General Specifications
Chip Terminations
30 Watts, 50
Model RFP-100200-4X50-2
Resistive Element:
Thick film
Substrate:
Beryllium oxide ceramic
Terminals:
Thick film silver
Outline Drawing
HATCHED AREA INDICATES
LOCATION OF PROTECTIVE
COATING
.100
.200
.040
.170
.030
SIDE VIEW
TOP VIEW
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +150C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
50 ohms, 2%
Frequency Range:
DC - 3.0 GHz
Power:
30 Watts
V.S.W.R.:
1.25:1
Chip T
e
rminations
Features
DC - 3.0 GHz
30 Watts
BeO Ceramic
Non-Nichrome Resistive
Element
Low VSWR
100% Tested
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Available on Tape and Reel for Pick and Place Manufacturing.
VER. 12/5/01
P.C.B. SOLDER INTERFACE TEMPERATURE -- C
% OF RATED POWER
125
100
75
50
25
100
75
25
50
0
150
Chip T
e
rminations
Model RFP-100200-4X50-2
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
BOARD EVEN
WITH LEAD.
MIN.
(2 PLACES)
.025
THAN LEAD.
BOARD LOWER
SCALE:
SUGGESTED STRESS RELIEF METHODS
1. Make sure that the devices are mounted on flat surfaces
(.001" under the device) to optimize the heat transfer.
2. Position device on mounting surface and solder in place
using an indalloy type or a 60/40 type solder.
3. Solder leads in place using a 60/40 type solder with a
controlled temperature iron (700F).
THAN LEAD.
BOARD HIGHER
SCALE:
NOT RECOMMENDED APPLICATION
BOARD LOWER
THAN LEAD.
Available on Tape and Reel for Pick and Place Manufacturing.
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