2004 California Micro Devices Corp. All rights reserved.
04/21/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
1
CM1425
PRELIMINARY
4 Channel EMI Filter Array with ESD Protection
Features
Four channels of EMI filtering with ESD protection
Pin compatible with CMD's CSPRC032A
Greater than 30dB attenuation over the 800MHz to
3GHz frequency range
15kV ESD protection (IEC 61000-4-2, contact
discharge)
30kV ESD protection (HBM)
9-bump, 2.470mm x 0.970mm footprint Chip Scale
Package (CSP)
Available with Optiguard
TM
coating for improved
reliability
Lead-free versions available
Applications
FIltering for antenna and keypad data lines
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
EMI filtering for LCD and chip-to-chip data lines in
mobile electronic devices that use flexible PCB
interconnections
Product Description
CAMD's CM1425 is an EMI filter array with ESD pro-
tection, which integrates 4 pi filters (C-R-C). The
CM1425 has component values of 20pF-100
-20pF.
The parts include ESD protection diodes on every pin,
which provide a very high level of protection for sensi-
tive electronic components that may be subjected to
electrostatic discharge (ESD). The ESD diodes con-
nected to the filter ports are designed and character-
ized to safely dissipate ESD strikes of
15kV, beyond
the maximum requirement of the IEC 61000-4-2 inter-
national standard. Using the MIL-STD-883 (Method
3015) specification for Human Body Model (HBM)
ESD, the pins are protected for contact discharges at
greater than
30kV.
This device is particularly well suited for portable elec-
tronics (e.g. mobile handsets, PDAs, notebook comput-
ers) because of its small package format and easy-to-
use pin assignments. In particular, the CM1425 is
ideal for EMI filtering and protecting data lines from
ESD in wireless handsets.
All CM1425 devices are optionally available with Opti-
Guard
TM
coating which results in improved reliability at
assembly. These devices are also available with stan-
dard and lead-free finishing. The CM1425 is housed in
a space-saving, low-profile, chip-scale package and is
fabricated with California Micro Devices' Centurion
TM
processes.
Electrical Schematic
100
20pF
20pF
FILTER+ESD1*
FILTER+ESD1*
100
20pF
20pF
FILTER+ESD2*
FILTER+ESD2*
100
20pF
20pF
FILTER+ESD3*
GND
FILTER+ESD3*
(Pin B3)
100
20pF
20pF
FILTER+ESD4*
FILTER+ESD4*
2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
04/21/04
CM1425
PRELIMINARY
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
PIN(s)
NAME
DESCRIPTION
A1
FILTER+ESD1
Filter Channel 1
B1
FILTER+ESD1
Filter Channel 1
A2
FILTER+ESD2
Filter Channel 2
B2
FILTER+ESD2
Filter Channel 2
A4
FILTER+ESD3
Filter Channel 3
B4
FILTER+ESD3
Filter Channel 3
A5
FILTER+ESD4
Filter Channel 4
B5
FILTER+ESD4
Filter Channel 4
B3
GND
Device Ground
B3
B4
B5
A4
A5
B1
A1
B2
A2
B3
B4
B5
A4
A5
B1
A1
B2
A2
N253
3
2
5
4
1
B
A
Orientation
Marking
(see note 2)
N251
3
2
5
4
1
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Notes:
CM1425-01
CSP Package (No coating)
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1425-03
CSP Package (OptiGuard
TM
coating)
PART NUMBERING INFORMATION
Bumps
PKG
Standard Finish
Lead-free Finish
2
No Coating
Optiguard
TM
Coated
No Coating
Optiguard
TM
Coated
Ordering Part
Number
1
Part
Marking
Ordering Part
Number
1
Part
Marking
Ordering Part
Number
1
Part
Marking
Ordering Part
Number
1
Part
Marking
9
CSP
CM1425-01CS
N251
CM1425-03CS
N253
CM1425-01CP
N251
CM1425-03CP
N253
2004 California Micro Devices Corp. All rights reserved.
04/21/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
3
CM1425
PRELIMINARY
Specifications
Note 1: T
A
=25
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
C
Power Rating per Resistor
100
mW
Package Power Rating
300
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
C
ELECTRICAL OPERATING CHARACTERISTICS
1
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
Resistance
80
100
120
C
Capacitance
At 2.5V DC, 1MHz, 30mV AC
16
20
24
pF
V
DIODE
Diode Standoff Voltage
I
DIODE
= 10
A
5.5
V
I
LEAK
Diode Leakage Current (reverse bias)
V
DIODE
= 3.3V
100
nA
V
SIG
Signal Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10mA
I
LOAD
= -10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-
2 Level 4
Notes 2,4 and 5
30
15
kV
kV
V
CL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
+12
-7
V
V
f
C
Cut-off Frequency
Z
SOURCE
=50
, Z
LOAD
=50
R = 100
, C = 20pF
86
MHz
2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
04/21/04
CM1425
PRELIMINARY
Performance Information
.
Figure 1. CM1425 Filter Typical Measured Frequency Response
Figure 2. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25C)
2004 California Micro Devices Corp. All rights reserved.
04/21/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
5
CM1425
PRELIMINARY
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance -- Edge To Corner Ball
+50
m
Solder Ball Side Coplanarity
+20
m
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
T
emperature (
C)
2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
04/21/04
CM1425
PRELIMINARY
Mechanical Details
CM1425 devices are packaged in a custom Chip Scale
Packages (CSP) and available with optional Opti-
Guard
TM
coating.
.
CM1425 9-bump CSP Mechanical Specifications
The CM1425 devices are packaged in a 9-bump cus-
tom Chip Scale Package (CSP). Dimensions are pre-
sented below.
Note 1: Applies to uncoated devices only.
Note 2: Applies to OptiGuard (coated) devices only.
Package Dimensions
CM1425 9-bump Chip Scale Package
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
9
Dim
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A1
0.925
0.970
1.015
0.0364
0.0382
0.0400
A2
2.425
2.470
2.515
0.0955
0.0972
0.0990
B1
0.495
0.500
0.505
0.0195
0.0197
0.0199
B2
0.495
0.500
0.505
0.0195
0.0197
0.0199
C1
0.185
0.235
0.285
0.0073
0.0093
0.0112
C2
0.185
0.235
0.285
0.0073
0.0093
0.0112
D1
1
0.562
0.606
0.650
0.0221
0.0239
0.0256
D2
1
0.356
0.381
0.406
0.0140
0.0150
0.0160
D3
2
0.600
0.670
0.739
0.0236
0.0264
0.0291
D4
2
0.394
0.445
0.495
0.0155
0.0175
0.0195
# per tape
and reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
4
5
B
C1
B1
A1
B2
C2
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
A
1
2
3
DIMENSIONS IN MILLIMETERS
A
B
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
4
5
B
C1
B1
A1
B2
C2
D3
D4
A2
BOTTOM VIEW
SIDE
VIEW
A
1
2
3
A
B
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
OptiGuard
TM
Coating
Non-coated CSP
OptiGuard
TM
Coated CSP
2004 California Micro Devices Corp. All rights reserved.
04/21/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
7
CM1425
PRELIMINARY
Mechanical Details (cont'd)
CSP Tape and Reel Specifications
Figure 6. Tape and Reel Mechanical Data
PART NUMBER
PKG. SIZE (mm)
POCKET SIZE (mm)
B
0
X A
0
X K
0
TAPE WIDTH
W
REEL
DIA.
QTY
PER
REEL
P
0
P
1
CM1425-01
2.470 X 0.970 X 0.606
2.62 X 1.12 X 0.762
8mm
178mm (7")
3500
4mm
4mm
CM1425-03
2.470 X 0.970 X 0.670
2.62 X 1.12 X 0.762
8mm
178mm (7")
3500
4mm
4mm
Top
For tape feeder reference
Cover
Tape
P
1
only including draft.
Concentric around B.
K
o
Embossment
User Direction of Feed
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
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