2004 California Micro Devices Corp. All rights reserved.
04/27/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846 www.calmicro.com
1
CM1421
4-Channel LCD EMI Filter Array plus
4-Channel ESD Protection Array
Features
Functionally and pin compatible with CMD's
CSPEMI607
Four channels of combined EMI/RFI filtering plus
ESD protection
Four additional channels of ESD-only protection
Better than 30dB attenuation (typical) at 1 GHz
15kV ESD protection on all channels
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on all channels (HBM)
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
15-bump, 2.960mm X 1.330mm footprint
Chip Scale Package (CSP)
Optiguard
TM
coated for improved reliability
Lead-free version available
Applications
LCD data lines in mobile handsets
EMI filtering and ESD protection for both data and
I/O ports
Mobile Handsets
Handheld PCs / PDAs
Notebook Computers
Product Description
The CM1421 is a multichannel array consisting of four
low-pass filters with integrated ESD protection and four
ESD-only protection channels designed to reduce EMI/
RFI emissions on LCD data lines in mobile handsets.
The CM1421 has component values of 15pF-100
-
15pF. These devices include ESD protection diodes on
every pin, which provide a very high level of protection
for sensitive electronic components that may be sub-
jected to electrostatic discharge (ESD). The ESD
diodes connected to the filter ports are designed and
characterized to safely dissipate ESD strikes of 15kV,
beyond the maximum requirement of the IEC 61000-4-
2 international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the pins are protected for contact dis-
charges at greater than 30kV.
This device is particularly well suited for portable elec-
tronics (e.g. wireless handsets, PDAs, notebook com-
puters) because of its small package format and easy-
to-use pin assignments. In particular, the CM1421 is
ideal for EMI filtering and protecting data lines from
ESD for the LCD display in clamshell handsets.
The CM1421 incorporates Optiguard
TM
coating which
results in improved reliability. The CM1421 is available
in space-saving, low-profile chip-scale packages with
optional lead-free finishing.
Electrical Schematic
100
15pF
15pF
FILTER+ESDn*
GND
FILTER+ESDn*
1 of 4 EMI/RFI + ESD Channels.
(Pins B1-B3)
15pF
ESDn*
1 of 4 ESD-only Channels
* See Package/Pinout Diagram for expanded pin information
2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846 www.calmicro.com
04/27/04
CM1421
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
A1
ESD_1
ESD Channel 1
A2
FILTER+ESD_1
Filter + ESD Channel 1
A3
FILTER+ESD_2
Filter + ESD Channel 2
A4
FILTER+ESD_3
Filter + ESD Channel 3
A5
FILTER+ESD_4
Filter + ESD Channel 4
A6
ESD_2
ESD Channel 2
B1-B3
GND
Device Ground
C1
ESD_3
ESD Channel 3
C2
FILTER+ESD_1
Filter + ESD Channel 1
C3
FILTER+ESD_2
Filter + ESD Channel 2
C4
FILTER+ESD_3
Filter + ESD Channel 3
C5
FILTER+ESD_4
Filter + ESD Channel 4
C6
ESD_4
ESD Channel 4
N213
4
3
2
6
5
1
C
B
A
Orientation
Marking
(see note 2)
FILTER+ESD_4
ESD_2
GND
FILTER+ESD_4
ESD_4
A6
A5
Orientation
Marking
B3
C6
C5
FILTER+ESD_2
FILTER+ESD_3
GND
FILTER+ESD_2
FILTER+ESD_3
A4
A3
B2
C4
C3
ESD_1
FILTER+ESD_1
GND
ESD_3
FILTER+ESD_1
A2
A1
B1
C2
C1
A1
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
CSP Package
(Bumps Up View)
TOP VIEW
(Bumps Down View)
CM1421-03
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PART NUMBERING INFORMATION
Pins
Package
Standard Finish
Lead-free Finish
Ordering Part
Number
1
Part Marking
Ordering Part
Number
1
Part Marking
2
15
CSP
CM1421-03CS
N213
CM1421-03CP
N213
2004 California Micro Devices Corp. All rights reserved.
04/27/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
CM1421
Specifications
Note 1: T
A
=25
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2,
then clamping voltage is measured at Pin C2.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
C
ELECTRICAL OPERATING CHARACTERISTICS
(SEE NOTE1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
Resistance
80
100
120
C
Capacitance
At 2.5V DC
12
15
18
pF
V
DIODE
Diode Standoff Voltage
I
DIODE
=10
A
5.5
V
I
LEAK
Diode Leakage Current (reverse bias)
V
DIODE
=3.3V
100
nA
V
SIG
Signal Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
30
15
kV
kV
V
CL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
+12
-7
V
V
f
C
Cut-off Frequency
Z
SOURCE
=50
, Z
LOAD
=50
R=100
, C=15pF
120
MHz
2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846 www.calmicro.com
04/27/04
CM1421
Performance Information
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss VS. Frequency (A2-C2 to GND B1)
2004 California Micro Devices Corp. All rights reserved.
04/27/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
CM1421
Performance Information (cont'd)
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss VS. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss VS. Frequency (A4-C4 to GND B2)
2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846 www.calmicro.com
04/27/04
CM1421
Performance Information (cont'd)
Figure 5. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25C)
2004 California Micro Devices Corp. All rights reserved.
04/27/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
7
CM1421
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
Figure 7. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 8. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance -- Edge To Corner Ball
50
m
Solder Ball Side Coplanarity
20
m
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
T
emperature (
C)
2004 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846 www.calmicro.com
04/27/04
CM1421
Mechanical Details
CSP Mechanical Specifications
CM1421 devices are packaged in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
Package Dimensions for
CM1421 Chip Scale Package
CSP Tape and Reel Specifications
Figure 9. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
15
Dim
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A1
2.915
2.960
3.005
0.1148
0.1165
0.1183
A2
1.285
1.330
1.375
0.0506
0.0524
0.0541
B1
0.495
0.500
0.505
0.0195
0.0197
0.0199
B2
0.245
0.250
0.255
0.0096
0.0098
0.0100
B3
0.430
0.435
0.440
0.0169
0.0171
0.0173
B4
0.430
0.435
0.440
0.0169
0.0171
0.0173
C1
0.180
0.230
0.280
0.0071
0.0091
0.0110
C2
0.180
0.230
0.280
0.0071
0.0091
0.0110
D1
0.600
0.670
0.739
0.0236
0.0264
0.0291
D2
0.394
0.445
0.495
0.0155
0.0175
0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
B
C
3
4
5
6
C1
B1
A1
B3
C2
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
1
2
B2
B4
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
OptiGuard
TM
Coating
DIMENSIONS IN MILLIMETERS
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B
0
X A
0
X K
0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
0
P
1
CM1421
2.96 X 1.33 X 0.6
3.10 X 1.45 X 0.74
8mm
178mm (7")
3500
4mm
4mm
Top
For Tape Feeder Reference
Cover
Tape
P
1
Only including Draft.
Concentric Around B.
K
o
Embossment
User Direction of Feed
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
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