APEX MICROTECHNOLOGY CORPORATION TELEPHONE (520) 690-8600 FAX (520) 888-3329 ORDERS (520) 690-8601 EMAIL prodlit@apexmicrotech.com
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FEATURES
LOW COST
HIGH VOLTAGE - 200 VOLTS
HIGH OUTPUT CURRENT - 10 AMPS
100 WATT DISSIPATION CAPABILITY
300kHz POWER BANDWIDTH
APPLICATIONS
INKJET PRINTER HEAD DRIVE
PIEZO TRANSDUCER DRIVE
INDUSTRIAL INSTRUMENTATION
REFLECTOMETERS
ULTRA-SOUND TRANSDUCER DRIVE
DESCRIPTION
The MP108 operational amplifier is a surface mount con-
structed component that provides a cost effective solution in
many industrial applications. The MP108 offers outstanding
performance that rivals much more expensive hybrid compo-
nents yet has a footprint of only 4 sq in. The MP108 has many
optional features such as four-wire current limit sensing and
external compensation. The 300 kHz power bandwidth and
10 amp output of the MP108 makes it a good choice for piezo
transducer drive applications. The MP108 is built on a thermally
conductive but electrically insulating substrate that can be
mounted to a heat sink.
EQUIVALENT CIRCUIT DIAGRAM
34-PIN DIP
PACKAGE STYLE FD
TYPICAL APPLICATION
INKJET NOZZLE DRIVE
The MP108's fast slew rate and wide power bandwith
make it an ideal nozzle driver for industrial inkjet printers.
The 10 amp output capability can drive hundreds of nozzles
simultaneously.
EXTERNAL CONNECTIONS
APEX MICROTECHNOLOGY CORPORATION 5980 NORTH SHANNON ROAD TUCSON, ARIZONA 85741 USA APPLICATIONS HOTLINE: 1 (800) 546-2739
2
ABSOLUTE MAXIMUM RATINGS
SPECIFICATIONS
MP108 MP108A
ABSOLUTE MAXIMUM RATINGS
SPECIFICATIONS
MP108
MP108A
PARAMETER
TEST CONDITIONS
1
MIN
TYP
MAX
MIN
TYP
MAX UNITS
INPUT
OFFSET VOLTAGE
1
5
*
3
mV
OFFSET VOLTAGE vs. temperature
Full temperature range
20
50
*
*
V/C
OFFSET VOLTAGE vs. supply
20
*
V/V
BIAS CURRENT, initial
3
100
70
pA
BIAS CURRENT vs. supply
0.1
*
pA/V
OFFSET CURRENT, initial
50
30
pA
INPUT RESISTANCE, DC
10
11
*
INPUT CAPACITANCE
4
*
pF
COMMON MODE VOLTAGE RANGE
+V
B
- 15
*
V
COMMON MODE VOLTAGE RANGE
-V
B
+ 15
*
V
COMMON MODE REJECTION, DC
92
*
dB
NOISE
1MHz bandwidth, 1k R
S
10
*
V RMS
GAIN
OPEN LOOP @ 15Hz
R
L
= 10K, C
C
= 10pF
96
*
dB
GAIN BANDWIDTH PRODUCT @ 1MHz C
C
= 10pF
10
*
MHz
PHASE MARGIN
Full temperature range
45
*
degrees
OUTPUT
VOLTAGE SWING
I
O
= 10A
+V
S
- 10 +V
S
- 8.6
*
*
V
VOLTAGE SWING
I
O
= -10A
-V
S
+ 10 -V
S
+ 7
*
*
V
VOLTAGE SWING
I
O
= 10A, +V
B
= +V
S
+10V
+V
S
- 1.6
*
V
VOLTAGE SWING
I
O
= -10A, -V
B
= -V
S
-10V
-V
S
+ 5.1
*
V
CURRENT, continuous, DC
10
11
A
SLEW RATE, A
V
= -20
C
C
= 10pF
150
170
*
*
V/S
SETTLING TIME, to 0.1%
2V Step
1
*
S
RESISTANCE
No load, DC
5
*
POWER BANDWIDTH 180V
P-P
C
C
= 10pF, +V
S
= 100V, -V
S
= -100V
300
*
kHz
POWER SUPPLY
VOLTAGE
15
75
100
*
*
*
V
CURRENT, quiescent
50
65
*
*
mA
THERMAL
RESISTANCE, AC, junction to case
5
Full temperature range, f 60Hz
1
*
C/W
RESISTANCE, DC, junction to case
Full temperature range, f < 60Hz
1.25
*
C/W
RESISTANCE, junction to air
Full temperature range
13
*
C/W
TEMPERATURE RANGE, case
-40
85
*
*
C
SUPPLY VOLTAGE, +V
S
to -V
S
200V
SUPPLY VOLTAGE, +V
B
+V
S
+ 15V
6
SUPPLY VOLTAGE, -V
B
-V
S
15V
6
OUTPUT CURRENT, peak
12A, within SOA
POWER DISSIPATION, internal, DC
100W
INPUT VOLTAGE
+V
B
to -V
B
TEMPERATURE, pin solder, 10s
225C.
TEMPERATURE, junction
2
150C.
TEMPERATURE RANGE, storage
-40 to 105C.
OPERATING TEMPERATURE, case
-40 to 85C.
NOTES: 1. Unless otherwise noted: T
C
=25C, compensation C
C
=100pF, DC input specifications are value given, power supply voltage
is typical rating.
2. Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation
to achieve high MTBF.
3. Doubles for every 10C of case temperature increase.
4. +V
S
and -V
S
denote the positive and negative supply voltages to the output stage. +V
B
and -V
B
denote the positive and negative
supply voltages to the input stages.
5. Rating applies if the output current alternates between both output transistors at a rate faster than 60Hz.
6. Power supply voltages +V
B
and -V
B
must not be less than +V
S
and -V
S
respectively.
APEX MICROTECHNOLOGY CORPORATION 5980 NORTH SHANNON ROAD TUCSON, ARIZONA 85741 USA APPLICATIONS HOTLINE: 1 (800) 546-2739
4
OPERATING
CONSIDERATIONS
MP108 MP108A
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.
MP108 REV C JANUARY 2005 2005 Apex Microtechnology Corp.
GENERAL
Please read Application Note 1 "General Operating Consid-
erations" which covers stability, power supplies, heat sinking,
mounting, current limit, SOA interpretation, and specification
interpretation. Visit www.apexmicrotech.com for design tools
that help automate tasks such as calculations for stability,
internal power dissipation, current limit, heat sink selection,
Apex's complete Application Notes library, Technical Seminar
Workbook and Evaluation Kits.
GROUND PINS
The MP108 has two ground pins (pins 3, 32). These pins
provide a return for the internal capacitive bypassing of the
small signal portions of the MP108. The two ground pins are
not connected together on the substrate. Both of these pins
are required to be connected to the system signal ground.
SAFE OPERATING AREA
The MOSFET output stage of the MP108 is not limited by
second breakdown considerations as in bipolar output stages.
Only thermal considerations and current handling capabilities
limit the SOA (see Safe Operating Area graph on previous page).
The output stage is protected against transient flyback by the
parasitic body diodes of the output stage MOSFET structure.
However, for protection against sustained high energy flyback
external fast-recovery diodes must be used.
COMPENSATION
The external compensation capacitor C
C
is connected
between pins 5 and 6. Unity gain stability can be achieved with
any capacitor value larger than 100pF for a minimum phase
margin of 45 degrees. At higher gains more phase shift can
usually be tolerated in most designs and the compensation
capacitor value can be reduced resulting in higher bandwidth
and slew rate. Use the typical operating curves as a guide to
select C
C
for the application. An NPO (COG) type capacitor
is required rated for the full supply voltage (200V).
OVERVOLTAGE PROTECTION
Although the MP108 can withstand differential input voltages
up to 25V, additional external protection is recommended. In
most applications 1N4148 signal diodes connected anti-parallel
across the input pins is sufficient. In more demanding applica-
tions where bias current is important diode connected JFETs
such as 2N4416 will be required. See Q1 and Q2 in Figure
1. In either case the differential input voltage will be clamped
to 0.7V. This is usually sufficient overdrive to produce the
maximum power bandwidth. Some applications will also need
over voltage protection devices connected to the power supply
rails. Unidirectional zener diode transient suppressors are rec-
ommended. The zeners clamp transients to voltages within the
power supply rating and also clamp power supply reversals to
ground. Whether the zeners are used or not the system power
supply should be evaluated for transient performance including
power-on overshoot and power-off polarity reversals as well
as line regulation. See Z1 and Z2 in Figure 1.
POWER SUPPLY BYPASSING
Bypass capacitors to power supply terminals +V
S
and -V
S
must be connected physically close to the pins to prevent local
parasitic oscillation in the output stage of the MP108. Use
electrolytic capacitors at least 10F per output amp required.
Bypass the electrolytic capacitors with high quality ceramic
capacitors (X7R) 0.1F or greater. In most applications power
supply terminals +V
B
and -V
B
will be connected to +V
S
and
-V
S
respectively. Supply voltages +V
B
and -V
B
are bypassed
internally but both ground pins 3 and 32 must be connected to
the system signal ground to be effective. In all cases power to
the buffer amplifier stage of the MP108 at pins 8 and 25 must
be connected to +V
B
and -V
B
at pins 4 and 30 respectively.
Provide local bypass capacitors at pins 8 and 25. See the
external connections diagram on page 1.
FIGURE 1
OVERVOLTAGE PROTECTION
FIGURE 2
4 WIRE CURRENT LIMIT
CURRENT LIMIT
The two current limit sense lines are to be connected directly
across the current limit sense resistor. For the current limit to
work correctly pin 28 must be connected to the amplifier output
side and pin 27 connected to the load side of the current limit
resistor R
LIM
as shown in Figure 2. This connection will bypass
any parasitic resistances RP, formed by socket and solder joints
as well as internal amplifier losses. The current limiting resistor
may not be placed anywhere in the output circuit except where
shown in Figure 2. The value of the current limit resistor can
be calculated as follows: R
LIM
= .65/I
LIMIT
BOOST OPERATION
With the boost feature the small signal stages of the amplifier
are operated at a higher supply voltages than the amplifiers
high current output stage. +V
B
(pins 4,8) and -V
B
(pins 25,30)
are connected to the small signal stages and +V
S
(pins 14-16)
and -V
S
(pins 17-19) are connected to the high current output
stage. An additional 10V on the +V
B
and -V
B
pins is sufficient
to allow the small signal stages to drive the output stage into
the triode region and improve the output voltage swing for extra
efficient operation when required. When the boost feature is
not needed +V
S
and -V
S
are connected to the +V
B
and -V
B
pins
respectively. The +V
B
and -V
B
pins must not be operated at
supply voltages less than +V
S
and -V
S
respectively.
BACKPLATE GROUNDING
The substrate of the MP108 is an insulated metal substrate.
It is required that it be connected to signal ground. Connect pin
2 (back plate) to signal ground. The back plate will then be AC
grounded to signal ground through a 1F capacitor.
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