Central

Semiconductor Corp.

145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com

PROCESS

CPD15

Ultra Fast Rectifier

500mA Glass Passivated Rectifier Chip

PRINCIPAL DEVICE TYPES

CBRHDU-02 Series

GEOMETRY

PROCESS DETAILS

BACKSIDE CATHODE

R2 (19-September 2003)

Process

GLASS PASSIVATED MESA

Die Size

25 x 25 MILS

Die Thickness

9.5 MILS

Anode Bonding Pad Area

14.5 x 14.5 MILS

Top Side Metalization

Au - 5,000�

Back Side Metalization

Au - 2,000�

GROSS DIE PER 4 INCH WAFER