General Specifications
Surface Mount Terminations
16 Watts, 50
Model RFP-250250-6Z50-2
Resistive Element:
Thick film
Substrate:
Beryllium oxide ceramic
Terminals:
Thick film silver
Outline Drawing
GND
RF PAD
.175
.037
.250
.250
.030
.120
.070
.070
.060
50
Z
RFP
TOP VIEW
SIDE VIEW
BOTTOM VIEW
HATCHED AREA INDICATES LOCATION
OF PROTECTIVE COATING
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +125C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
50 ohms, 2%
Frequency Range:
DC - 3.0 GHz
Power:
16 Watts
V.S.W.R.:
1.25:1
Sur
face Mount T
e
r
minations
Features
DC - 3.0 GHz
16 Watts
BeO Ceramic
Non-Nichrome Resistive
Element
Low VSWR
100% Tested
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Available on Tape and Reel for Pick and Place Manufacturing.
VER. 12/5/01
125
100
75
50
100
75
50
25
0
25
% OF RATED POWER
P.C.B. SOLDER INTERFACE TEMPERATURE
C
Sur
face Mount T
e
r
minations
Model RFP-250250-6Z50-2
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
Available on Tape and Reel for Pick and Place Manufacturing.
(2 PLS.)
SCREW
SOLDER
PASTE
PC BOARD
HEATSINK
SOLDER
FILLED VIA
1. Solder part in place using 60/40 type solder with controlled
temperature iron (700F).
2. Drill thermal vias through PCB and fill with solder, such as
60/40 type.
3. To ensure good thermal connectivity to heat sink, drill and
tap heatsink and mount PCB board to heat sink using
screws.
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