145 Adams Avenue

Hauppauge, NY 11788 USA

Phone

(631) 435-1110

Fax

(631) 435-1824

w w w . c e n t r a l s e m i . c o m

PROCESS

PROCESS DETAILS

PRINCIPAL DEVICE TYPES

PROCESS
DIE SIZE
DIE THICKNESS
BASE BONDING PAD AREA
EMITTER BONDING PAD AREA
TOP SIDE METALIZATION
BACK SIDE METALIZATION

Please refer to
selection guide on page .

GEOMETRY

Central

Semiconductor Corp.

EPITAXIAL PLANAR
15 x 15 MILS
7.5 MILS
2.0 x 2.4 MILS
2.0 x 2.7 MILS
Al
Au - 16,000�

CP205

NPN - Silicon RF Transistor Chip

2N3866

BASE

EMITTER

BACKSIDE COLLECTOR

Small Signal Transistors