DS-CPC5610/5611-R9.0
www.clare.com
1
Features
Full-duplex data and voice transmission
Transformerless telephone line isolation interface
Operates at all modem speeds, including V.90 (56K)
3.3 or 5 V power supply operation
Half-wave ring detector (CPC5610) or full-wave ring
detector (CPC5611)
Caller ID signal reception
Small 32-pin SOIC plastic package
Printed-circuit board space and cost savings
Meets PC Card (PCMCIA) height requirements
Easy interface with modem ICs and voice CODECs
Worldwide dial-up telephone network compatibility
Supplied application circuit complies with the
requirements of TIA/EIA/IS-968 (FCC part 68),
UL1950, UL60950, EN60950, IEC60950,
EN55022B, CISPR22B, EN55024, and TBR-21
CPC5610 and CPC5611 comply with UL1577
TTL compatible logic inputs and outputs
Line-side circuit powered from telephone line
Applications
Satellite and cable set-top boxes
V.90 (and other standard) modems
Fax machines
Voicemail systems
Computer telephony
PBXs
Telephony gateways
Embedded modems for such applications as POS
terminals, automated banking, remote metering,
vending machines, security, and surveillance
Description
Clare CPC5610 and CPC5611 LITELINKs are silicon
data access arrangement (DAA) ICs used in data and
voice communication applications to make connec-
tions to the public switched telephone network
(PSTN). LITELINK uses on-chip optical components
and a few inexpensive external components to form a
complete voice or high-speed data telephone line
interface.
LITELINK eliminates the need for the large isolation
transformers or capacitors as used in other DAA con-
figurations. It incorporates the required high-voltage
isolation barrier in the surface-mount SOIC package.
The CPC5610 (half-wave ring detect) and CPC5611
(full-wave ring detect) build upon Clare's existing
LITELINK line, with improved performance and 3.3 V
operation.
Ordering Information
Figure 1. CPC5610/CPC5611 Block Diagram
Part Number
Description
CPC5610A
32-pin surface mount DAA with half-wave ring
detect, tubed
CPC5610ATR
32-pin surface mount DAA with half-wave ring
detect, tape and reel
CPC5611A
32-pin surface mount DAA with full-wave ring
detect, tubed
CPC5611ATR
32-pin surface mount DAA with full-wave ring
detect, tape and reel
Transconductance
Stage
2-4 Wire Hybrid
AC/DC Termination
Hookswitch
Isolation Barrier
Vref
AGC
Vref
AGC
Snoop Amplifier
Receive
Isolation
Amplifier
Transmit
Isolation
Amplifier
TIP+
RING-
Transmit
Diff.
Amplifier
Receive
Diff.
Amplifier
CID/
RING
MUX
Tx+
Tx-
OH
RING
CID
Rx+
Rx-
Current Limit Control
AC Impedance Control
VI Slope Control
C
SNOOP
C
SNOOP
R
SNOOP
R
SNOOP
CPC5610/CPC5611
LITELINKTM II Silicon Data Access Arrangement (DAA) IC
CPC5610/CPC5611
2
www.clare.com
R9.0
1 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Resistive Termination Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1.1 Resistive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Reactive Termination Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2.1 Reactive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Using LITELINK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Switch Hook Control (On-hook and Off-hook States) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2 On-hook Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.1 Ring Signal Detection via the Snoop Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.2 Polarity Reversal Detection with CPC5611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2.3 On-hook Caller ID Signal Processing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3 Off-Hook Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.1 Receive Signal Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.2 Transmit Signal Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4 DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4.1 Resistive Termination Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4.2 Reactive Termination Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5 AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.5.1 Resistive Termination Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.5.2 Reactive Termination Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 LITELINK Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1 Clare, Inc. Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2 Third Party Design Resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6 LITELINK Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7 Manufacturing Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.2 Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3.1 Moisture Reflow Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3.2 Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.4 Washing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
CPC5610/CPC5611
Rev. 9.0
www.clare.com
3
1. Electrical Specifications
1.1 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at these or
any other conditions beyond those indicated in the opera-
tional sections of this data sheet is not implied. Exposure of
the device to the absolute maximum ratings for an
extended period may degrade the device and affect its reli-
ability.
1.2 Performance
Parameter
Minimum
Maximum
Unit
Isolation Voltage
1500
-
V
RMS
Continuous Tip to Ring
Current (R
ZDC
= 5.2
)
150
mA
Total Package Power Dis-
sipation
1
W
Operating temperature
0
+85
C
Storage temperature
-40
+125
C
Soldering temperature
-
+220
C
Parameter
Minimum
Typical
Maximum
Unit
Conditions
DC Characteristics
Operating Voltage V
DD
3.0
-
5.50
V
Host side
Operating Current I
DD
-
-
10
mA
Host side
Operating Voltage V
DDL
2.8
-
3.2
V
Line side, derived from tip and ring
Operating Current I
DDL
-
10.5
12
mA
Line side, drawn from tip and ring while off-hook
On-hook Characteristics
Metallic DC Resistance
10
-
-
M
Tip to ring, 100 Vdc applied
Longitudinal DC Resistance
10
-
-
M
150 Vdc applied from tip and ring to Earth ground
Ring Signal Detect Level
5
-
-
V
RMS
68 Hz ring signal applied to tip and ring
Ring Signal Detect Level
28
-
-
V
RMS
15 Hz ring signal applied across tip and ring
Snoop Circuit Frequency Response
166
-
>4000
Hz
-3 dB corner frequency @ 166 Hz
Snoop Circuit CMRR
-
-40
-
dB
120 V
RMS
60 Hz common mode signal across tip
and ring
Ringer Equivalence
-
0.1B
-
REN
Longitudinal Balance
60
-
-
dB
Per FCC part 68.3
Off-Hook Characteristics
AC Impedance
-
600
-
Tip to ring, using resistive termination application
circuit
Longitudinal Balance
40
-
-
dB
Per FCC part 68.3
Return Loss
-
26
-
dB
Into 600
at 1800 Hz
Transmit and Receive Characteristics
Frequency Response
30
-
4000
Hz
-3 dB corner frequency 30 Hz
Trans-Hybrid Loss
-
36
-
dB
Into 600
at 1800 Hz, with C18
Transmit and Receive Insertion Loss
-1
0
1
dB
30 Hz to 4 kHz
Average In-band Noise
-
-120
-
dBm/Hz
4 kHz flat bandwidth
Harmonic Distortion
-
-80
-
dB
-3 dBm, 600 Hz, 2
nd
harmonic
CPC5610/CPC5611
4
www.clare.com
Rev. 9.0
Transmit Level
-
0
2.2
V
P-P
Single-tone sine wave. Or 0 dBm into 600
.
Receive Level
-
-
2.2
V
P-P
Single-tone sine wave. Or 0 dBm into 600
.
RX+/RX- Output Drive Current
-
-
0.5
mA
Sink and source
TX+/TX- Input Impedance
60
90
120
k
Isolation Characteristics
Isolation Voltage
1500
-
-
V
RMS
Line side to host side
Surge Rise Time
2000
-
-
V/
S
No damage via tip and ring
OH and CID Control Logic Inputs
Input Threshold Voltage
0.8
-
2.0
V
High Level Input Current
-120
-
0
A
V
IN
V
DD
Low Level Input Current
-
-
-120
A
V
IN
=GND
RING Output Logic Levels
Output High Voltage
V
DD
-0.4
-
-
V
I
OUT
= -400
A
Output Low Voltage
-
-
0.4
V
I
OUT
= 1 mA
Specifications subject to change without notice. All performance characteristics based on the use of Clare, Inc. application circuits. Functional operation of the
device at conditions beyond those specified here is not implied. Specification conditions: V
DD
= 5V, temperature = 25 C, unless otherwise indicated.
Parameter
Minimum
Typical
Maximum
Unit
Conditions
CPC5610/CPC5611
Rev. 9.0
www.clare.com
5
1.3 Pin Description
Figure 2. Pinout
Pin
Name
Function
1
VDD
Host (CPE) side power supply
2
TXSM
Transmit summing junction
3
TX-
Negative differential transmit signal to DAA
from host
4
TX+
Positive differential transmit signal to DAA from
host
5
TX
Transmit differential amplifier output
6
REFM
Internal voltage reference
7
GND
Host (CPE) side analog ground
8
OH
Assert logic low for off-hook operation
9
RING
Indicates ring signal, pulsed high to low
10 CID
Assert logic low while on hook to place CID
information on RX pins.
11 RX-
Negative differential analog signal received
from the telephone line. Must be AC coupled
with 0.1
F.
12 RX+
Positive differential analog signal received from
the telephone line. Must be AC coupled with
0.1
F.
13 SNP+
Positive differential snoop input
14 SNP-
Negative differential snoop input
15 RXF
Receive photodiode amplifier output
16 RX
Receive photodiode summing junction
17 VDDL
Power supply for line side, regulated from tip
and ring.
18 RXS
Receive isolation amp summing junction
19 RPB
Receive LED pre-bias current set
20 BR-
Bridge rectifier return
21 ZDC
Electronic inductor and DC current limit
22 DCS2
DC feedback output
23 DCS1
V to I slope control
24 REFB
0.625 Vdc reference
25 GAT
External MOSFET gate control
26 NTS
Receive signal input
27 BR-
Bridge rectifier return
28 TXSL
Transmit photodiode summing junction
29 ZNT
Receiver impedance set
30 ZTX
Transmit transconductance gain set
31 TXF
Transmit photodiode amplifier output
32 REFL
1.25 Vdc reference
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VDD
TXSM
TX-
TX+
TX
REFM
GND
OH
RING
CID
RX-
RX+
SNP+
SNP-
RXF
RX
REFL
TXF
ZTX
ZNT
TXSL
BR-
NTS
GAT
REFB
DCS1
DCS2
ZDC
BR-
RPB
RXS
VDDL
PDF 
ZIP