.102
(.157
.004)
1.498
.102
(.059
.004)
6.731 MAX.
(.265)
.406 MAX.
(.016)
4.877
(.192)
Top Cover
Tape
2.007
.102
(.079
.004)
11.988
.102
(.472
.004)
User Direction of Feed
.050R TYP.
16.002
.305
(.630
.012)
10.287
(.405)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
.102 MAX.
(.004)
10.287
.102
(.405
.004)
1.549
.102
(.061
.004)
330.2 DIA.
(13.00)
1
8
Dimensions
mm
(inches)
Mechanical Dimensions
Tape and Reel Packaging for 8 Pin Surface Mount Package
7.493
.102
(.295
.004)
12.090
(.476)
1.753
.102
(.069
.004)
3.987
.102
(.157
.004)
1.498
.102
(.059
.004)
6.731 MAX.
(.265)
.406 MAX.
(.016)
4.877
(.192)
Top Cover
Tape
2.007
.102
(.079
.004)
11.989
.102
(.472
.004)
User Direction of Feed
.050R TYP.
16.002
.305
(.630
.012)
10.300
(.405)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
.102 MAX.
(.004)
10.300
.102
(.405
.004)
1.549
.102
(.061
.004)
330.2 DIA.
(13.00)
1
8
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85077 Manching
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http://www.clare.com
Worldwide Sales Offices
Specification: DS-LAA100L-R1
Copyright 2001, Clare, Inc.
OptoMOS
is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
6/19/01
Clare cannot assume responsibility for use of any circuitry other
than circuitry entirely embodied in this Clare product. No circuit
patent licenses nor indemnity are expressed or implied. Clare
reserves the right to change the specification and circuitry, with-
out notice at any time. The products described in this document
are not intended for use in medical implantation or other direct life
support applications where malfunction may result in direct phys-
ical harm, injury or death to a person.
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